Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

Abstract: A method for fabricating a stacked semiconductor device has the steps of: a) Attach a temporary base on a side of a substrate having a conductor pattern and a cavity. b) Provide a first die in the cavity of the substrate and attach it on the temporary base and electrically connect it to the conductor pattern via wires. c) Stack a second die on the first die and electrically connect it to the conductor pattern via wires. d) Provide an insulating layer on the substrate and in the cavity to embed the first die and the second die, and e) remove the temporary base.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern and a cavity. A first die is received in the cavity of the cavity of the substrate and is electrically connected to the conductor pattern via wires. An adhesive layer is printed on a top of the first die. A second die is stacked on the first die via the adhesive layer and is electrically connected to the conductor pattern via wires, and An insulating layer provided on the substrate, wherein the insulating layer cover the first die and the second die and has a portion thereof received in the cavity to bond the first die.

Abstract: A semiconductor package for lowering electromagnetic interference and a method for fabricating the same are proposed. The semiconductor package includes a chip carrier, at least one chip attached and electrically connected to the chip carrier, and an encapsulation body formed on the chip carrier for encapsulating the chip. The encapsulation body includes an electromagnetic absorbing layer made of an organic material filled with a plurality of porous metal particles. The electromagnetic absorbing layer absorbs electromagnetic waves generated by the chip and converts the electromagnetic waves to heat so as to improve the heat dissipation efficiency and reduce electromagnetic interference for the semiconductor package.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern thereon and the conductor pattern has a plurality of pads. A first die is mounted on the substrate and is electrically connected to the pads of the conductor pattern by gold wires. A first insulating layer is mounted on the substrate to cover the first die and the gold wires. A mask, which has a top and an annular sidewall, is mounted on the substrate to cover the first insulating layer and the first die. A second die is mounted on the top of the mask and is electrically connected to the pads of the connector pattern by gold wires. A second insulating layer is mounted on the substrate to cover the second die and the gold wires.

Abstract: A stacked semiconductor device has a substrate having a conductor pattern and a die bonding portion. A first die is bonded on the die bonding portion of the substrate and is electrically connected to the conductor pattern via wires. A first adhesive layer provided on the substrate to cover the first die and the wires. The first adhesive layer has a greater top on which a second die is bonded. The second die is greater than the first die and is electrically connected to the pads of the conductor pattern via wires. A second adhesive layer provided on the substrate to cover the second die and the wires.

Abstract: An image capture device comprises a substrate having a first side, a second side, a cavity running through the substrate from the first side to the second side and a conductor pattern. An image sensor is provided on the first side of the substrate to cover the cavity. A first die is provided in the cavity of the substrate and is bonded to a bottom of the image sensor. A second die is stacked on the first die. An insulating layer is provided on the second side of the substrate to cover the first die and the second die, and a frame is provided on the first side of the substrate to receive the image sensor therein. The frame has a window in which lenses are mounted.