Patents by Inventor Chi-Pin Tsai

Chi-Pin Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11476572
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: October 18, 2022
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20200161756
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Patent number: 10587041
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: March 10, 2020
    Assignee: Silicon Precision Industries Co., Ltd.
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Patent number: 10074621
    Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
    Type: Grant
    Filed: June 14, 2016
    Date of Patent: September 11, 2018
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
  • Publication number: 20180090835
    Abstract: An electronic package structure is provided, including a substrate with an electronic component, an antenna element and a shielding element disposed on the substrate. The shielding element is positioned between the antenna element and the electronic component to prevent electromagnetic interference (EMI) from occurring between the antenna element and the electronic component. A method for fabricating the electronic package structure is also provided.
    Type: Application
    Filed: May 16, 2017
    Publication date: March 29, 2018
    Inventors: Chih-Yuan Shih, Chih-Hsien Chiu, Yueh-Chiung Chang, Tsung-Li Lin, Chi-Pin Tsai, Chien-Cheng Lin, Tsung-Hsien Tsai, Heng-Cheng Chu, Ming-Fan Tsai
  • Publication number: 20170278807
    Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
    Type: Application
    Filed: June 14, 2016
    Publication date: September 28, 2017
    Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Chi-Liang Shih, Ming-Fan Tsai, Chia-Yang Chen
  • Publication number: 20160300660
    Abstract: An electronic device is provided, which includes: a magnetically conductive element having at least a through hole; a conductor structure formed on the magnetically conductive element and in the through hole; and a base body encapsulating the magnetically conductive element and the conductor structure, thereby allowing the electronic device to generate a higher magnetic flux and thus cause an increase in inductance.
    Type: Application
    Filed: May 21, 2015
    Publication date: October 13, 2016
    Inventors: Chih-Hsien Chiu, Chi-Pin Tsai, Ming-Fan Tsai, Jyun-Yuan Jhang, Chi-Liang Shih
  • Publication number: 20150263421
    Abstract: An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure provided on the substrate, wherein the antenna structure has at least a supporting portion and an extending portion supported by the supporting portion over the substrate and surrounding the electronic element; and a shielding structure provided on the substrate and overlapping with the antenna structure, thereby saving the surface area of the substrate so as to meet the miniaturization requirement of the electronic package.
    Type: Application
    Filed: May 29, 2014
    Publication date: September 17, 2015
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Tsung-Hsien Tsai, Chi-Pin Tsai, Chih-Ming Cheng
  • Patent number: 6327056
    Abstract: An image scanner with an image correction function generates a primary image and an auxiliary image of a document. The image scanner includes an image sensing module, a lens module, a scanning platform, a primary light source and an auxiliary light source. The primary light source illuminates the document from a first optical angle and the auxiliary light source illuminates the document from a second optical angle. During alternate illumination by the primary and auxiliary light sources, the scanner respectively generates two images for each document, one of which is a primary image and the other of which is an auxiliary image. The auxiliary image, which includes information concerning damage to the document, is used to correct the primary image, either transmitting the images to a host for further processing, or by processing the images within the scanner.
    Type: Grant
    Filed: September 23, 1999
    Date of Patent: December 4, 2001
    Assignee: Microtek International Inc.
    Inventors: Chi-pin Tsai, Hung-chou Chiu
  • Patent number: 6170751
    Abstract: The present invention discloses a scanning module with variable optical paths for increasing scanning resolution. The scanning module comprises a carriage with a first scanning position, a light detecting device, a plurality of mirrors, and a lens set. The light detecting device is installed inside the carriage for detecting light transmitted from the document at the first scanning position. The plurality of mirrors is installed inside the carriage for reflecting the light from the document to the light detecting device. The plurality of mirrors comprises at least one moveable mirror for changing an optical path from the document to the light detecting device thereby allowing the light from the document be transmitted to the light detecting device along a first optical path or a second optical path. The lens set is installed inside the carriage with a first end and a second end for focusing the light from the document onto the light detecting device.
    Type: Grant
    Filed: May 6, 1998
    Date of Patent: January 9, 2001
    Assignee: Microtek International Inc.
    Inventor: Chi-Pin Tsai
  • Patent number: 6043476
    Abstract: The present invention provides a film scanner with an adjustable light module whose chromaticity can be adjusted according to the positive or negative film to be scanned. The film scanner comprises a light module comprising a plurality of lamps of different colors, a scanning module for scanning the light transmitted through the film and generating image signals, an adjusting device for adjusting the on/off state or chromaticity of the lamps, and a control device for controlling the adjusting device according to the image signals received from the scanning module.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: March 28, 2000
    Assignee: Microtek International Inc.
    Inventor: Chi-Pin Tsai