Patents by Inventor Chi-Nan Tsai

Chi-Nan Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6992890
    Abstract: A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.
    Type: Grant
    Filed: September 2, 2004
    Date of Patent: January 31, 2006
    Assignee: Glacialtech, Inc.
    Inventors: Ying-Chih Wang, Yong-Chang Kao, Chi-Nan Tsai
  • Publication number: 20050264994
    Abstract: A heat sink is provided. The heat sink comprises a hollow chassis having a contact face at a bottom portion thereof for attaching to an electronic component and a heat dissipating face at a top portion thereof. A plurality of circularly arranged fins extend from an inner sidewall of the hollow chassis towards a center of the hollow chassis so that gaps between the fins gradually decrease from the inner sidewall of said hollow chassis towards the center of said hollow chassis. At least a heat pipe is positioned between the contact face and the heat dissipating face. At least a fan is positioned at a side of the hollow chassis for generating air to increase an amount of air blowing through wider gaps between said fins to increase the speed of heat dissipation.
    Type: Application
    Filed: September 2, 2004
    Publication date: December 1, 2005
    Applicant: GLACIALTECH, INC.
    Inventors: Ying-Chih Wang, Yung-Chang Kao, Chi-Nan Tsai