Abstract: A fingerprint flash drive includes a circuit board, an enclosure and a fingerprint recognizer. The enclosure encloses the circuit board. An insertion direction of the fingerprint flash drive is defined as a front-to-rear direction. The enclosure has a top surface extending along the insertion direction of the fingerprint flash drive, and a front surface connected with a front edge of the top surface. The front surface and the top surface of the enclosure are noncoplanar. A rear end of the enclosure cooperates with the circuit board to form a plug. The fingerprint recognizer is electrically connected with the circuit board and fastened to the front surface of the enclosure. A front surface of the fingerprint recognizer is exposed outside.

Abstract: A fingerprint sensor having electrostatic discharge (ESD) protection includes a first ESD protection electrode and a second ESD protection electrode. The first ESD protection electrode is connected to an ESD protection circuit for providing an ESD path, where the first ESD protection electrode and a fingerprint sensor electrode array are formed in a same layer of the fingerprint sensor. The second ESD electrode is connected to the first ESD electrode via multiple conductive via.

Abstract: Vertical gate all around (VGAA) devices and methods of manufacture thereof are described. A method for manufacturing a VGAA device includes: exposing a top surface and sidewalls of a first portion of a protrusion extending from a doped region, wherein a second portion of the protrusion is surrounded by a gate stack; and enlarging the first portion of the protrusion using an epitaxial growth process.

Abstract: The present invention provides antibodies or the antigen-binding portion thereof, that bind to one or more carbohydrate antigens. Also disclosed herein are pharmaceutical pharmaceutical compositions and methods for the inhibition of cancer cells in a subject in need thereof. The pharmaceutical compositions comprise an antibody or an antigen-binding portion thereof and at least one pharmaceutically acceptable carrier.

Abstract: An method for capturing images using a capturing apparatus including determining whether a moiré pattern exists in a preview image captured by a camera device. A capturing parameter of the camera device is adjusted when the moiré pattern exists in the preview image. The camera device is controlled to capture images when the capturing parameter has been adjusted.

Abstract: A sensing device includes a first III-V compound stack and a second III-V compound stack. The first III-V compound stack has a first sensing area, and the second III-V compound stack has a second sensing area. A passivation layer fully covers the second sensing area. The first III-V compound stack is physically separated from the second III-V compound stack, and has material compositions and structures same as the second III-V compound stack.

Abstract: An electronic device includes a main body, a first back cover and a second back cover. The main body includes a first surface and a second surface opposite to the first surface. A display is mounted onto the first surface. The first back cover is disposed on the second surface and rotatable about a first axis. The first back cover can be lifted along a first direction by rotating about the first axis. The second back cover is disposed on the second surface and rotatable about a second axis. The second back cover can be lifted along a second direction by rotating about the second axis.

Abstract: A manufacturing method of a package-on package structure including at least the following steps is provided. A die is bonded on a first circuit carrier. A spacer is disposed on the die. The spacer and the first circuit carrier are connected through a plurality of conductive wires. An encapsulant is formed to encapsulate the die, the spacer and the conductive wires. A thickness of the encapsulant is reduced until at least a portion of each of the conductive wires is removed to form a first package structure. A second package structure is stacked on the first package structure. The second package structure is electrically connected to the conductive wires.

Abstract: A chip package structure includes a redistribution layer, at least one chip, a reinforcing frame, an encapsulant and a plurality of solder balls. The redistribution layer includes a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the redistribution layer. The reinforcing frame is disposed on the first surface and includes at least one through cavity. The chip is disposed in the through cavity and a stiffness of the reinforcing frame is greater than a stiffness of the redistribution layer. The encapsulant encapsulates the chip, the reinforcing frame and covering the first surface. The solder balls are disposed on the second surface and electrically connected to the redistribution layer.

Abstract: A chip package structure includes a substrate, a chip, an encapsulant, a plurality of solder balls and a patterned metal layer. The substrate includes a first surface and a second surface opposite to each other. The chip is disposed on the first surface and electrically connected to the substrate. The encapsulant encapsulates the chip and covering the first surface. The solder balls are disposed on the second surface and electrically connected to the substrate. The patterned metal layer s disposed on the encapsulant. The patterned metal layer includes at least one concave portion and at least one convex portion defined by the concave portion. The convex portion faces the encapsulant. The adhesion layer is disposed between the patterned metal layer and the encapsulant. The adhesion layer is filled in the concave portion.

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a circuit carrier, a substrate, a die, a plurality of conductive wires and an encapsulant. The substrate is disposed on the circuit carrier and includes a plurality of openings. The die is disposed between the circuit carrier and the substrate. The conductive wires go through the openings of the substrate to electrically connect between the substrate and the circuit carrier. The encapsulant is disposed on the circuit carrier and encapsulates the die, the substrate and the conductive wires.

