Patents by Inventor Chi-Ping LEI

Chi-Ping LEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
    Publication number: 20220246483
    Abstract: In an embodiment, a system includes: a pad comprising a first side and a second side opposite the first side, wherein the first side is configured to receive a wafer during chemical mechanical planarization (CMP), and a platen adjacent the pad along the second side, wherein the platen comprises a suction opening that interfaces with the second side; a pump configured to produce suction at the suction opening to adhere the second side to the platen; and a sensor configured to collect sensor data characterizing a uniformity of adherence between the pad and the platen, wherein the pump is configured to produce the suction at the suction opening based on the sensor data.
    Type: Application
    Filed: April 14, 2022
    Publication date: August 4, 2022
    Inventors: Yu-Hsiang CHAO, Chi-Ping Lei
  • Systems and methods for suction pad assemblies
    Patent number: 11328965
    Abstract: In an embodiment, a system includes: a pad comprising a first side and a second side opposite the first side, wherein the first side is configured to receive a wafer during chemical mechanical planarization (CMP), and a platen adjacent the pad along the second side, wherein the platen comprises a suction opening that interfaces with the second side; a pump configured to produce suction at the suction opening to adhere the second side to the platen; and a sensor configured to collect sensor data characterizing a uniformity of adherence between the pad and the platen, wherein the pump is configured to produce the suction at the suction opening based on the sensor data.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: May 10, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hsiang Chao, Chi-Ping Lei
  • SYSTEMS AND METHODS FOR SUCTION PAD ASSEMBLIES
    Publication number: 20200043814
    Abstract: In an embodiment, a system includes: a pad comprising a first side and a second side opposite the first side, wherein the first side is configured to receive a wafer during chemical mechanical planarization (CMP), and a platen adjacent the pad along the second side, wherein the platen comprises a suction opening that interfaces with the second side; a pump configured to produce suction at the suction opening to adhere the second side to the platen; and a sensor configured to collect sensor data characterizing a uniformity of adherence between the pad and the platen, wherein the pump is configured to produce the suction at the suction opening based on the sensor data.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 6, 2020
    Inventors: Yu-Hsiang CHAO, Chi-Ping LEI