Patents by Inventor Chi Wei Yap

Chi Wei Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing electronic device
    Patent number: 11464118
    Abstract: Methods for manufacturing an electronic device include providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components including an antenna and a matching circuitry. A cap is attached to the substrate over the antenna and the matching circuitry and a molding operation is performed to encapsulate the cap and at least a portion of the substrate with a mold compound.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: October 4, 2022
    Assignee: PCI PRIVATE LIMITED
    Inventors: Handi Kartadihardja, Nelson Ranola, Chi Wei Yap, Stephen Conner
  • METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    Publication number: 20210029833
    Abstract: Methods for manufacturing an electronic device include providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components including an antenna and a matching circuitry. A cap is attached to the substrate over the antenna and the matching circuitry and a molding operation is performed to encapsulate the cap and at least a portion of the substrate with a mold compound.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 28, 2021
    Inventors: Handi Kartadihardja, Nelson Ranola, Chi Wei Yap, Stephen Conner