Patents by Inventor Chi-Wen Tsai

Chi-Wen Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210247561
    Abstract: A light guide module is provided. The light guide module includes a first light guide unit, a second light guide unit and an elastic unit. The elastic unit is disposed between the first light guide unit and the second light guide unit. One side of the elastic unit is connected to the first light guide unit, and the other side of the elastic unit is connected to the second light guide unit. In an initial state, a first distance is formed between the first light guide unit and the second light guide unit. In an extended state, the elastic unit is elastically deformed, and a second distance is formed between the first light guide unit and the second light guide unit.
    Type: Application
    Filed: September 21, 2020
    Publication date: August 12, 2021
    Inventors: Chi-Wen TSAI, Che-Min LIN, Shin-Jie HO
  • Patent number: 11067743
    Abstract: A light guide module is provided. The light guide module includes a first light guide unit, a second light guide unit and an elastic unit. The elastic unit is disposed between the first light guide unit and the second light guide unit. One side of the elastic unit is connected to the first light guide unit, and the other side of the elastic unit is connected to the second light guide unit. In an initial state, a first distance is formed between the first light guide unit and the second light guide unit. In an extended state, the elastic unit is elastically deformed, and a second distance is formed between the first light guide unit and the second light guide unit.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: July 20, 2021
    Assignee: WISTRON NEWEB CORP.
    Inventors: Chi-Wen Tsai, Che-Min Lin, Shin-Jie Ho
  • Patent number: 8191231
    Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: June 5, 2012
    Assignee: Wistron NeWeb Corporation
    Inventors: Wen-Kuei Lo, Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Tzuh-Suan Wang
  • Patent number: 8176621
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: May 15, 2012
    Assignee: Wistron NeWeb Corp.
    Inventors: Wen-Kuei Lo, Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Tzuh-Suan Wang
  • Publication number: 20120042505
    Abstract: A method for manufacturing an antenna includes steps as follows. First, a substrate is provided, wherein a surface of the substrate has an antenna region. Then, the surface of the substrate is electroless plated with a metal medium, so that the surface is covered with the metal medium. Then, the metal medium is covered with a resist. Then, a portion of the resist in the antenna region is removed. Then, the antenna region is electroplated with metal material to form an antenna main body. Then, a remaining portion of the resist is removed, and excluding a portion of the metal medium in the antenna region, the other portion of the metal medium is also removed from the substrate.
    Type: Application
    Filed: December 20, 2010
    Publication date: February 23, 2012
    Applicant: WISTRON NEWEB CORPORATION
    Inventors: Wen-Kuei LO, Sheng-Chieh CHANG, Bau-Yi HUANG, Chi-Wen TSAI, Hsin-Hui HSU, Tzuh-Suan WANG
  • Publication number: 20120027951
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and forming a photosensitive medium layer on the non-conductive frame, wherein the medium layer comprises a catalyzer for electroless deposition; applying a light beam through a transparent portion of a mask to the medium layer, such that a part of the medium layer is solidified within a predetermined region on the non-conductive frame; removing a part of the medium layer outside of the predetermined region; and forming a metal layer on the medium layer within the predetermined region.
    Type: Application
    Filed: January 26, 2011
    Publication date: February 2, 2012
    Applicant: WISTRON NEWEB CORP.
    Inventors: Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Wen-Kuei Lo
  • Publication number: 20120017427
    Abstract: A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.
    Type: Application
    Filed: December 15, 2010
    Publication date: January 26, 2012
    Applicant: WISTRON NEWEB CORP.
    Inventors: Wen-Kuei Lo, Sheng-Chieh Chang, Bau-Yi Huang, Chi-Wen Tsai, Hsin-Hui Hsu, Tzuh-Suan Wang
  • Patent number: 6190307
    Abstract: An auxiliary erotic implement includes a body, a vibrator, a transmitting unit, and an changeover switch. the body has an intermediate portion provided with a layer of rolling beads under the surface, and the vibrator provided on an outer surface of a rear portion. the transmitting unit is container in the body, consisting of a motor, tow gear and rod sets, a slide plate, an interacting gear and an interacting rod. The body is rotated for 360° and move axially back and forth at the same time by the two gear and rod sets rotated by the motor controlled by the changeover switch and cooperated by the interacting gear, the interacting rod and the slide plate. In addition, the rolling beads also roll together with the body, enhancing worth of the implement and pleasure to be acquired.
    Type: Grant
    Filed: April 30, 1999
    Date of Patent: February 20, 2001
    Inventor: Chi-Wen Tsai
  • Patent number: 6189167
    Abstract: A pillow includes a lower housing for containing a base, a motor connected to a transmitting device, and an upper housing. The motor rotates the transmitting device, which has several transmitting shafts and gears so as to provide different modes of movement, such as rotation and up and down movement, to the pillow. The upper housing is fixed with the transmitting device, supporting the body of a user, and having a curved recess formed in an upper surface to suit to the curvature of a human body. A cover covers the upper and lower housings to prevent miscellaneous matters from entering the interior of the upper and the lower housings.
    Type: Grant
    Filed: April 12, 1999
    Date of Patent: February 20, 2001
    Inventor: Chi-Wen Tsai