Patents by Inventor Chi Sheng Wang

Chi Sheng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145569
    Abstract: A semiconductor device includes a field effect transistor (FET). The FET includes a first channel, a first source and a first drain; a second channel, a second source and a second drain; and a gate structure disposed over the first and second channels. The gate structure includes a gate dielectric layer and a gate electrode layer. The first source includes a first crystal semiconductor layer and the second source includes a second crystal semiconductor layer. The first source and the second source are connected by an alloy layer made of one or more Group IV element and one or more transition metal elements. The first crystal semiconductor layer is not in direct contact with the second crystal semiconductor layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yee-Chia YEO, Sung-Li WANG, Chi On CHUI, Jyh-Cherng SHEU, Hung-Li CHIANG, I-Sheng CHEN
  • Publication number: 20240128626
    Abstract: A transmission device includes a daisy chain structure composed of at least three daisy chain units arranged periodically and continuously. Each of the daisy chain units includes first, second and third conductive lines, and first and second conductive pillars. The first and second conductive lines at a first layer extend along a first direction and are discontinuously arranged. The third conductive line at a second layer extends along the first direction and is substantially parallel to the first and second conductive lines. The first conductive pillar extends in a second direction. The second direction is different from the first direction. A first part of the first conductive pillar is connected to the first and third conductive lines. The second conductive pillar extends in the second direction. A first part of the second conductive pillar is connected to the second and third conductive lines.
    Type: Application
    Filed: November 25, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Yu-Kuang WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Huang, Wei-Yu Liao, Chi-Min Chang
  • Publication number: 20240130038
    Abstract: A transmission device for suppressing the glass-fiber effect includes a circuit board and a transmission line. The circuit board includes a plurality of glass fibers, so as to define a fiber pitch. The transmission line is disposed on the circuit board. The transmission line includes a plurality of non-parallel segments. Each of the non-parallel segments of the transmission line has an offset distance with respect to a reference line. The offset distance is longer than or equal to a half of the fiber pitch.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 18, 2024
    Applicants: UNIMICRON TECHNOLOGY CORP., National Taiwan University
    Inventors: Chin-Hsun WANG, Ruey-Beei Wu, Ching-Sheng Chen, Chun-Jui Hung, Wei-Yu Liao, Chi-Min Chang
  • Publication number: 20240127109
    Abstract: A federated learning method includes: providing importance parameters and performance parameters by client devices respectively to a central device, performing a training procedure by the central device, wherein the training procedure includes: selecting target devices from the client devices according to a priority order associated with the importance parameters, dividing the target devices into training groups according to a similarity of the performance parameters, notifying the target devices to perform iterations according to the training groups respectively to generate trained models, transmitting the trained models to the central device, and updating a global model based on the trained models, performing the training procedure again or outputting the global model to the client devices based on a convergence value of the global model and the number of times of performing the training procedure.
    Type: Application
    Filed: November 10, 2022
    Publication date: April 18, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Ping Feng WANG, Chiun Sheng HSU, Chi-Yuan CHOU, Fu-Chiang CHANG
  • Patent number: 11955379
    Abstract: A metal adhesion layer may be formed on a bottom and a sidewall of a trench prior to formation of a metal plug in the trench. A plasma may be used to modify the phase composition of the metal adhesion layer to increase adhesion between the metal adhesion layer and the metal plug. In particular, the plasma may cause a shift or transformation of the phase composition of the metal adhesion layer to cause the metal adhesion layer to be composed of a (111) dominant phase. The (111) dominant phase of the metal adhesion layer increases adhesion between the metal adhesion layer.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Pei-Wen Wu, Chun-I Tsai, Chi-Cheng Hung, Jyh-Cherng Sheu, Yu-Sheng Wang, Ming-Hsing Tsai
  • Publication number: 20240081055
    Abstract: A semiconductor structure includes a substrate. The substrate is divided into a first element region, a second element region and a boundary region. The boundary region is disposed between the first element region and a second element region. A first mask structure covers the first element region. A second mask structure is disposed in the second element region. A logic gate structure is disposed within the second element region.
