Patents by Inventor Chi-Ming Tseng

Chi-Ming Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210060417
    Abstract: A game grip includes a cover body, a grip shell, a pressure sensor, a buffer material element, a sliding mechanism and an elastic mechanism. An outer surface of the cover body is recessed inward to form an accommodating surface. The grip shell is covered to the accommodating surface. The pressure sensor is disposed to the accommodating surface. The buffer material element is disposed to the grip shell. The buffer material element is disposed corresponding to the pressure sensor. The sliding mechanism is disposed between the cover body and the grip shell. The elastic mechanism abuts between the accommodating surface of the cover body and the grip shell.
    Type: Application
    Filed: March 19, 2020
    Publication date: March 4, 2021
    Inventors: Chi Ming Tseng, Tsung Shih Lee
  • Patent number: 10936091
    Abstract: A pressing structure of a mouse includes a base, a circuit board mounted on the base, at least one electronic switch mounted on the circuit board, an upper cover mounted on the base, and a button shell. A rear end wall of the at least one opening protrudes downward and extends towards a front end wall of the at least one opening to form a buckling block. A bottom of the buckling block is recessed inward to form a first accommodating groove equipped with a first magnet. The button shell has at least one button. The at least one button protrudes downward to form at least one contact portion. A rear surface of the at least one contact portion is recessed inward to form a buckling space corresponding to the buckling block. The at least one contact portion is equipped with a second magnet.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 2, 2021
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Ming-Han Kuo, Chang-Ting Ho
  • Publication number: 20210051408
    Abstract: A head band structure of headset includes a retractable adjusting block and a head band group. The retractable adjusting block includes an upper cover, a sliding slice, an elastic piece and a lower cover. The sliding slice has at least one blocking portion. A substantial middle of the elastic piece is arched upward to form a convex surface. The head band group is connected with the retractable adjusting block. The head band group has a head band, and two end covers disposed to two opposite ends of the head band. A surface of each end cover has a waveform locking portion, and at least one stopping frame disposed at one end of the waveform locking portion. The convex surface keeps contacting with the waveform locking portion.
    Type: Application
    Filed: December 9, 2019
    Publication date: February 18, 2021
    Inventors: Chi Ming Tseng, Chin Chung Lin
  • Publication number: 20210046592
    Abstract: A pressing structure includes a support frame and a pressing element. The pressing element is mounted to a bottom surface of the base plate. The pressing element includes a pedestal and a cushion element. The pedestal has a base board. A bottom surface of the base board protrudes downward to form a pressing block. A bottom surface of the pressing block is recessed upward and gradually arched outward from top to bottom to form a first pressing face. The rocker component has a base portion. The first pressing face is in contact with the base portion. The cushion element is mounted on the pedestal, so that the rocker component is mounted on the electronic component by the pressing structure, the rocker component and the electronic component are without affording the excessive pressure force to cause a damage and a deformation of the electronic component.
    Type: Application
    Filed: November 18, 2019
    Publication date: February 18, 2021
    Inventors: Tsung Shih Lee, Chi Ming Tseng, Chia Fa Cheng
  • Patent number: 10915135
    Abstract: A button assembly is disposed in a rocker. The button assembly including a base, a pressure sensor and a keycap. The base has two lower positioning portions with each of the two lower positioning portions protruding outwardly from respective sides of the base. The pressure sensor is mounted on the base. The keycap overlies the pressure sensor. The keycap has two upper positioning portions with each of the two upper positioning portions protruding outwardly from respective sides of the keycap. The two upper positioning portions are individually fixed on each of the two lower positioning portions. As described above, a push-button structure is thus formed by the two lower positioning portions and the two upper positioning portions configured among the base, the pressure sensor and the keycap to achieve the modularization of the button assembly of the present invention.
    Type: Grant
    Filed: October 27, 2019
    Date of Patent: February 9, 2021
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Tsung-Shih Lee
  • Publication number: 20210036658
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Application
    Filed: October 19, 2020
    Publication date: February 4, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Ching-Han HUANG, Hui-Chung LIU, Kuo-Hua LAI, Cheng-Ling HUANG
  • Publication number: 20200402879
    Abstract: A semiconductor package structure includes a substrate; a first die on the substrate, wherein an active surface of the first die is facing away from the substrate; a second die on the active surface of the first die, electrically connected to the first die through a plurality of conductive terminals; and a sealing structure on the active surface of the first die, surrounding the plurality of conductive terminals and abutting the second die thereby forming a cavity between the first die and the second die. A method for manufacturing the semiconductor package structure is also provided.
