Patents by Inventor Chi Won AN

Chi Won AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948545
    Abstract: A sound control device in a vehicle and control method thereof may include obtaining energy per unit time of an audio signal corresponding to a preset low frequency band, calculating an allowable reference value based on a difference between a magnitude of energy per unit time of the audio signal and a magnitude of a preset maximum allowable input of a speaker, monitoring whether a magnitude of energy per unit time of a noise control signal for eliminating noise in the vehicle exceeds the allowable reference value, and adjusting a magnitude of the noise control signal when the magnitude of energy per unit time of the noise control signal exceeds the allowable reference value.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: April 2, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Jung Keun You, Jong Won Lee, Kaang Dok Yee, Chi Sung Oh, Hyun Jin Song
  • Publication number: 20240090753
    Abstract: An aspect of the present invention relates to an endoscope system which can be inserted into the body of a subject to examine or treat tissue or the like and, more specifically, to an endoscope system in which an operation of bending a bending section of an insertion tube is motorized, and thus convenience in a surgeon's manipulation is ensured.
    Type: Application
    Filed: September 27, 2021
    Publication date: March 21, 2024
    Applicant: MEDINTECH INC.
    Inventors: Chi Won LEE, Myung Joon KIM
  • Publication number: 20240051200
    Abstract: Proposed is an apparatus and method for manufacturing automotive interior materials. The apparatus includes a first mold unit provided with a first molding surface and a gate disposed on the first molding surface, wherein a skin is set on the first molding surface. The apparatus further includes a second mold unit provided with a second molding surface facing the first molding surface, and configured to provide an opening exposing an edge of an edge portion of the set skin along a periphery between the first molding surface and the second molding surface when the second mold unit is combined with the first mold unit, and a sealing block provided with a tip portion disposed along the opening when the first mold unit and the second mold unit are combined.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventor: Chi Won YOON
  • Publication number: 20240051198
    Abstract: Proposed is an apparatus and method for manufacturing automotive interior materials. The apparatus includes a first mold unit with a first molding surface and a gate disposed on the first molding surface, and a second mold unit provided with a second molding surface facing the first molding surface, wherein a skin is set on the first molding surface; and the first mold unit and the second mold unit are configured, when combined, to provide a volume-variable injection space between the set skin and the first molding surface, wherein the volume-variable injection space is in a first volume state while molten resin is injected through the gate, and after completing the injection of the molten resin, the volume-variable injection space changes to a second volume state that a volume of the injection space is reduced compared to the first volume state to compress the molten resin.
    Type: Application
    Filed: October 24, 2023
    Publication date: February 15, 2024
    Inventor: Chi Won YOON
  • Publication number: 20230331453
    Abstract: Disclosed is a storage container, in which a valve coupled to an opening portion of a tube is not cut in advance, but the valve is cut when a liquid injection nozzle is inserted into the tube, such that a gap between the liquid injection nozzle and the valve may be perfectly blocked, thereby preventing a leak of a liquid. A storage container according to an embodiment of the present invention includes a tube made of an expandable or contractible elastic material, and a valve configured to be coupled to an upper end of the tube before a liquid is injected into the tube, in which the valve includes a ring-shaped support portion configured to be seated and supported at the upper end of the tube, and an elastic membrane extending from an end of the support portion and configured to close an opening portion of the tube.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 19, 2023
    Applicant: BOTTLESS CO., LTD.
    Inventor: Chi Won YI
  • Publication number: 20230329530
    Abstract: A motor-driven endoscope includes: an insertion unit which is configured so that at least a part from one side thereof, and which includes a curve unit that is configured to be bent when being pulled by a wire inserted therein; a grip unit which is provided at one side of the insertion unit and is held by a user to input a driving input; a plurality of motors for transferring driving power so as to steer the curve unit; and a tension adjustment unit which is provided at the other side of the insertion unit and receives a rotating force from the motors to pull each wire, wherein the tension adjustment unit and the motor are configured to be coupled to or uncoupled from each other, and the tension adjustment unit is configured to receive the rotating force from the motor when coupled to the motor.
