Abstract: A method of manufacturing an integrated circuit includes adjusting a first spacing between an adjacent pair of routing tracks in a first set of routing tracks to be equal to a second spacing, adjusting a third spacing between an adjacent pair of routing tracks in a second set of routing tracks to be equal to a fourth spacing, placing a first and second pair of conductive patterns on the corresponding first and second set of routing tracks, forming a first set of conductive structures based on the first pair of conductive patterns, and a second set of conductive structures based on the second pair of conductive patterns. A first and second cell have a same cell height that is a non-integer multiple of a minimum pitch. One spacing of a first set of spacings is different from another spacing of the first set of spacings.

Abstract: A method of manufacturing an integrated circuit includes adjusting a first spacing between an adjacent pair of routing tracks in a first set of routing tracks to be equal to a second spacing, adjusting a third spacing between an adjacent pair of routing tracks in a second set of routing tracks to be equal to a fourth spacing, placing a first and second pair of conductive patterns on the corresponding first and second set of routing tracks, forming a first set of conductive structures based on the first pair of conductive patterns, and a second set of conductive structures based on the second pair of conductive patterns. A first and second cell have a same cell height that is a non-integer multiple of a minimum pitch. One spacing of a first set of spacings is different from another spacing of the first set of spacings.

Abstract: A method of manufacturing an integrated circuit includes generating a layout of a first and a second cell, adjusting a first spacing between an adjacent pair of routing tracks in a first set of routing tracks to be equal to a second spacing, adjusting a third spacing between an adjacent pair of routing tracks in a second set of routing tracks to be equal to a fourth spacing, placing a first pair of conductive patterns on the first set of routing tracks, placing a second pair of conductive patterns on the second set of routing tracks, forming a first set of conductive structures based on the first pair of conductive patterns, and forming a second set of conductive structures based on the second pair of conductive patterns. The first and second cell have a same cell height that is a non-integer multiple of a minimum pitch.

Abstract: A method of manufacturing an integrated circuit includes generating a layout of a first and a second cell, adjusting a first spacing between an adjacent pair of routing tracks in a first set of routing tracks to be equal to a second spacing, adjusting a third spacing between an adjacent pair of routing tracks in a second set of routing tracks to be equal to a fourth spacing, placing a first pair of conductive patterns on the first set of routing tracks, placing a second pair of conductive patterns on the second set of routing tracks, forming a first set of conductive structures based on the first pair of conductive patterns, and forming a second set of conductive structures based on the second pair of conductive patterns. The first and second cell have a same cell height that is a non-integer multiple of a minimum pitch.

Abstract: A method of manufacturing an integrated circuit includes identifying a first cell of a layout, placing a first pair of conductive patterns on a first set of routing tracks, placing a second pair of conductive patterns on a second set of routing tracks, and forming, by a first mask, a first set of conductive structures based on the first pair or second pair of conductive patterns. The first cell abuts a second cell. The first cell has a first set of routing tracks. The second cell has a second set of routing tracks. The first and second cell have a same cell height that is a non-integer multiple of a minimum pitch. A top and bottom boundary of the first cell overlaps a pair of the first set of routing tracks. A top and bottom boundary of the second cell overlaps a pair of the second set of routing tracks.

Abstract: A method of manufacturing an integrated circuit includes identifying a first cell of a layout, placing a first pair of conductive patterns on a first set of routing tracks, placing a second pair of conductive patterns on a second set of routing tracks, and forming, by a first mask, a first set of conductive structures based on the first pair or second pair of conductive patterns. The first cell abuts a second cell. The first cell has a first set of routing tracks. The second cell has a second set of routing tracks. The first and second cell have a same cell height that is a non-integer multiple of a minimum pitch. A top and bottom boundary of the first cell overlaps a pair of the first set of routing tracks. A top and bottom boundary of the second cell overlaps a pair of the second set of routing tracks.

Abstract: A method of designing a layout includes identifying a cell having a cell height being a non-integral multiple of a minimum pitch, generating, using a processor, possibilities of an ordered arrangement of a plurality of virtual grid lines parallel to the top boundary and the bottom boundary, and placing at least two conductive patterns on the plurality of virtual grid lines. The cell height is defined by a top boundary and a bottom boundary, and the minimum pitch is based on a manufacturing process. The plurality of virtual grid lines are separated from each other by a plurality of spacings, and the top boundary overlaps a first virtual grid line of the plurality of virtual grid lines and the bottom boundary overlaps a second virtual grid line of the plurality of virtual grid lines. At least one spacing is different from another spacing of the plurality of spacings.

Abstract: A method is disclosed that includes the operation below. Vertices in a conflict graph are sorted into a first clique and a second clique, in which the conflict graph corresponds to a layout of a circuit. A first vertex of the vertices is merged with a second vertex of the vertices, to generate a reduced graph, in which the first clique excludes the second vertex, and the second clique excludes the first vertex. A first color pattern of a plurality of color patterns is assigned to a first pattern, corresponding to the first vertex, and a second pattern, corresponding to the second vertex, in the layout according to the reduced graph.

Abstract: A method of designing a layout includes identifying a cell having a cell height being a non-integral multiple of a minimum pitch, generating, using a processor, possibilities of an ordered arrangement of a plurality of virtual grid lines parallel to the top boundary and the bottom boundary, and placing at least two conductive patterns on the plurality of virtual grid lines. The cell height is defined by a top boundary and a bottom boundary, and the minimum pitch is based on a manufacturing process. The plurality of virtual grid lines are separated from each other by a plurality of spacings, and the top boundary overlaps a first virtual grid line of the plurality of virtual grid lines and the bottom boundary overlaps a second virtual grid line of the plurality of virtual grid lines. At least one spacing is different from another spacing of the plurality of spacings.