    Type: Application
    Filed: June 21, 2019
    Publication date: December 24, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi Sheng TSENG, Lu-Ming LAI, Hui-Chung LIU
  • Patent number: 10857453
    Abstract: A button assembly adapted for being mounted in a game controller. The button assembly includes a pedestal, a pressure sensor module and a key cap. A middle of the pedestal has an accommodating groove penetrating upward through a top surface of the middle of the pedestal. Two opposite sides of the pedestal have two limiting portions oppositely protruded outward. The pressure sensor module is mounted in the accommodating groove of the pedestal. The key cap is covered on the pressure sensor module. A bottom surface of the key cap has a contact portion contacting with the pressure sensor module. Two opposite sides of the key cap have two active portions protruded outward. The two active portions are mounted to the two limiting portions, respectively. In processes of pressing and releasing the key cap, the two active portions move downward and upward with respect to the two limiting portions.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: December 8, 2020
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Chi-Ming Tseng, Tsung-Shih Lee
  • Publication number: 20200367612
    Abstract: A hand fixation band includes a fastening band, a sliding arm and a damping element. The fastening band has a connecting portion. A bottom surface of the connecting portion is defined as a contact surface. The sliding arm is connected with the fastening band. A top surface of one end of the sliding arm is recessed downward to form an accommodating groove. Several portions of a top surface of a bottom wall of the accommodating groove protrude upward to form a plurality of buckling blocks. The damping element is disposed in the accommodating groove and contacts with the contact surface. Several portions of a bottom surface of the damping element are recessed upward to form a plurality of buckling holes. The plurality of the buckling blocks are buckled in the plurality of the buckling holes.
    Type: Application
    Filed: October 4, 2019
    Publication date: November 26, 2020
    Inventors: Tsung Shih Lee, Chi Ming Tseng, Chia Fa Cheng
  • Publication number: 20200367609
    Abstract: A hand fixation band includes a fastening band, a sliding arm and a damping element. The fastening band has a main portion, and a connecting portion protruded outward from one end of the main portion. A bottom surface of the connecting portion is defined as a contact surface. The sliding arm is connected with the fastening band. One end of the sliding arm disposed under the connecting portion is recessed downward to form an accommodating groove. A top of a peripheral wall of the accommodating groove is inclined outward from bottom to top to form a first inclined surface. The damping element is disposed in the accommodating groove and contacts with the contact surface. A periphery of a bottom surface of the damping element is inclined outward from bottom to top to form a second inclined surface. The first inclined surface contacts with the second inclined surface.
    Type: Application
    Filed: September 26, 2019
    Publication date: November 26, 2020
    Inventors: Tsung Shih Lee, Chi Ming Tseng
  • Publication number: 20200362730
    Abstract: A hand fixation band includes a fastening band, a damping element and a sliding arm. The fastening band has a main portion, and a connecting portion protruded outward from one end of the main portion. A free end of the connecting portion protrudes downward to form a first protruding portion. The damping element is assembled to the fastening band. A top surface of an inner side of the damping element is recessed downward to form a first recess. A bottom surface of the damping element is recessed upward to form a second recess. The first protruding portion is assembled in the first recess. The sliding arm is connected with the fastening band and the damping element. One end of the sliding arm protrudes upward to form a second protruding portion. The second protruding portion is assembled in the second recess.
    Type: Application
    Filed: September 17, 2019
    Publication date: November 19, 2020
    Inventors: Tsung Shih Lee, Chi Ming Tseng
  • Publication number: 20200359749
    Abstract: A hand fixation band includes a fastening band, a sliding arm and a damping element. The fastening band has a main portion, and a connecting portion protruded outward from one end of the main portion. The connecting portion protrudes downward to form a first protruding rib. An inside of the first protruding rib has an accommodating space. The sliding arm is connected with the fastening band. A top surface of one end of the sliding arm has a buckling slot. The buckling slot is corresponding to and buckled with the first protruding rib. One end of the sliding arm opens a locating hole. A top surface of a peripheral wall of the locating hole surrounded by the buckling slot is defined as an accommodating surface. The damping element is disposed on the accommodating surface and is accommodated in the accommodating space.
    Type: Application
    Filed: September 23, 2019
    Publication date: November 19, 2020
    Inventors: Tsung Shih Lee, Chi Ming Tseng
  • Patent number: 10825623
    Abstract: A rocker assembly structure includes a pedestal having a base portion, and a keycap. A bottom wall of the accommodating groove protrudes upward to form a rod portion. Several portions of a peripheral surface of the rod portion are recessed inward to form a plurality of first guiding grooves. A lower portion of an inner wall of each first guiding groove is recessed inward to form a buckling slot. A front of the peripheral surface of the rod portion is further recessed inward to form a second guiding groove. The keycap covers the rod portion. Several portions of an inner wall of the keycap protrudes inward to form a plurality of buckling blocks. The plurality of the buckling blocks are disposed in the buckling slots of the plurality of the first guiding grooves and the second guiding groove.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: November 3, 2020
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chi Ming Tseng, Tsung Shih Lee
  • Publication number: 20200340764
    Abstract: A molding method is provided. The method includes steps of: providing a mold having a male mold forming a column and a female mold forming a cavity; multiple ribs extending along a longitudinal direction of the column are formed on the column; inserting the male mold into the female mold to close the mold to make the column inserted in and separated from an inner surface of the cavity; filling a molten plastic material mixed with metal particles into the cavity so as to make the material fill a space between the column and the cavity; forming a molded heat transfer component covering the column by the solidified plastic material; taking out the molded heat transfer component with the column along the longitudinal direction of the column from the cavity; and separating the molded heat transfer component from the column along the longitudinal direction of the column.