    Type: Application
    Filed: November 25, 2020
    Publication date: October 19, 2023
    Applicant: MEDINTECH INC.
    Inventors: Chi Won LEE, Myung Joon KIM
  • Publication number: 20230281269
    Abstract: Disclosed are a method for generating matrix index information about a target matrix including a sparse matrix, and a method for processing a matrix using matrix index information. The disclosed matrix index information generation method comprises the steps of: confirming elements of a target matrix; and generating a bit stream which includes one or more bits each allocated to each of the elements and indicating position information about the element within the target matrix.
    Type: Application
    Filed: June 17, 2021
    Publication date: September 7, 2023
    Inventors: Gi-Ho PARK, Chi Won HAN, Min Kwan KEE
  • Patent number: 11737211
    Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: August 22, 2023
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki Suk Kim, Hyung Ki Lee, Chi Won Hwang
  • Publication number: 20230262891
    Abstract: A connection structure embedded substrate includes: a printed circuit board including a plurality of first insulating layers and a plurality of first wiring layers, respectively disposed on or between the plurality of first insulating layers; and a connection structure disposed in the printed circuit board and including a plurality of internal insulating layers and a plurality of internal wiring layers, respectively disposed on or between the plurality of internal insulating layers. Among the plurality of internal wiring layers, an internal wiring layer disposed in one surface of the connection structure is in contact with one surface of a first insulating layer, among the plurality of first insulating layers.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki Suk Kim, Hyung Ki Lee, Chi Won Hwang
  • Publication number: 20230245989
    Abstract: A printed circuit board includes: a first insulating layer; a first cavity disposed in one surface of the first insulating layer; a plurality of protrusion portions spaced apart from each other in the first cavity; and a first wiring layer embedded in the one surface of the first insulating layer.
    Type: Application
    Filed: April 7, 2023
    Publication date: August 3, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Chi Won Hwang, Gyu Mook Kim
  • Publication number: 20230199955
    Abstract: A printed circuit board includes: an insulating member; a first wiring layer disposed in the insulating member, and including first and second pattern layers spaced apart from each other based on a thickness direction of the printed circuit board; and a second wiring layer disposed in the insulating member, and spaced apart from the first pattern layer over the first pattern layer based on the thickness direction. Based on the thickness direction, an insulation distance between the first pattern layer and the second pattern layer is smaller than an insulation distance between the first pattern layer and the second wiring layer, and each of the first and second pattern layers is thinner than the second wiring layer.
    Type: Application
    Filed: April 4, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk Lee, Chi Won Hwang, Eun Sun Kim, Yong Wan Ji, Young Hun You
  • Publication number: 20230199951
    Abstract: A printed circuit board includes: a wiring substrate including a plurality of insulating layers, a plurality of wiring layers, and a plurality of via layers; and a bridge embedded in the wiring substrate and having a plurality of connection pads thereon. An uppermost wiring layer of the plurality of wiring layers includes a plurality of bump pads connected to the plurality of connection pads, and a pitch between at least two adjacent connection pads of the plurality of connection pads is larger than a pitch between at least two adjacent ones of the plurality of bump pads.
    Type: Application
    Filed: May 12, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Chi Won HWANG, Eun Sun KIM
  • Publication number: 20230199956
    Abstract: A printed circuit board includes: an insulating member; a first bump disposed on the insulating member; a second bump disposed adjacently to but spaced apart from the first bump on the insulating member; a first insulating wall covering at least a portion of the first bump; and a second insulating wall covering at least a portion of the second bump and disposed adjacently to but spaced apart from the first insulating wall.
    Type: Application
    Filed: May 10, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • Publication number: 20230171888
    Abstract: The present disclosure relates to a printed circuit board and a method of manufacturing the same. The printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls that are disposed on the insulating layer and cover side surfaces of the plurality of pads, respectively, but are not disposed on upper surfaces of the plurality of pads. The plurality of insulating walls are disposed to be spaced apart from each other on the first insulating layer.
