Abstract: A process for fabricating a cavity-type integrated circuit package. The process includes: supporting an interior portion of each of a plurality of leads, in a mold; supporting a die attach pad in said mold; molding a package body in said mold such that said leads extend from an interior cavity of said package body to an exterior thereof; mounting a semiconductor die to said die attach pad; wire bonding various ones of said leads to said semiconductor die; adding a fill material for covering at least a surface of said interior portion of said leads; and mounting a lid on said package body for enclosing said die in said cavity of said package body.

Abstract: The present invention discloses an integrated circuit (IC) driver chip for electroluminescent (EL) device, including an EL display-data-control block (DCB) and an EL display-segment-driver block (SDB), wherein said DCB stores the data for display and generates data-control-pulses for the EL segment display; and said SDB receives the data from the DCB and then drives the EL segments to display the desired information in real-time. This integrated circuit driver chip is suitable to be used to control and drive a multiple segment EL display. The applications of the IC include, but are not limited to, the display alphanumeric digits and image information. By cascading multiple IC driver chips together, it is possible to enlarge the number of display segments.