Abstract: A land grid array socket (12) includes a dielectric housing (30) and a number of conductive terminals (40) secured thereto. A stiffener (50) having a pair of transverse flanges (504, 508) and a pair of discrete longitudinal sidewall (506) is disposed around the housing. A load plate (60) is pivotally attached to one of the flange for downwardly pressing a land grid array package seated on the terminals toward the housing. A lever (70) is moveably coupled to the other flange for locking the load plate in position.

Abstract: According to one embodiment of the present invention, an electrical connector (10) includes an insulative housing (15) defining a number of passages (18) and a number of conductive terminals (20) seated in corresponding passages, respectively. The conductive terminal includes a base section (22), a bent section (23) projecting angularly from the base section and having a planar section (26) parallel with the base section, a spring arm (24) sticking upwardly and obliquely out of the passage, and a soldering pad (25) to be mounted on a circuit substrate (28).

Abstract: An electrical connector terminal (1) includes a base portion (12) having a lower end (122) for connecting to a circuit board and an upper end, a twist portion (14) extending upwardly from the upper end of the base portion, and a contact portion (16) extending upwardly from the twist portion. The contact portion defines an upwardly facing contacting face.

Abstract: A conductive contact (1) includes a base portion (10) extending along a upright direction, an extending portion (13) extending from the base portion (10), a spring portion (14) extending upwardly from the extending portion (13) with a contacting portion extending portion (13) on a top end thereof, a tail (11) formed on a distal end thereof. Wherein the contact (1) further defines a reinforcing portion (12) extending upwardly from the base portion (1) for abutting against the extending portion (13) during the contact (1) sliding at a predetermined trace.

Abstract: An electrical contact (1) comprises a retention portion (11), a contact engaging portion (12) extending upward away from the retention portion ( ), and a lower portion (13) extending from the retention portion (11), wherein the contact engaging portion (12) is formed with an embossed portion (14), which makes the contact (1) have a preferred engaging function and an improved current conducting feature.

Abstract: An electrical contact for electrically connecting an IC package and a circuit board includes a base portion, a resilient portion which includes a medial portion extending from the base portion and a connecting portion, a mating portion extending from the upper end of the connecting portion and having a mating point in the free end thereof, a tail portion extending from a lower end of the base portion. The connecting portion extends substantially parallel to the medial portion and distant to the medial portion, thus a distance in a horizontal direction between the medial portion and the resilient portion is formed and the elastic property of the electrical contact increases.

Abstract: An electrical connector (100) for mounting on a board (3) includes an insulative housing (2) defining a number of passageways (20) and a number of contacts (1) received in corresponding passageways. Each contact includes a base portion (10), a tail portion (12) extending from one side of the base portion and electrically connecting to the board, a contact portion (16) projecting beyond an upper opening (21) of the passageway, and an intermediate portion (15) interconnecting the contact portion and the base portion in such a manner that the contact portion extends along a direction defining an angle with respect to both the base portion and the intermediate portion.

Abstract: An electrical connector (5) includes a plurality of housings (52), a plurality of contacts received in each housing (52), a bracket (51) defining a plurality of sections (511) for receiving the housings (52) therein. Relative to the related art, the electrical connector (5) defines a plurality of separately housings (52) and a bracket (51) having a number of receiving section (511) for receiving the housings (52) therein, which simplifies the mold process and improves the insulative material injected quality.

Abstract: A land grid array socket (12) includes a dielectric housing (30) and a number of conductive terminals (40) secured thereto. A stiffener (50) having a pair of transverse flanges (504, 508) and a pair of discrete longitudinal sidewall (506) is disposed around the housing. A load plate (60) is pivotally attached to one of the flange for downwardly pressing a land grid array package seated on the terminals toward the housing. A lever (70) is moveably coupled to the other flange for locking the load plate in position.

