Abstract: A light-emitting device includes a substrate including a top surface; a semiconductor stack including a first semiconductor layer, an active layer and a second semiconductor layer formed on the substrate, wherein a portion of the top surface is exposed; a distributed Bragg reflector (DBR) formed on the semiconductor stack and contacting the portion of the top surface of the substrate; a metal layer formed on the distributed Bragg reflector (DBR), contacting the portion of the top surface of the substrate and being insulated with the semiconductor stack; and an insulation layer formed on the metal layer and contacting the portion of the top surface of the substrate.

Abstract: A light-emitting device comprises a substrate comprising a top surface; a plurality of light-emitting units formed on the top surface of the substrate comprising a first light-emitting unit, a second light-emitting unit, and one or a plurality of third light-emitting units, wherein each of the plurality of light-emitting units comprises a first semiconductor layer, an active layer and a second semiconductor layer; an insulating layer comprising a first insulating layer opening and a second insulating layer opening formed on each of the plurality of light-emitting units; a first extension electrode covering the first light-emitting unit, wherein the first extension electrode covers the first insulating layer opening on the first light-emitting unit without covering the second insulating layer opening on the first light-emitting unit; a second extension electrode covering the second light-emitting unit, wherein the second extension electrode covers the second insulating layer opening on the second light-emittin

Abstract: A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract: A rigid flex circuit board is provided, including a flexible circuit board, which includes a core layer, first and second cover layers, first and second bonding layers, first and second dielectric layers, and first and second superposition layers. The core layer includes first and second core circuit layers. The first and second cover layers cover a portion of the first and second core circuit layers. The first and second bonding layers cover a portion of the first and second cover layers. The first and second dielectric layers cover a portion of the first and second core circuit layers and the first and second cover layers. The first superposition layer is disposed on the first bonding layer and the first dielectric layer, and the second superposition layer is disposed on the second bonding layer and the second dielectric layer.

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract: A rail joint for interconnecting two successive rail bars of a railroad track includes longitudinally aligned first and second guide rails. Each of the guide rails has a mounting end adapted to be secured to a respective one of adjacent end portions of the rail bars, a distal end opposite to the mounting end and spaced from the distal end of the other one of the guide rails at an expansible space, and a downwardly and longitudinally extending dovetail projection. A connector is adapted to be fixed on the railroad track and is formed with an upwardly opening and longitudinally extending dovetail groove for receiving fittingly the dovetail projections of the guide rails therein so as to maintain alignment of the guide rails.

Abstract: A grinding apparatus includes a frame, a first grinding assembly mounted on the frame for rotating about a vertical axis and a second grinding assembly supported on the frame and sleeved around the first grinding assembly. The first grinding assembly has a substantially truncated cone-shaped member with an external frusto-conical grinding surface. The truncated cone-shaped member is tapered upward. The second grinding assembly has an internal frusto-conical grinding surface to contact the external frusto-conical grinding surface of the truncated cone-shaped member for grinding. A driving device is provided for rotating the first grinding assembly about the vertical axis with respect to the second grinding assembly.

Abstract: The disclosure herein describes an air-cleaning apparatus which comprises a frame support in the form of a rectangular hollow body including a first lateral wall having an inlet adapted for receiving exhaust and a second lateral wall opposite to the first lateral wall having an outlet for expelling cleaned exhaust; at least one filtering member removably inserted between the first and second lateral walls, which has a plurality of suitably dimensioned perforations formed therein, means for supplying a cleaning liquid, said means enabling said cleaning liquid to flow against said filtering member and spread over said perforations; and means for collecting said cleaning liquid. When a stream of the cleaning liquid is spread over the filtering member, a liquid film is effectively formed on the perforations therein, which will efficiently remove any pollutants existing in the exhaust so as to prevent air pollution from resulting therefrom.

Abstract: A grinding apparatus includes a frame, a driving device mounted in the frame, and an upper and a lower grinding member mounted coaxially on a vertical axis on the frame. One of the upper and lower grinding members is rotated by the driving device. The upper grinding member is movable in an upward and a downward direction. Each of the upper and lower grinding members has a grinding disc with a central opening, a disc seat holding the grinding disc, and a shaft carrying the disc seat. The grinding surface of the grinding disc of the uper grinding member is concave and the grinding surface of the grinding disc of the lower grinding member is convex so that both of the grinding surfaces of the grinding discs can come into snug contact with each other. A guiding device is provided for guiding the shaft of the upper grinding member which permits the upper grinding member to move vertically but prevents the same from lateral movement.