Abstract: An electrical assembly that with an inverter that is mounted to the field windings of a stator. The inverter has a plurality of power semiconductor packages (PSP), each of which including a semiconductor die, a plurality of electric terminals, which are electrically coupled to the semiconductor die, and a heat sink with a base, which is fixedly and electrically coupled to one of the electric terminals, and a plurality of fins that extend axially from the base in a direction away from the semiconductor die. The PSP's are arranged in a circumferentially spaced apart manner. The fins are arranged in rows and are progressively longer in length from a radially-inner most fin to a radially-outer most fin. Slots are formed in the base on a radially-inner side of the base. Each slot extends toward a radially-outer side of the base and intersects a corresponding one of the rows of fins.

Abstract: An electrical assembly that includes a semiconductor die, a heat sink and a case. The semiconductor die includes a power semiconductor device with a plurality of terminals, and a plurality of electrically conductive leads. Each of the electrically conductive leads is electrically coupled to an associated one of the terminals on the power semiconductor device. The heat sink has a base, a mount, and a plurality of fins. The mount extends from a first side of the base and is coupled to the semiconductor die. The fins are fixedly coupled to the base and extend from a second side of the base that is opposite the first side of the base. The case is formed of a first electrically insulating material. A first one of the leads is integrally and unitarily formed with the mount.