Abstract: A method is disclosed that includes the operation below. Vertices in a conflict graph are sorted into a first clique and a second clique, in which the conflict graph corresponds to a layout of a circuit. A first vertex of the vertices is merged with a second vertex of the vertices, to generate a reduced graph, in which the first clique excludes the second vertex, and the second clique excludes the first vertex. A first color pattern of a plurality of color patterns is assigned to a first pattern, corresponding to the first vertex, and a second pattern, corresponding to the second vertex, in the layout according to the reduced graph.

Abstract: A method is performed at least in part by at least one processor. In the method, a plurality of circuit elements are placed in a layout for a semiconductor device, the plurality of circuit elements having a plurality of pins. A layer assignment is generated to assign a plurality of interconnections to corresponding conductive layers of the semiconductor device, the plurality of interconnections connecting corresponding pairs of pins among the plurality of pins. The plurality of interconnections is routed in the layout in accordance with the layer assignment.

Abstract: Among other things, one or more systems and techniques for tier based layer modification, such as promotion or demotion, for a design layout are provided herein. A metal scheme describes one or more metal layers of the design layout, which are grouped into a set of tiers based upon resistivity similarity between the metal layers. Wire segments of the design layout are evaluated for promotion to tiers providing improved performance, for demotion to tiers providing decreased performance so that relatively faster routing resources are freed up for other wire segments, or for modification such as widening of wire segments. Via count penalties corresponding to timing delays of additional vias used to reassign wire segments are taken into account during promotion. Routing resource gains associated with reassigning wire segments are taken into account during demotion. In this way, wire segments of the design layout are promoted, demoted, or modified.

Abstract: A method of forming a semiconductor arrangement is provided. The semiconductor arrangement includes an interconnection arrangement comprising a first connection between a driver and a receiver. At least one buffer is disposed along the first connection to reduce delay associated with the interconnection arrangement. However, buffers increase power consumption, and thus a determination is made as to whether a buffer is unnecessary. A buffer is determined to be unnecessary where removal of the buffer does not violate a timing constraint regarding an amount of time a signal takes to go from the driver to the receiver. If a buffer is determined to be unnecessary, the buffer is removed to reduce power consumption.

Abstract: A method of forming a semiconductor arrangement is provided. The semiconductor arrangement includes an interconnection arrangement comprising a first connection between a driver and a receiver. At least one buffer is disposed along the first connection to reduce delay associated with the interconnection arrangement. However, buffers increase power consumption, and thus a determination is made as to whether a buffer is unnecessary. A buffer is determined to be unnecessary where removal of the buffer does not violate a timing constraint regarding an amount of time a signal takes to go from the driver to the receiver. If a buffer is determined to be unnecessary, the buffer is removed to reduce power consumption.

Abstract: Among other things, one or more systems and techniques for tier based layer modification, such as promotion or demotion, for a design layout are provided herein. A metal scheme describes one or more metal layers of the design layout, which are grouped into a set of tiers based upon resistivity similarity between the metal layers. Wire segments of the design layout are evaluated for promotion to tiers providing improved performance, for demotion to tiers providing decreased performance so that relatively faster routing resources are freed up for other wire segments, or for modification such as widening of wire segments. Via count penalties corresponding to timing delays of additional vias used to reassign wire segments are taken into account during promotion. Routing resource gains associated with reassigning wire segments are taken into account during demotion. In this way, wire segments of the design layout are promoted, demoted, or modified.

Abstract: A method is performed at least in part by at least one processor. In the method, a plurality of circuit elements are placed in a layout for a semiconductor device, the plurality of circuit elements having a plurality of pins. A layer assignment is generated to assign a plurality of interconnections to corresponding conductive layers of the semiconductor device, the plurality of interconnections connecting corresponding pairs of pins among the plurality of pins. The plurality of interconnections is routed in the layout in accordance with the layer assignment.

Abstract: A method comprises selecting a region from a layout pattern of an integrated circuit, wherein the region comprises a plurality of functional units, and wherein the functional units are not coupled to each other through a variety of connection components, identifying hot spots in the region using a first threshold and inserting a plurality of decoupling capacitors adjacent to the hot spots.

Abstract: A method comprises selecting a region from a layout pattern of an integrated circuit, wherein the region comprises a plurality of functional units, and wherein the functional units are not coupled to each other through a variety of connection components, identifying hot spots in the region using a first threshold and inserting a plurality of decoupling capacitors adjacent to the hot spots.

Abstract: Test points on an integrated circuit chip, especially points subject to IR voltage drop along power supply rails, are coupled to comparators controlled by an automatic test controller, all included on the chip. Each test point can have one or more comparators and one or more reference voltages over a testing range. A change of state at a comparator sets a latch that is read and reset by the on-chip automatic test controller during test intervals. The automatic test controller can coordinate with external automatic test equipment that applies stimulus signals to the chip during testing. The greatest voltage drop during a test interval is determined from the latched output of the switched comparator coupled to the lowest reference voltage. The setting and resetting of the latch can be gated through a selectable delay so as to discriminate for excursions that persist for a longer or shorter time.

Abstract: A printable photovoltaic electrochromic device is provided. The device includes a transparent substrate, at least one thin-film solar cell on the transparent substrate, at least one single polarity electrochromic (EC) thin film, wherein the single polarity electrochromic thin film includes a single polarity electrochromic material and a polyelectrolyte. The thin-film solar cell at least includes an anode layer, a cathode layer, and a photoelectric conversion layer between the anode layer and cathode layer, wherein a portion of the anode layer or a portion of the cathode layer is exposed from the thin-film solar cell. The single polarity electrochromic thin film covers and contacts with both the cathode layer and the anode layer.