    Type: Application
    Filed: August 8, 2019
    Publication date: October 29, 2020
    Inventors: Wei-Lin TSENG, Yang-Ming SHIH, Hung-Yun HSU, Chi-Hang HUNG
  • Patent number: 10806994
    Abstract: A trigger with user adjustable sensor position assembled to an outer shell, includes a pressing portion pivotally connected to the outer shell, a torsion spring elastically abutting between the pressing portion and the outer shell, a triggering portion assembled in the outer shell, and an adjusting assembly. When an elastic force of the torsion spring is released, the torsion spring elastically abuts against the pressing portion to define a position where the pressing portion is located to be an original position, a position where the pressing portion abuts against the triggering portion to trigger the triggering portion is defined as a triggering position. The pressing portion is capable of swinging between the original position and the triggering position. The adjusting assembly is assembled in the outer shell. When the adjusting assembly is in different adjusting positions, key travels between the pressing portion and the triggering portion are different.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: October 20, 2020
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Hsieh Cheng Chou, Chi Ming Tseng
  • Patent number: 10812017
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 20, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang
  • Patent number: 10780343
    Abstract: The present invention is a game controller, the game controller comprises a body, at least one socket, at least one fastening receptor, at least one actuating module, at least one fixed and at least one fastening member. The socket is formed in the body. The fastening receptor is formed in the body. The actuating module is removably mounted in the socket. The fixed frame is configured to receive the actuating module. The fixed frame comprises at least one first positioning hole. The actuating module is fixed in the socket by a combination of the fixed frame and the fastening member, wherein the fastening member passes the first positioning hole and fastens in the fastening receptor.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: September 22, 2020
    Assignee: CHENG UEI PRECISION INDUSTRY CO., LTD.
    Inventors: Hsieh Cheng Chou, Chi Ming Tseng
  • Patent number: 10752494
    Abstract: A semiconductor device package is provided, which includes a carrier, a first reflective element, a second reflective element, a first optical component, a second optical component and a microelectromechanical system (MEMS) device. The carrier has a first surface. The first reflective element is disposed on the first surface of the carrier. The second reflective element disposed on the first surface of the carrier. The first optical component is disposed on the first reflective element. The second optical component is disposed on the second reflective element. The MEMS device is disposed on the first surface of the carrier to provide light beams to the first reflective element and the second reflective element. The light beams provided to the first reflective element are reflected to the first optical component and the light beams provided to the second reflective element are reflected to the second optical component.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 25, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Shih-Chieh Tang, Hsin-Ying Ho, Hsun-Wei Chan
  • Publication number: 20200243283
    Abstract: A button assembly is disposed in a rocker. The button assembly including a base, a pressure sensor and a keycap. The base has two lower pivoting portions with each of the two lower pivoting portions protruding outwardly from respective sides of the base. The pressure sensor is mounted on the base. The keycap overlies the pressure sensor. The keycap has two upper pivoting portions with each of the two upper pivoting portions protruding outwardly from respective sides of the keycap. The two lower pivoting portions are pivoted with the two upper pivoting portions to allow the two upper pivoting portions to be rotatable relative to the two lower pivoting portions. As described above, a push-button structure is thus formed by the two lower pivoting portions and the two upper pivoting portions configured among the base, the pressure sensor and the keycap to achieve the modularization of the button assembly.
    Type: Application
    Filed: November 5, 2019
    Publication date: July 30, 2020
    Inventors: CHI-MING TSENG, TSUNG-SHIH LEE
  • Patent number: 10727020
    Abstract: A switch module includes an outer shell, a button and a bracket. The button is disposed to the outer shell. The button has a base board. One side of a bottom surface of the base board is recessed in the upward direction to form an avoiding groove. A rear of the bottom surface of the base board protrudes in the downward direction to form a driving pillar. The bracket is disposed under the button. A top surface of the bracket is recessed in the downward direction to form an accommodating groove. A top surface of a bottom wall of the accommodating groove is defined as a stopping surface. The driving pillar projects beyond the stopping surface. A front end of the top surface of the bottom wall of the accommodating groove is recessed downward to form an avoiding plane.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: July 28, 2020
    Assignee: Cheng Uei Precision Industry Co., Ltd.
    Inventors: Chi Ming Tseng, Wen Hsiang Tai