Abstract: An electronic component includes a board, an electronic device, and a stiffening structure is provided. The electronic device is disposed on the board. The stiffening structure is disposed on the board. The stiffening structure includes a ring portion corresponding the edge of the board. The stiffening structure includes a core base and a cladding layer. The cladding layer covers the core base.

Abstract: A method includes depositing a high-k gate dielectric layer over and along sidewalls of a semiconductor fin. The method further includes depositing an n-type work function metal layer over the high-k gate dielectric layer and performing a passivation treatment on the high-k gate dielectric layer through the n-type work function metal layer. The passivation treatment comprises a remote plasma process. The method further includes depositing a fill metal over the n-type work function metal layer to form a metal gate stack over the high-k gate dielectric layer. The metal gate stack comprising the n-type work function metal layer and the fill metal.

Abstract: An electronic device includes a body, an electronic module, and an elastic element, wherein the body has at least an accommodating space and a first connector. The electronic module is accommodated in the accommodating space and has a plurality of connection ports and a second connector electrically connected to the plurality of connection ports. The second connector is electrically connected to the first connector, and the plurality of connection ports is exposed on the outer surface of the body. The elastic element surrounds the junction between the first connector and the second connector, wherein the electronic module presses the elastic element against the body.

Abstract: An electronic device includes a body, an electronic module, and an elastic element, wherein the body has at least an accommodating space and a first connector. The electronic module is accommodated in the accommodating space and has a plurality of connection ports and a second connector electrically connected to the plurality of connection ports. The second connector is electrically connected to the first connector, and the plurality of connection ports is exposed on the outer surface of the body. The elastic element surrounds the junction between the first connector and the second connector, wherein the electronic module presses the elastic element against the body.