Abstract: A vapor chamber includes an upper casing, a lower casing, a support member, a wick material and a working fluid. The support member is formed of a plurality of ribs connected with each other, and a plurality of surrounded spaces are formed and regularly arranged between the ribs. Each rib has an upper abutting end and a lower abutting end. By the interconnection of the upper abutting ends and the lower abutting ends of the ribs, the ribs are inclined and each has a relatively higher end and a relatively lower end, so that a plurality of subspaces are respectively formed under the body of each rib close to the upper abutting end and above the body of each rib close to the lower abutting end, and the subspaces are in communication with the surrounded spaces between the ribs.

Abstract: A micro heat pipe includes a pipe body, a second capillary structure disposed inside the pipe body, and a working fluid injected into the pipe body. The pipe body has two enclosed ends and is defined with a heat absorbing section, a heat isolating section and a condensing section. The pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the aforementioned sections. The heat absorbing section is filled up with the second capillary structure. The micro heat pipe is manufactured in a way that the inner pipe wall of the pipe body is etched to form the first capillary structure, the second capillary structure is filled in the heat absorbing section and then sintered, the working fluid is injected into the pipe body, and the pipe body is vacuumed and sealed.

Abstract: A micro heat pipe includes a pipe body, a second capillary structure disposed inside the pipe body, and a working fluid injected into the pipe body. The pipe body has two enclosed ends and is defined with a heat absorbing section, a heat isolating section and a condensing section. The pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the aforementioned sections. The heat absorbing section is filled up with the second capillary structure. The micro heat pipe is manufactured in a way that the inner pipe wall of the pipe body is etched to form the first capillary structure, the second capillary structure is filled in the heat absorbing section and then sintered, the working fluid is injected into the pipe body, and the pipe body is vacuumed and sealed.

Abstract: A vapor chamber includes an upper casing, a lower casing, a support member, a wick material and a working fluid. The support member is formed of a plurality of ribs connected with each other, and a plurality of surrounded spaces are formed and regularly arranged between the ribs. Each rib has an upper abutting end and a lower abutting end. By the interconnection of the upper abutting ends and the lower abutting ends of the ribs, the ribs are inclined and each has a relatively higher end and a relatively lower end, so that a plurality of subspaces are respectively formed under the body of each rib close to the upper abutting end and above the body of each rib close to the lower abutting end, and the subspaces are in communication with the surrounded spaces between the ribs.

Abstract: A LED lamp having a good heat-dissipating function includes a thermal radiator of solid metal including a top surface downwardly sloping from a peak point thereof to the border, a plurality of granular bumps raised from the top surface and defining a plurality of flow paths thereamong, a recess curved inwardly from a bottom surface thereof, an eave surrounding the recess and an inner slope located at the inner side of the eave and obliquely upwardly extended from the lowest edge of the eave to the recess, a vapor chamber bonded with the top surface thereof to the bottom surface of the recess, a circuit module bonded with the top surface thereof to the bottom surface of the vapor chamber, and a LED unit mounted at the bottom surface of the circuit module.

Abstract: A LED lamp having a good heat-dissipating function includes a thermal radiator of solid metal including a top surface downwardly sloping from a peak point thereof to the border, a plurality of granular bumps raised from the top surface and defining a plurality of flow paths thereamong, a recess curved inwardly from a bottom surface thereof, an eave surrounding the recess and an inner slope located at the inner side of the eave and obliquely upwardly extended from the lowest edge of the eave to the recess, a vapor chamber bonded with the top surface thereof to the bottom surface of the recess, a circuit module bonded with the top surface thereof to the bottom surface of the vapor chamber, and a LED unit mounted at the bottom surface of the circuit module.

Abstract: A heat-dissipating device includes a hermetic container, a metallic sheet, and two metallic nets. The hermetic container contains a liquid working medium and has an internal top side and an internal bottom side. The metallic sheet is mounted inside the hermetic container, having a plurality of pores running therethrough and a plurality of support pieces protruding outward from its upper and lower surfaces respectively. The two metallic nets are supported by the support pieces to contact against the internal top and bottom sides of the hermetic container.

Abstract: A method of making a length of heat conduction pipe from a long conduction pipe filled with heat transfer medium in vacuum environment comprises: a material preparation step in which a long heat conduction pipe with predetermined length sealed at both ends is prepared, a squelching and cutting step in which squelching and cutting is conducted on pre-determined point of said long heat conduction pipe in vacuum environment; a sealing step by which the cut end of said long heat conduction pipe is brazed and sealed in vacuum. There also provides an equipment for performing the method.

