Abstract: A method of orthopedic treatment includes steps of: by using a computer aided design (CAD) tool based on profile data that is related to a to-be-treated part of a bone of a patient, obtaining a model of a preliminary instrument that substantially fits the to-be-treated part; by using the CAD tool, obtaining a model of a patient specific instrument (PSI) based on the model of the preliminary instrument; producing the PSI based on the model of the PSI, the PSI being adjustable; performing medical operation on the to-be-treated part, and then attaching the PSI to the to-be-treated part; after attaching the PSI to the to-be-treated part, adjusting the PSI such that the PSI is adapted to real conditions of the to-be-treated part.

Abstract: The invention provides a radio frequency (RF) module and associated method with envelope tracking (ET) power supply in a device. The RF module may comprise a plurality of transmitters, an ET output, and an ET multiplexer. Each said transmitter may comprise an ET port and one or more RF outputs, and may be configured for providing an RF signal to one of said one or more RF outputs, and providing an ET signal, which reflects an envelope of the RF signal, to the ET port. The ET multiplexer may be coupled between said ET ports of the plurality of transmitters and the ET output, for selectively relaying one of said ET ports to the ET output.

Abstract: The invention provides a radio frequency (RF) module and associated method with envelope tracking (ET) power supply in a device. The RF module may comprise a plurality of transmitters, an ET output, and an ET multiplexer. Each said transmitter may comprise an ET port and one or more RF outputs, and may be configured for providing an RF signal to one of said one or more RF outputs, and providing an ET signal, which reflects an envelope of the RF signal, to the ET port. The ET multiplexer may be coupled between said ET ports of the plurality of transmitters and the ET output, for selectively relaying one of said ET ports to the ET output.

Abstract: An RF signal processing device includes multiple first signal receive paths receiving multiple first signals, multiple second signal receive paths receiving multiple second signals and a radio transceiver. The radio transceiver includes a first signal-processing circuit designed for processing the first signals, a second signal-processing circuit designed for processing the second signals, multiple first receive ports coupled to the first signal-processing circuit, multiple second receive ports coupled to the second signal-processing circuit, a first switch and a tunnel device. The first switch is coupled between at least one first receive port and the first signal-processing circuit. The tunnel device is coupled between the first switch and the second signal-processing circuit. The at least one first receive port coupled to the first switch is utilized to receive the first signal or the second signal.

Abstract: An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.

Abstract: An electronic device includes a circuit board. The circuit board includes a power amplifier footprint configured for mounting a first power amplifier or a second power amplifier thereon. The power amplifier footprint includes a first part and a second part. The first part includes multiple I/O pads. When the first power amplifier is mounted on the circuit board, the I/O pads in the first part are coupled to the first power amplifier. The second part includes multiple I/O pads. When the second power amplifier is mounted on the circuit board, both the I/O pads in the first part and the I/O pads in the second part are coupled to the second power amplifier.