Abstract: A terminals (10) for use in connection of a first electrical interface (50) and a second interface (60), comprises a base portion (12) extending between the first electrical interface and the second electrical interface, a pair of arm portions (14) extending from two lateral sides of the base portion toward the first electrical interface, a solder portion (16) extending outwardly from the base portion (12) towards the second electrical interface, and at least one plate-like member disposed between the arm portion (14) and the solder portion (16) of the terminal (10).

Abstract: A liquid crystal display panel includes a repair line for substituting open-circuited signal lines. Signal lines are disposed over a first side of a first substrate of the liquid crystal display panel for data transmission. Repair lines are disposed over a first side of a second substrate of the liquid crystal display panel for substituting open-circuited signal lines. The first side of the first substrate faces the first side of the second substrate. A liquid crystal layer is disposed between the first and second substrates of the liquid crystal panel.

Abstract: A pixel structure of an active device array substrate is provided. The pixel structure includes a scan line and a data line; an active device electrically coupled to the scan line and the data line; a pixel electrode electrically coupled to the active device, wherein the pixel electrode has at least one opening therein; and at least one island electrode disposed inside the opening, wherein the island electrode is electrically coupled to a voltage V, and the pixel electrode is electrically coupled to a driving voltage Vd that is different from the voltage V, such that a transverse electric field is formed between the island electrode and the pixel electrode.

Abstract: An optically compensated birefringence liquid crystal display (LCD) panel is provided, which includes an active device array apparatus, a color filter apparatus, and an optically compensated birefringence liquid crystal layer disposed between the active device array apparatus and the color filter apparatus. The color filter apparatus includes a substrate, a color filter array, a common electrode, a plurality of electrode lines, and an insulating layer. The color filter array is disposed on the substrate and has a black matrix and a color filter layer. The common electrode is disposed over the color filter array. The electrode lines are disposed over the common electrode. The insulating layer is disposed between the common electrode and the electrode lines. Accordingly, the problems of delay of data signal and overload of the driving circuit when a high voltage is applied to the control signal electrode of the conventional LCD panel are resolved.

Abstract: An electrical contact for electrically connecting an IC package and a circuit board includes a base portion, a resilient portion which includes a medial portion extending from the base portion and a connecting portion, a mating portion extending from the upper end of the connecting portion and having a mating point in the free end thereof, a tail portion extending from a lower end of the base portion. The connecting portion extends substantially parallel to the medial portion and distant to the medial portion, thus a distance in a horizontal direction between the medial portion and the resilient portion is formed and the elastic property of the electrical contact increases.

Abstract: An LGA connector contact (1) according to an embodiment includes a vertical retention portion (10) for being secured in an LGA connector, and an upper engaging portion (11) connecting to the retention portion for engaging a mating contact of an IC package. The upper engaging portion includes a curved connection section (111) for connecting to an upper part of the vertical retention portion, and a resilient arm (113) extending from the curved connection section. The resilient arm is configured to extend angularly relative to the retention portion. As compared with the prior art, the connection section is configured to have a gradually decreased width relative to the upper part of the retention portion. This configuration of the connection section will minimize stress imposed on the contact connection section, thereby avoiding fatigue of the connector contact.

Abstract: A terminals (10) for use in connection of a first electrical interface (50) and a second interface (60), comprises a base portion (12) extending between the first electrical interface and the second electrical interface, a pair of arm portions (14) extending from two lateral sides of the base portion toward the first electrical interface, a solder portion (16) extending outwardly from the base portion (12) towards the second electrical interface, and at least one plate-like member disposed between the arm portion (14) and the solder portion (16) of the terminal (10).

Abstract: According to one embodiment of the present invention, an electrical connector (10) includes an insulative housing (15) defining a number of passages (18) and a number of conductive terminals (20) seated in corresponding passages, respectively. The conductive terminal includes a base section (22), a bent section (23) projecting angularly from the base section and having a planar section (26) parallel with the base section, a spring arm (24) sticking upwardly and obliquely out of the passage, and a soldering pad (25) to be mounted on a circuit substrate (28).