Patents by Inventor Chi Seok Hwang

Chi Seok Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY
    Publication number: 20120029117
    Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
    Type: Application
    Filed: October 6, 2011
    Publication date: February 2, 2012
    Applicant: CHEIL INDUSTRIES, INC.
    Inventors: Han Nim CHOI, Ki Tae Song, Chi Seok Hwang, Hea Kyung Kim, Chang Beom Chung
  • Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods
    Publication number: 20090136748
    Abstract: An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C.
    Type: Application
    Filed: November 28, 2008
    Publication date: May 28, 2009
    Inventors: Han Nim Choi, Ki Tae Song, Chi Seok Hwang, Hea Kyung Kim, Chang Beom Chung