Abstract: An in-cell touch liquid crystal panel and an array substrate thereof, and the array substrate includes a glass substrate and three metal layers, and a common electrode layer that are sequentially formed on the glass substrate and are insulated with each other. A plurality of scan lines are disposed in the second metal layer, a plurality of connection wirings are disposed in the third metal layer, and a common electrode layer is divided into a plurality of touch control inductive electrodes that are electrically connected to a touch control detection chip through the connection wirings. A plurality of metal lines are disposed in the second metal layer, the metal lines and the scan lines are insulated with each other, and two ends of each metal line are electrically connected to the connection wiring.

Abstract: A method of forming a package-on-package (POP) structure is provided. A laser drilling is performed on a mold compound of a first semiconductor package to form a plurality of through holes in the mold compound. A conductive layer is formed on the mold compound such that the mold compound is covered by a conductive material and the through holes are filled with the conductive material. The layer of the conductive material is grinded to expose the mold compound. A second semiconductor package is stacked on the first semiconductor package such that a plurality of metal bumps of the second semiconductor package attach to the conductive material filled in the through holes.

Abstract: A manufacturing method of a POP structure including at least the following steps is provided. A first package structure is formed and a second package structure is formed on the first package structure. The first package structure includes a circuit carrier and a die disposed on the circuit carrier. Forming the first package structure includes providing a conductive interposer on the circuit carrier, encapsulating the conductive interposer by an encapsulant and removing a portion of the encapsulant and the plate of the conductive interposer. The conductive interposer includes a plate, a plurality of conductive pillars and a conductive protrusion respectively extending from the plate to the circuit carrier and the die. The conductive protrusion disposed on the die, and the conductive pillars are electrically connected to the circuit carrier. The second package structure is electrically connected to the first package structure through the conductive interposer.

Abstract: A chip package structure including a substrate, a first chip, a frame, a plurality of first conductive connectors, a first encapsulant, and a package is provided. The first chip is disposed on the substrate. The first chip has an active surface and a back surface opposite to the active surface, and the active surface faces the substrate. The frame is disposed on the back surface of the first chip and the frame has a plurality of openings. The first conductive connectors are disposed on the substrate and the first conductive connectors are disposed in correspondence to the openings. The first encapsulant is disposed between the substrate and the frame and encapsulates the first chip. The package is disposed on the frame and is electrically connected to the substrate via the first conductive connectors.

Abstract: A driving method for a liquid crystal panel is disclosed. Wherein, the driving method includes: (A) at a moment of switching from a normal display time stage to a touch scanning time stage in a current frame, applying a first over driving voltage to a common electrode of each pixel of a liquid crystal panel; and (B) at a moment of switching from the touch scanning time stage in the current frame to a normal display time stage of a next frame, applying a second over driving voltage to the common electrode of each pixel. According to the method described above a time that the common electrode reaches a present level voltage is shorten in order to effectively improve the poor display and touch problem caused by signal abnormality at moments of switching between a normal display and a touch scanning in an in-cell touch panel.

Abstract: A palette wet keeper in which a palette on which oil color or acrylic color is squeezed to be used is put into a box, the box is vacuumized to block a contact of air, and thus prevents a hardening of the oil color or acrylic color.

Abstract: An improved loss recovery method for coding streaming media classifies each data unit in the media stream as an independent data unit (I unit), a remotely predicted unit (R unit) or a predicted data unit (P unit). Each of these units is organized into independent segments having an I unit, multiple P units and R units interspersed among the P units. The beginning of each segment is the start of a random access point, while each R unit provides a loss recovery point that can be placed independently of the I unit. This approach separates the random access point from the loss recovery points provided by the R units, and makes the stream more impervious to data losses without substantially impacting coding efficiency. The most important data units are transmitted with the most reliability to ensure that the majority of the data received by the client is usable. The I units are the least sensitive to transmission losses because they are coded using only their own data.

Abstract: A display device including a display panel and an optical element is provided. The optical element is disposed on one side of the display panel. At least one portion of the optical element overlaps a display area of the display panel. An area of the optical element which is exposed and does not overlap the display area functions as an appearance area. Therefore, the appearance area of the optical element may be seen by a user from outward appearance of the display device. Brand trademarks, ambient light, touch buttons, and other patterns may be displayed through the appearance area. Therefore, a backlight module may be decorative or perform other additional functions besides functioning as a light source.

Abstract: A charged particle multi-beam lithography system includes an illumination sub-system that is configured to generate a charged particle beam; and multiple plates with a first aperture through the plates. The plates and the first aperture are configured to form a charged particle doublet. The system further includes a blanker having a second aperture whose footprint is smaller than that of the first aperture. The charged particle doublet is configured to demagnify a portion of the charged particle beam passing through the first aperture, thereby producing a demagnified beamlet. The blanker is configured to receive the demagnified beamlet from the charged particle doublet, and is further configured to conditionally allow the demagnified beamlet to travel along a desired path.