Abstract: A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method.

Abstract: This invention declares a heat transfer device combined a flatten loop heat pipe with a vapor chamber, in which the loop heat pipe has an evaporator and a condenser, and the vapor chamber is on the evaporation part of the loop heat pipe evaporator. Metal mesh is coating on the inside surface of the vapor chamber, and coating a metal plate with vent holes on it and with supports on the both side. Working fluid is filled into the vapor chamber. Besides the advanced heat transfer characteristics of the flatten loop heat pipe, this invention has an additional advantage from the vapor chamber, which could spread the high heat flux hot spot on the chips quickly to reduce the temperature of the chips and give the chips an advantage of higher density of integration and higher running speed.

Abstract: A flat loop heat pipe is formed of a first capillary core, a second capillary core, a first support member, and a second support member. The first capillary core and the first support member constitute an evaporation room. The second capillary core and the second support member constitute a compensation room. In light of this structure, it is not difficult to activate circulation of thermal dissipation under low-watt heat source and the first capillary core can avoid dry-out phenomenon.

Abstract: A quick temperature-equalizing heat-dissipating device includes a hermetic container, a metallic sheet, and two metallic nets. The hermetic container contains a liquid working medium and has an internal top side and an internal bottom side. The metallic sheet is mounted inside the hermetic container, having a plurality of pores running therethrough and a plurality of support pieces protruding outward from its upper and lower surfaces respectively. The two metallic nets are supported by the support pieces to contact against the internal top and bottom sides of the hermetic container. Accordingly, the heat-dissipating device is based on the aforesaid heat-dissipating structure and the principle of working medium liquid phase transition to quickly equally dissipate the high heat flow density of an electronic component.

Abstract: A heat-dissipating device without any injection pipe, which includes an upper cover plate and a lower cover plate. The upper cover plate is combined with the lower cover plate, wherein a crevice and an internal space are formed between the upper and lower cover plates. The crevice is sealed by where the upper and lower cover plates are close to the crevice by high-temperature autogenous welding to become a flat sealed surface flush with the surfaces of the upper and lower cover plates. Accordingly, the heat-dissipating device is provided with enhanced reliability and heat-dissipating efficiency. A method of making the heat-dissipating device includes the steps of putting the upper and lower cover plates together by welding; injecting a liquid working medium through the crevice into the internal space; and sealing the crevice by high-speed welding under a vacuum environment.

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract: This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.

Abstract: A method of making a length of heat conduction pipe from a long conduction pipe filled with heat transfer medium in vacuum environment comprises: a material preparation step in which a long heat conduction pipe with predetermined length sealed at both ends is prepared, a squelching and cutting step in which squelching and cutting is conducted on pre-determined point of said long heat conduction pipe in vacuum environment; a sealing step by which the cut end of said long heat conduction pipe is brazed and sealed in vacuum. There also provides an equipment for performing the method.

Abstract: This invention relates to a type of loop heat conducting device, comprising an evaporator and a condenser which are connected together by means of a loop pipe, in order to form a cyclic loop for a liquid working medium, wherein the evaporator has a wick network core, and multiple tunnels are formed on the wick network core, and one end of the tunnels converges at a vapor chamber and is connected to a loop pipe to form a gaseous working medium outlet, and the terminal end of the pipe extends into and comes into contact with the internal part of the wick network core, and a compensation chamber for liquid working medium is formed on the upper section of the wick network core. Consequently, the cyclic loop that separates the gas and liquid enables the optimal heat dissipation capacity, and also has a structure that is simplified, thereby allowing for easy mass production.

Abstract: A planar micro parallel-link mechanism that provides fine planar motion to a platform in two translation directions and one rotation direction using comb-drive actuators with gear chain systems coupled to rack-and-pinions and struts. The micro parallel-link mechanism has a large operating envelope and can be fabricated using surface micromachining techniques. The kinematic and dynamic analyses of the micro parallel-link mechanism are integrated with closed-loop control system to monitor and supervise the position and velocity of the micro mechanism with three degree-of freedom motions. Methods of depositing and building miniaturized tools and parts on the platform are also disclosed to provide the basic building block for a number of products applicable for nano technology, sensor, actuators, and biotechnology applications.

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract: A micro heat spreader having an inside vacuum chamber, a bottom recess in the bottom wall thereof, a filling hole formed in the bottom recess in fluid communication with the inside vacuum chamber, a fluid filled into the inside vacuum chamber, and a bronze stopper fastened to the bottom recess to seal the filling hole and maintained in flush with the bottom wall.