Abstract: An apparatus for 3D surface measurement of a target surface, the apparatus comprising: a first projector configured to project a fringe pattern onto the target surface; a second projector configured to project a fringe pattern onto the target surface; a first camera configured to capture the fringe patterns projected by the first projector and the second projector; a second camera configured to capture the fringe patterns projected by the first projector and the second projector; and a computer configured to perform fringe pattern processing of the fringe patterns captured by the first camera and the second camera and to perform data stitching and merging to obtain a 3D surface reconstruction.

Abstract: There is provided a method and system for real time inspection of a silicon wafer. The method includes using an infrared plane polariscope to obtain an image of a bonded interface of the silicon wafer, the image showing stress patterns; and assessment of the stress patterns. The stress patterns in a form of at least one butterfly pattern indicates a presence of at least one of: at least one trapped particle, trapped gases and at least one de-bonding region. No computer/algorithm processing is carried out to locate defects/de-bondings at the bonded interface. Furthermore, the stress fields being generated can be used to approximate the size of the de-bonding region/trapped particle. The system employs the infrared plane polariscope to obtain an image of a bonded interface of the silicon wafer.

Abstract: An apparatus for 3D surface measurement of a target surface, the apparatus comprising: a first projector configured to project a fringe pattern onto the target surface; a second projector configured to project a fringe pattern onto the target surface; a first camera configured to capture the fringe patterns projected by the first projector and the second projector; a second camera configured to capture the fringe patterns projected by the first projector and the second projector; and a computer configured to perform fringe pattern processing of the fringe patterns captured by the first camera and the second camera and to perform data stitching and merging to obtain a 3D surface reconstruction.