Patents by Inventor Chi Teng

Chi Teng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for maching a wafer
    Publication number: 20060281282
    Abstract: The present invention relates to a method for machining a wafer, comprising: (a) providing a wafer having an active surface and a backside surface; (b) attaching a plate substrate to the active surface of the wafer; (c) grinding the backside surface of the wafer; (d) removing the plate substrate; and (e) sawing the wafer. Therefore, warping of the thin wafer can be avoided.
    Type: Application
    Filed: June 6, 2006
    Publication date: December 14, 2006
    Inventors: Fu Chu, Chi Chung, Chi Teng