    Type: Application
    Filed: September 1, 2022
    Publication date: June 1, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon KIM, Young Kuk KO, Gyu Mook KIM, Hea Sung KIM, Chi Won HWANG, Suk Chang HONG
  • Patent number: 11657594
    Abstract: An apparatus for classifying an image according to an embodiment includes a fake image generation module receiving a classification target image and a fake image in a form in which only a background exists and no specific object exists in the classification target image, a difference of images vector generation module generating a difference of images between the classification target image and the fake image and a difference of images vector by converting the generated difference of images into preset one-dimensional matrix data, a difference of feature vectors generation module generating a difference of feature vectors between a feature vector generated based on the classification target image and a feature vector generated based on the fake image, and an image classification module classifying the classification target image based on the difference of images vector, the feature vector generated based on the classification target image, and the difference of feature vectors.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: May 23, 2023
    Assignee: Polaris3D Co., Ltd.
    Inventors: Chi Won Sung, Jae Gun Lee
  • Publication number: 20230147912
    Abstract: A printed circuit board includes: an insulating layer; a plurality of pads disposed on the insulating layer; and a plurality of insulating walls disposed on the insulating layer, and at least partially covering side surfaces of the plurality of pads, respectively, while being free from surfaces of the plurality of pads, respectively. The plurality of insulating walls are disposed to be spaced apart from each other on the insulating layer.
    Type: Application
    Filed: March 10, 2022
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Chi Won Hwang, Suk Chang Hong
  • Publication number: 20230131654
    Abstract: Proposed are an apparatus and a method for manufacturing an interior material for a vehicle, in which a core and a skin can be integrated by a pressing operation. The apparatus includes a first mold unit having a first molding surface, and a second mold unit having a second molding surface corresponding to the first molding surface. The core is mounted on the second molding surface. The first mold unit includes a first fixing part, and the second mold unit includes a second fixing part. The first fixing part and the second fixing part are configured to fix an outer peripheral portion of a skin placed between the first mold unit and the second mold unit.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 27, 2023
    Inventor: Chi Won YOON
  • Publication number: 20230117940
    Abstract: A printed circuit board includes: a first insulating layer having at least one recess portion in one surface thereof; a first wiring layer embedded in one surface of the first insulating layer; and a first via layer including a first via penetrating through at least a portion of the first insulating layer, one surface of the first via being exposed externally through the recess portion.
    Type: Application
    Filed: September 6, 2022
    Publication date: April 20, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kuk KO, Chi Won HWANG, Sang Hoon KIM
  • Publication number: 20230066381
    Abstract: A printed circuit board includes a first board including a plurality of first insulating layers and a plurality of first wiring layers disposed between the plurality of first insulating layers, respectively; and a second board disposed on one surface of the first board and including a plurality of second insulating layers and a plurality of second wiring layers disposed on or between the plurality of second insulating layers, respectively. At least one of the plurality of first insulating layers has a thickness less than a thickness of at least one of the plurality of second insulating layers. The first board further includes a through-via penetrating each of the plurality of first insulating layers and connected to one of the plurality of second wiring layers.
    Type: Application
    Filed: January 19, 2022
    Publication date: March 2, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Uk LEE, Chi Won HWANG, Eun Sun KIM, Yong Wan JI
  • Publication number: 20220383993
    Abstract: The present disclosure provides a method of generating compound information in a computing apparatus, the method including obtaining a learning model for information associated with partial structures, obtaining information associated with a source molecule that is a target of a partial structure modification, obtaining information associated with a partial structure set including a plurality of partial structures of the source molecule, selecting, from the partial structures included in the partial structure set, a target partial structure to be modified, obtaining, using the learning model, information associated with a modified partial structure corresponding to the target partial structure, and outputting result information in which the target partial structure is replaced by the modified partial structure in the source molecule.
    Type: Application
    Filed: October 20, 2020
    Publication date: December 1, 2022
    Inventors: Ji Ho YOO, Min Kyu HA, Jong Hwan CHAE, Chi Won SON, Sang Hyung JIN, Jae Hong SHIN, Han Jo KIM, Si U KIM, Sang Ok SONG