Patents by Inventor Chi-Wen Chu

Chi-Wen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230276928
    Abstract: The invention provides a protable article device, which mainly comprises a flat, expandable sheath and a binding component. The inner surface of the sheath is flexible, with a non-slip surface with plurality grooves; it is connected to the Velcro and positioning ring of the binding component. This design enables objects to be tightly fastened inside the sheath because of the elasticity of the Velcro. The positioning ring of the sheath can be locked to a clip holder to enable easy carrying and retrieval when outdoors.
    Type: Application
    Filed: March 4, 2022
    Publication date: September 7, 2023
    Inventor: Chi-Wen CHU
  • Patent number: 10806052
    Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: October 13, 2020
    Assignee: WISTRON CORP.
    Inventors: Chi-Wen Chu, Yun An Chang
  • Publication number: 20200154599
    Abstract: The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components.
    Type: Application
    Filed: March 13, 2019
    Publication date: May 14, 2020
    Inventors: Chi-Wen Chu, Yun An Chang
  • Publication number: 20170104213
    Abstract: The present invention provides a method for manufacturing a negative plate of a secondary battery, which includes the following steps: providing multiple sheets of functional graphene; compressing the functional graphene to form a graphene target; providing copper foil, and forming a microstructure on a surface of the copper foil, so as to strengthen attachment between a graphene layer and the copper foil; depositing the graphene target on the microstructure of the surface of the copper foil, to form the graphene layer; and repairing the graphene layer by using an excimer laser. The foregoing manufacturing method can greatly prolong a cycle life of the whole graphene cathode, and increase a reversible capacitance of a battery.
    Type: Application
    Filed: December 15, 2015
    Publication date: April 13, 2017
    Inventors: Chia-Hung HUANG, Sung-Mao CHIU, Chi-Wen CHU, Yin CHUANG, Chun-Chieh WANG, Chia-Min WEI
  • Publication number: 20150114821
    Abstract: A method for modifying properties of graphene includes a graphene film provision step and a modification step. In the graphene film provision step, a graphene film is provided, and the graphene is formed on a substrate. In the modification step, the graphene film is placed in a vacuum environment and radiated by an electron beam to obtain a graphene material.
    Type: Application
    Filed: April 1, 2014
    Publication date: April 30, 2015
    Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chia-Hung Huang, Chi-Wen Chu, Sung-Mao Chiu, Chun-Chieh Wang, Chia-Min Wei, Chung-Jen Chung, Bo-Hsiung Wu