Abstract: A memory module comprises dynamic random access memory (DRAM), Flash memory, and a module controller. The module controller is configured to receive data to be transferred from the DRAM to the Flash memory, compute first cyclic redundancy check (CRC) codes for the data, and write the data into the Flash memory. The module controller is further configured to read the data from the Flash memory, compute second CRC codes for the data read from the Flash memory, and transfer the data to the DRAM. The module controller is further configured to compare the second CRC codes with the first CRC codes to determine one or more erroneous data bits in the data read from the Flash memory, read a data segment of the data from the DRAM that include the one or more erroneous data bits, correct the one or more erroneous data bits in the data segment, and write the data segment back into the DRAM.

Abstract: A memory module comprises dynamic random access memory (DRAM), Flash memory, and a module controller. The module controller is configured to receive data to be transferred from the DRAM to the Flash memory, compute first cyclic redundancy check (CRC) codes for the data, and write the data into the Flash memory. The module controller is further configured to read the data from the Flash memory, compute second CRC codes for the data read from the Flash memory, and transfer the data to the DRAM. The module controller is further configured to compare the second CRC codes with the first CRC codes to determine one or more erroneous data bits in the data read from the Flash memory, read a data segment of the data from the DRAM that include the one or more erroneous data bits, correct the one or more erroneous data bits in the data segment, and write the data segment back into the DRAM.

Abstract: A memory module comprises a volatile memory subsystem including DRAM, a non-volatile memory subsystem including Flash memory, and a module control device. The Flash memory includes main Flash providing a main Flash memory space and scratch Flash providing a scratch Flash memory space. The module control device is configured to receive a request from the memory controller to move one or more segments of data in a first Flash block in the main Flash to the DRAM and to, for each respective segment of data: select a respective set of pages in the DRAM; transfer respective data stored in the respective set of pages from the DRAM to a corresponding segment in the scratch Flash; and transfer the respective segment of data to the respective set of pages in the DRAM. Thus, data can be moved segment by segment between the DRAM and the Flash memory.

Abstract: A memory module comprises a volatile memory subsystem including DRAM, a non-volatile memory subsystem including Flash memory, and a module control device. The Flash memory includes main Flash providing a main Flash memory space and scratch Flash providing a scratch Flash memory space. The module control device is configured to receive a request from the memory controller to move one or more segments of data in a first Flash block in the main Flash to the DRAM and to, for each respective segment of data: select a respective set of pages in the DRAM; transfer respective data stored in the respective set of pages from the DRAM to a corresponding segment in the scratch Flash; and transfer the respective segment of data to the respective set of pages in the DRAM. Thus, data can be moved segment by segment between the DRAM and the Flash memory.

Abstract: A memory module comprises a volatile memory subsystem configured to coupled to a memory channel in computer system and capable of serving as main memory for the computer system, a non-volatile memory subsystem providing storage for the computer system, and a module controller coupled to the volatile memory subsystem, the non-volatile memory subsystem, and the C/A bus. The module controller is configured to control intra-module data transfers between the volatile memory subsystem and the non-volatile memory subsystem. The module controller is further configured to monitor C/A signals on the C/A bus and schedule the intra-module data transfers in accordance with the C/A signals so that the intra-module data transfers do not conflict with accesses to the volatile memory subsystem by the memory controller.

Abstract: A memory module comprises a volatile memory subsystem configured to coupled to a memory channel in computer system and capable of serving as main memory for the computer system, a non-volatile memory subsystem providing storage for the computer system, and a module controller coupled to the volatile memory subsystem, the non-volatile memory subsystem, and the C/A bus. The module controller is configured to control intra-module data transfers between the volatile memory subsystem and the non-volatile memory subsystem. The module controller is further configured to monitor C/A signals on the C/A bus and schedule the intra-module data transfers in accordance with the C/A signals so that the intra-module data transfers do not conflict with accesses to the volatile memory subsystem by the memory controller.