    Type: Application
    Filed: September 27, 2022
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hsuan-Kai Wang, Chao-Sheng Cheng, Chi-Cheng Huang
  • Publication number: 20230330592
    Abstract: A resource recovery system for reducing carbon dioxide emissions is revealed. Salt is delivered to a first plasma decomposition unit and decomposed into sodium and chlorine. The sodium is sent to a hydrolysis unit and mixed with water to get pure hydrogen and sodium hydroxide which are respectively sent to a power generation unit for power generation and a carbon dioxide absorption unit to react with carbon dioxide from air and produce a mixture of sodium carbonate and sodium bicarbonate. Then the mixture is delivered to an electric heating unit and broken into carbon dioxide and sodium hydroxide. The carbon dioxide is sent to a second plasma decomposition unit and decomposed into carbon and oxygen gas which is delivered to the power generation unit for generating power. Thereby catalysts, power required, and coproducts are obtained during operation of the system. Therefore, the system offers energy, environmental, and economic benefits.
    Type: Application
    Filed: May 31, 2022
    Publication date: October 19, 2023
    Inventor: CHI-SHENG WANG
  • Patent number: 10888142
    Abstract: A synchronous opening and closing structure and a backpack including the same are provided. The synchronous opening and closing structure includes: a first opening and closing structure including a first sliding member and a first tape assembly, wherein the first sliding member is slidably disposed on the first tape assembly so that the first tape assembly is in a closed state or in an open state; a second opening and closing structure including a second sliding member and a second tape assembly, wherein the second sliding member is slidably disposed on the second tape assembly so that the second tape assembly is in the closed state or in the open state; and a connecting structure including a connector connecting the first sliding member and the second sliding member, wherein the connector moves to a first direction and a second direction opposite to the first direction.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: January 12, 2021
    Assignee: UNCLESIGN CO., LTD.
    Inventors: Chi-Sheng Wang, Yao-Yu Wu, Ju-Huai Lin
  • Publication number: 20180184469
    Abstract: A method for wirelessly connecting to an internet, applied for establishing a wireless connection between a mobile device and a plurality of wireless networking devices, the method including: the mobile device searching for the plurality of wireless networking devices via a wireless communication; the mobile device wirelessly connecting with a main controlling device which is one of the plurality of wireless networking devices; the mobile device providing a connection information to the main controlling device for connecting to a base station; and the main controlling device broadcasting the connection information to the other wireless networking devices of the plurality of wireless networking devices; and the main controlling device and the other wireless networking devices of the plurality of wireless networking devices connecting to the base station according to the connection information.
    Type: Application
    Filed: December 28, 2017
    Publication date: June 28, 2018
    Inventors: CHIN-MIN HUANG, MENG-SHIN LEE, KAI-CHUN LIN, CHI-SHENG WANG
  • Patent number: 8899675
    Abstract: A heat ventilating chair includes a backrest unit, a seat unit, and a connecting unit connecting the backrest unit to the seat unit. One of the backrest unit and the seat unit includes a hollow member having an air pump, a pressure valve, and a channel that communicates fluidly the air pump and the pressure valve. The connecting unit is connected between the air pump and the other one of the backrest unit and the seat unit. The connecting unit drives the air pump to expel hot air in the channel to the ambient via the pressure valve when the backrest unit is forced to incline rearward. The connecting unit drives the air pump to draw ambient cool air into the channel via the pressure valve when the backrest unit is restored from a rearwardly inclined state.
    Type: Grant
    Filed: November 2, 2011
    Date of Patent: December 2, 2014
    Assignee: I-Shou University
    Inventors: Tai-Hsi Wu, Yi-Hao Chang, Chi-Sheng Wang, Kuo-Liang Lin
  • Publication number: 20130106149
    Abstract: A heat ventilating chair includes a backrest unit, a seat unit, and a connecting unit connecting the backrest unit to the seat unit. One of the backrest unit and the seat unit includes a hollow member having an air pump, a pressure valve, and a channel that communicates fluidly the air pump and the pressure valve. The connecting unit is connected between the air pump and the other one of the backrest unit and the seat unit. The connecting unit drives the air pump to expel hot air in the channel to the ambient via the pressure valve when the backrest unit is forced to incline rearward. The connecting unit drives the air pump to draw ambient cool air into the channel via the pressure valve when the backrest unit is restored from a rearwardly inclined state.
