Patents by Inventor Chi Q. Truong

Chi Q. Truong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRE-APPLIED UNDERFILL
    Publication number: 20150064851
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Inventors: Michael K. GALLAGHER, Edgardo ANZURES, David FLEMING, Avin V. DHOBLE, Chi Q. TRUONG, Anupam CHOUBEY, Jeffrey M. CALVERT
  • Antireflective hard mask compositions
    Patent number: 8373241
    Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 12, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
  • ANTIREFLECTIVE HARD MASK COMPOSITIONS
    Publication number: 20100297539
    Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
    Type: Application
    Filed: October 20, 2009
    Publication date: November 25, 2010
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.
    Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
  • Antireflective hard mask compositions
    Patent number: 7605439
    Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: October 20, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
  • Reduction of inorganic contaminants in polymers and photoresist compositions comprising same
    Patent number: 6773872
    Abstract: The present invention provides polymers which are substantially or completely free of inorganic contaminants and the use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting resists. Polymers of the invention also are suitable for use as a resin component for antireflective coating compositions (ARCs). More particularly, the invention provides methods for reducing such contaminants in polymerization initiators, particularly free radical initiators.
    Type: Grant
    Filed: December 27, 2001
    Date of Patent: August 10, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Suzanne Coley, Chi Q. Truong, Ashish Pandya
  • Reduction of inorganic contaminants in polymers and photoresist compositions comprising same
    Publication number: 20020142246
    Abstract: The present invention provides polymers which are substantially or completely free of inorganic contaminants and the use of such polymers as a resin component for photoresist compositions, particularly chemically-amplified positive-acting resists. Polymers of the invention also are suitable for use as a resin component for antireflective coating compositions (ARCs). More particularly, the invention provides methods for reducing such contaminants in polymerization initiators, particularly free radical initiators.
    Type: Application
    Filed: December 27, 2001
    Publication date: October 3, 2002
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Suzanne Coley, Chi Q. Truong, Ashish Pandya