Abstract: A memory module comprises a volatile memory subsystem configured to coupled to a memory channel in computer system and capable of serving as main memory for the computer system, a non-volatile memory subsystem providing storage for the computer system, and a module controller coupled to the volatile memory subsystem, the non-volatile memory subsystem, and the C/A bus. The module controller is configured to control intra-module data transfers between the volatile memory subsystem and the non-volatile memory subsystem. The module controller is further configured to monitor C/A signals on the C/A bus and schedule the intra-module data transfers in accordance with the C/A signals so that the intra-module data transfers do not conflict with accesses to the volatile memory subsystem by the memory controller.

Abstract: A memory module comprises a volatile memory subsystem configured to coupled to a memory channel in computer system and capable of serving as main memory for the computer system, a non-volatile memory subsystem providing storage for the computer system, and a module controller coupled to the volatile memory subsystem, the non-volatile memory subsystem, and the C/A bus. The module controller is configured to control intra-module data transfers between the volatile memory subsystem and the non-volatile memory subsystem. The module controller is further configured to monitor C/A signals on the C/A bus and schedule the intra-module data transfers in accordance with the C/A signals so that the intra-module data transfers do not conflict with accesses to the volatile memory subsystem by the memory controller.

Abstract: A module is electrically connectable to a computer system. The module includes an edge connector with a plurality of electrical contacts electrically connectable to the computer system, at least one layer of thermally conductive material thermally coupled to the edge connector, and first and second printed circuit boards each having a plurality of integrated circuit components that are electrically coupled to the edge connector and thermally coupled to the at least one layer of thermally conductive material. The at least one layer of thermally conductive material are disposed between the first and second printed circuit boards.

Abstract: An electronic module for a computer system comprises a first circuit board having a plurality of edge connectors configured to releasably connect to electrical contacts of a computer system socket, a second circuit board having a plurality of contacts configured to connect with a plurality of electrical components, and a flexible portion having electrical conduits to provide electrical connection between the plurality of edge connectors and the plurality of contacts. The flexible portion further includes an electrically conductive layer extending across a region of the flexible portion. The electrically conductive layer is superposed with the electrical conduits and separated from electrical conduits by a dielectric layer.

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.

Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.

Abstract: A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract: A circuit includes a first plurality of contacts configured to be in electrical communication with a plurality of electronic devices. The circuit card further includes a flexible portion including a dielectric layer, a second plurality of contacts, and a plurality of electrical conduits extending across a region of the flexible portion and in electrical communication with one or more contacts of the first plurality of contacts and with the second plurality of contacts. The flexible portion further includes an electrically conductive layer extending across the region of the flexible portion. The electrically conductive layer is superposed with the plurality of electrical conduits with the dielectric layer therebetween. The electrically conductive layer does not overlay one or more portions of the dielectric layer in the region of the flexible portion.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first surface and a first plurality of circuits coupled to the first surface. The first plurality of circuits is in electrical communication with the electrical contacts. The module further includes a second surface and a second plurality of circuits coupled to the second surface. The second plurality of circuits is in electrical communication with the electrical contacts. The second surface faces the first surface. The module further includes at least one thermally conductive layer positioned between the first surface and the second surface. The at least one thermally conductive layer is in thermal communication with the first plurality of circuits, the second plurality of circuits, and a first set of the plurality of electrical contacts.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.

Abstract: A module is electrically connectable to a computer system. The module includes a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first substrate which has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second substrate which has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second substrate faces the first surface of the first substrate. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components.

Abstract: On implementation of the invention provides a stackable chip-scale package for improving memory density that may be mounted within a limited area or module. A novel staggered routing scheme enables the use of the same trace routing at every level of the stacked architecture for efficiently accessing individual memory devices in a chip-scale package stack. The use of a ball grid array chip-scale package architecture in combination with thermally compatible materials decreases the risk of thermal cracking while improving heat dissipation. Moreover, this architecture permits mounting support components, such as capacitors and resistors, on the chip-scale package.