    Type: Application
    Filed: November 2, 2011
    Publication date: May 2, 2013
    Applicant: I SHOU UNIVERSITY
    Inventors: Tai-Hsi Wu, Yi-Hao Chang, Chi-Sheng Wang, Kuo-Liang Lin
  • Patent number: 6305951
    Abstract: An electrical connector assembly includes a first connector (1), a guiding spacer (12) and a second connector (2). The first connector has a first housing (10) receiving two rows of first contacts (14) therein. A pair of guiding posts (106) is formed on opposite ends of a top wall (105) of the first housing for fitting into grooves (32) defined in a mating media storage device (3). The spacer includes a rectangular top wall (121) and four side walls (123) defining a chamber (120) therebetween for accommodating the second connector therein. Each first contact engages with a second contact (22) of the second connector, the second contact being soldered to a printed circuit board (4) of an electronic device. A supporting wall (124) projects upwardly from a longitudinal side of the rectangular top wall for abutting against a rear end of the top wall of the first housing.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 23, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Yueh-Shan Shih, Chi-Sheng Wang
  • Patent number: 6302710
    Abstract: An electrical connector assembly comprises a first connector(1) and a second connector (2). The first connector comprises an upper housing(10) having a main body (101), and a lower housing (12). The lower housing has a body board (120) with a plurality of recesses (124) on opposite sides thereof, and a plurality of first contacts (14). Each recess defines a depression (126) at an end thereof. Each first contact includes a flat leg (144) received in the recess with a projection (146) received in the depression, and a pair of protrusions (147) interferingly engaging with sides of the recess. The second connector comprises a housing (20) having a slot (204) and a plurality of second contacts (22). The body board is adapted to extend into the slot and support reliable engagement of the legs of the first contacts with mating portions (220) of the second contacts.
    Type: Grant
    Filed: December 13, 2000
    Date of Patent: October 16, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Chi-Sheng Wang, Yueh-Shan Shih
  • Patent number: 6280247
    Abstract: Two solder pads both having a horizontal solder tab therein and a vertical positioning leg used to mount a surface mounted electrical connector to a printed circuit board. The electrical connector comprises an elongated insulative housing having a holding cavity at each side thereof. Each of a plurality of terminals secured in the plurality of receiving channels of the insulative housing includes an engaging portion and a solder tail. Each solder pad includes an L-shaped body and a positioning leg downwardly extending from the L-shaped body. The L-shaped body comprises a vertical body portion and a horizontal solder tab for respectively engaging with the holding cavity of the insulative housing and being soldered to the printed circuit board. The positioning leg extends through a hole of the printed circuit board, where it, too, is soldered, thus adding strength to the board between the connector and the printed circuit board.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: August 28, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jerry Wu, Chi Sheng Wang
  • Patent number: 6227875
    Abstract: A connector assembly includes a pair of connectable first and second connectors for respectively connecting with a disk drive and a PCB in a portable computer casing thereby vertically mounting the disk drive on the PCB and interconnecting the disk drive with the PCB. The first connector defines an upper row and a lower row of first passageways with first terminals retained therein. Each first terminal includes a pair of inwardly inclined first contact arms for mating with a corresponding pin of the disk drive, and a right-angle bent first tail portion retained in recesses of an intermediate plate and downwardly extending therefrom for connecting with the second connector. The second connector defines two rows of second passageways with second terminals retained therein.
    Type: Grant
    Filed: December 27, 1999
    Date of Patent: May 8, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jerry Wu, Chi Sheng Wang, Kelly Shih
  • Patent number: 5193942
    Abstract: An improved method and device to prevent erosion of slurry transport devices is disclosed which uses liquid injection to prevent contact by the slurry composition with the inner surface of the walls of the transport system. A non-abrasive liquid is injected into the slurry transport system and maintains intimate contact with the entire inner surface of the transport system, thereby creating a fluid barrier between the non-abrasive liquid and the inner surface of the transport system which thereby prevents erosion.
    Type: Grant
    Filed: January 16, 1991
    Date of Patent: March 16, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventors: Gregory F. Berry, Robert W. Lyczkowski, Chi-Sheng Wang
  • Patent number: D787233
    Type: Grant
    Filed: February 11, 2016
    Date of Patent: May 23, 2017
    Inventor: Chi-Sheng Wang