Abstract: A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened underfill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.

Abstract: A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened undefill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.