Patents by Inventor Chi-Wen PAN

Chi-Wen PAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200333193
    Abstract: The surface temperature of a portable device is estimated. The portable device includes a sensor for detecting the internal temperature of the portable device. The portable device also includes circuitry for estimating the surface temperature, using the internal temperature and an ambient temperature of the portable device as input to a circuit model. The circuit model describes thermal behaviors of the portable device. The circuitry is operative to identify a scenario in which the portable device operates, and determine the ambient temperature using the scenario and at least the internal temperature.
    Type: Application
    Filed: July 3, 2020
    Publication date: October 22, 2020
    Inventors: Chi-Wen Pan, Pei-Yu Huang, Sheng-Liang Kuo, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li, Wei-Ting Wang
  • Patent number: 10739206
    Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: August 11, 2020
    Assignee: MediaTek Inc.
    Inventors: Chi-Wen Pan, Pei-Yu Huang, Sheng-Liang Kuo, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li, Wei-Ting Wang
  • Publication number: 20200107469
    Abstract: A wireless charging device with a heat dissipation function is provided. The wireless charging device includes a case, a wireless charging assembly and a working fluid. The case includes an accommodation space. The wireless charging assembly is disposed in the accommodation space. The wireless charging assembly includes a circuit board, a coil coupled to the circuit board and a connector coupled to the circuit board. The working fluid is disposed in the accommodation space in the case. The circuit board and the coil of the wireless charging assembly are immersed in the working fluid.
    Type: Application
    Filed: November 14, 2018
    Publication date: April 2, 2020
    Inventors: CHI-WEN CHOU, Jen-Chieh Pan
  • Publication number: 20200051988
    Abstract: A method for forming an antifuse on a substrate is provided, which comprises: forming a first conductive material on the substrate; placing the first conductive material in an electrolytic solution; performing anodic oxidation on the first conductive material to form a nanowire made of the first conductive material and surrounded by a first dielectric material formed during the anodic oxidation and to form the antifuse on the nanowire; and forming a second conductive material on the antifuse to sandwich the antifuse between the first conductive material and the second conductive material.
    Type: Application
    Filed: October 17, 2019
    Publication date: February 13, 2020
    Inventors: Jenn-Gwo Hwu, Wei-Cheng Tian, Samuel C. Pan, Chao-Hsiung Wang, Chi-Wen Liu
  • Patent number: 10504907
    Abstract: A method for forming an antifuse on a substrate is provided, which comprises: forming a first conductive material on the substrate; placing the first conductive material in an electrolytic solution; performing anodic oxidation on the first conductive material to form a nanowire made of the first conductive material and surrounded by a first dielectric material formed during the anodic oxidation and to form the antifuse on the nanowire; and forming a second conductive material on the antifuse to sandwich the antifuse between the first conductive material and the second conductive material.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: December 10, 2019
    Assignees: Taiwan Semiconductor Manufacturing Company Limited, National Taiwan University
    Inventors: Jenn-Gwo Hwu, Wei-Cheng Tian, Samuel C. Pan, Chao-Hsiung Wang, Chi-Wen Liu
  • Publication number: 20190115269
    Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, and a stiffener ring mounted on the top surface of the package substrate. The stiffener ring includes a reinforcement rib that is coplanar with the stiffener ring on the top surface of the package substrate. At least two compartments are defined by the stiffener ring and the reinforcement rib. At least two individual chip packages are mounted on chip mounting regions within the at least two compartments, respectively, thereby constituting a package array on the package substrate.
    Type: Application
    Filed: December 11, 2018
    Publication date: April 18, 2019
    Inventors: Chi-Wen Pan, I-Hsuan Peng, Sheng-Liang Kuo, Yi-Jou Lin, Tai-Yu Chen
  • Publication number: 20180261528
    Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.
    Type: Application
    Filed: January 8, 2018
    Publication date: September 13, 2018
    Inventors: Tai-Yu Chen, Wen-Sung Hsu, Sheng-Liang Kuo, Chi-Wen Pan, Jen-Chuan Chen
  • Publication number: 20180245986
    Abstract: The surface temperature of a portable device is estimated. A sensor detects the internal temperature of the portable device. The internal temperature and an ambient temperature are used as input to a circuit model that describes thermal behaviors of the portable device. Dynamic thermal management may be performed based on the estimated surface temperature.
    Type: Application
    Filed: December 30, 2017
    Publication date: August 30, 2018
    Inventors: Chi-Wen Pan, Pei-Yu Huang, Sheng-Liang Kuo, Jih-Ming Hsu, Tai-Yu Chen, Yun-Ching Li, Wei-Ting Wang
  • Publication number: 20160153922
    Abstract: A computer system and a method for adaptive thermal resistance-capacitance (RC) network analysis of a semiconductor device for use in a portable device are provided. The method includes the steps of: receiving a device input file and a plurality of specific effective heat transfer coefficients (HTCs) associated with the portable device; repeatedly performing a thermal analysis of the portable device based on the device input file and a current effective HTC to estimate a target die temperature of the semiconductor device; calculating a target effective HTC based on the device input file and the target die temperature; and updating the current effective HTC with the target effective HTC; and generating an output file recording the target die temperature of the semiconductor device.
    Type: Application
    Filed: November 25, 2015
    Publication date: June 2, 2016
    Inventors: Yu-Min LEE, Chi-Wen PAN, Hung-Wen CHIOU, Tai-Yu CHEN, Tao CHENG, Wen-Sung HSU, Sheng-Liang LI