Patents by Inventor Chi-Tung LAI

Chi-Tung LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210375645
    Abstract: A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: Ming-Chieh HSU, Yung-Long CHEN, Fang-Pin CHIANG, Feng-An YANG, Ching-Jung HSU, Chi-Tung LAI
  • Patent number: 10814455
    Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: October 27, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
  • Publication number: 20170320193
    Abstract: Disclosed herein is a method of providing slurry to a chemical mechanical planarization (CMP) station. The method includes the operations of: mixing slurry, water and a chemical to form dilute slurry; measuring a surface tension of the dilute slurry; supplying the dilute slurry to a CMP station through piping; and modulating a flow rate of the dilute slurry in the piping in accordance with the measured surface tension.
    Type: Application
    Filed: July 27, 2017
    Publication date: November 9, 2017
    Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG
  • Patent number: 9744642
    Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: August 29, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Huang Chen, Wei-Cheng Li, Chi-Tung Lai, Yung-Ti Hung
  • Publication number: 20150117135
    Abstract: A slurry feed system includes a valve manifold, a mixing tank, a slurry feed pump, a surface tension meter and suction piping, discharge piping as well as slurry return piping. The valve manifold includes inlet piping, outlet piping fluidly coupled to the inlet piping, and a slurry discharge header for supplying slurry to CMP stations. The slurry feed pump is connected to the mixing tank by the suction piping. The discharge piping is routed from the slurry feed pump to the inlet piping of the valve manifold. The slurry return piping is routed from the outlet piping of the valve manifold to the mixing tank. The suction piping, the discharge piping, the inlet piping, the outlet piping and the slurry return piping define a first slurry supply loop. The surface tension meter is coupled to the first slurry supply loop.
    Type: Application
    Filed: October 29, 2013
    Publication date: April 30, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Huang CHEN, Wei-Cheng LI, Chi-Tung LAI, Yung-Ti HUNG