Patents by Inventor Chi-Tsong Chen

Chi-Tsong Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Patent number: 8232382
    Abstract: This invention relates to a number of bird sex-identification oligonucleotides and their use in determining the sex of birds in various families.
    Type: Grant
    Filed: December 19, 2008
    Date of Patent: July 31, 2012
    Assignee: Academia Sinica
    Inventors: Lucia Liu Severinghaus, Lih-Chiann Wang, Chi-Tsong Chen
  • Publication number: 20090203539
    Abstract: This invention relates to a number of bird sex-identification oligonucleotides and their use in determining the sex of birds in various families.
    Type: Application
    Filed: December 19, 2008
    Publication date: August 13, 2009
    Applicant: Academia Sinica
    Inventors: Lucia Liu Severinghaus, Lih-Chiann Wang, Chi-Tsong Chen