Patents by Inventor Chi-Pin Lin

Chi-Pin Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8174596
    Abstract: A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length LPL into line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLSj) of sensing elements. The LPLSj converts portion of the PLI into a raw image segment signal set (RISSj). The LPLSj set forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCSj) coupled to LPLSj for processing RISSj into a readout image segment signal set (ROSSj). The RCSj has a set of contact pads (CTPj) for off-chip interconnection. Upon off-chip interconnection of the CTPj set thus composing the ROSSj set into LIS, the WLISC functions as a key part of a linear image sensor system of image length LPL.
    Type: Grant
    Filed: July 21, 2009
    Date of Patent: May 8, 2012
    Assignee: CMOS Sensor Inc.
    Inventors: Weng-Lyang Wang, Shengmin Lin, Chi-Pin Lin, Feng-Ke Hsiao
  • Patent number: 8058602
    Abstract: A long-length industry camera image sensor (LICIS) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length LPL along X-direction into a line image signal (LIS). The LICIS includes a full-width linear image sensor (FLIS) of length LIS along X-direction and displaced from the PLI along Z-direction by an imaging distance DIMG for converting an incident line image (ILI) impinging upon its FLIS top surface into the LIS. Where LIS is about equal to LPL. The LICIS also has a full-width linear rod lens (FLRL) of length LRL along X-direction and displaced from the PLI in Z-direction by a working distance DWKG. Where LRL is about equal to LPL and DWKG is selected such that the PLI gets focused by the FLRL into the ILI at the FLIS top surface with an imaging magnification factor of about 1:1.
    Type: Grant
    Filed: February 25, 2009
    Date of Patent: November 15, 2011
    Assignee: CMOS Sensor, Inc.
    Inventors: Weng-Lyang Wang, Shengmin Lin, Chi-Pin Lin, Feng Ke Hsiao
  • Publication number: 20110019044
    Abstract: A time delay integration (TDI) based MOS photoelectric pixel sensing circuit (TDIPSC) is proposed. The TDIPSC includes multi-element photoelectric pixel sensor (MEPS) having sub-pixel sensor elements SPSE1, . . . , SPSEM respectively converting a portion of pixel light into sub-pixel photoelectric signals (SPPES1, . . . , SPPESM). The TDIPSC also includes intermediate photoelectric signal accumulators (PESA1, . . . , PESAM) where any PESAk can be switchably coupled to any SPSEj via switching transistors for receiving a corresponding SPPESj from it and accruing an accumulated photoelectric signal ACPESk. A readout circuit (ROC) switchably coupled to any PESAk serves to remove and read the ACPESk. A TDI-sequence controller (TDISC) coupled to the SPSEs, the PESAs and the ROC executes a time sequence of cyclic coupling among them. The TDISC produces, via the ROC, a final time signal SQTS equal to the time delayed summation of the (SPPES1, . . . , SPPESM) with a reduced SNR.
    Type: Application
    Filed: July 21, 2009
    Publication date: January 27, 2011
    Inventors: Weng-Lyang Wang, Shengmin Lin, Chi-Pin Lin, Feng-Ke Hsiao
  • Publication number: 20110019046
    Abstract: A wafer-scale linear image sensor chip (WLISC) is proposed with gapless pixel line and signal readout circuit segments. The WLISC converts pixel line image (PLI) of length LPL into line image signal (LIS). The WLISC includes a linear array of sensor segments. Each sensor segment includes a gapless local pixel line segment (LPLSj) of sensing elements. The LPLSj converts portion of the PLI into a raw image segment signal set (RISSj). The LPLSj set forms a gapless global pixel line (GPL) corresponding to PLI. The sensor segment also includes readout circuit segment (RCSj) coupled to LPLSj for processing RISSj into a readout image segment signal set (ROSSj). The RCSj has a set of contact pads (CTPj) for off-chip interconnection. Upon off-chip interconnection of the CTPj set thus composing the ROSSj set into LIS, the WLISC functions as a key part of a linear image sensor system of image length LPL.
    Type: Application
    Filed: July 21, 2009
    Publication date: January 27, 2011
    Inventors: Weng-Lyang Wang, Shangmin Lin, Chi-Pin Lin, Feng-Ke Hsiao
  • Publication number: 20100213355
    Abstract: A full-width line image-sensing head (FLIH) is proposed for, expressed in X-Y-Z coordinates, converting a pixel line image (PLI) of length LPL along X-direction into a line image signal (LIS). The FLIH includes a full-width linear image sensor (FLIS) of length LIS along X-direction and displaced from the PLI along Z-direction by an imaging distance DIMG for converting an incident line image (ILI) impinging upon its FLIS top surface into the LIS. Where LIS is about equal to LPL. The FLIH also has a full-width linear rod lens (FLRL) of length LRL along X-direction and displaced from the PLI in Z-direction by a working distance DWKG. Where LRL is about equal to LPL and DWKG is selected such that the PLI gets focused by the FLRL into the ILI at the FLIS top surface with an imaging magnification factor of about 1:1.
    Type: Application
    Filed: February 25, 2009
    Publication date: August 26, 2010
    Inventors: Weng-Lyang Wang, Shengmin Lin, Chi-Pin Lin, Feng Ke Hsiao