Patents by Inventor Chi Won AN

Chi Won AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin for transparent encapsulation material, and associated encapsulation material and electronic device
    Patent number: 9147626
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Grant
    Filed: August 8, 2014
    Date of Patent: September 29, 2015
    Assignee: CHEIL INDUSTRIES, INC.
    Inventors: Sung-Hwan Cha, Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An
  • RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE
    Publication number: 20140357792
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Application
    Filed: August 8, 2014
    Publication date: December 4, 2014
    Inventors: Sung-Hwan CHA, Sang-Ran KOH, Yong Kook KIM, Woo-Han KIM, Ha Neul KIM, Chi Won AN
  • Resin for transparent encapsulation material, and associated encapsulation material and electronic device
    Patent number: 8847414
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: September 30, 2014
    Assignee: Cheil Industries, Inc.
    Inventors: Sung-Hwan Cha, Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An
  • ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE PREPARED USING THE SAME
    Publication number: 20120168815
    Abstract: An encapsulation material and an electronic device, the encapsulation material including a resin, the resin including a first polysiloxane including hydrogen bonded with silicon (Si—H) at a terminal end thereof, and a second polysiloxane including an alkenyl group bonded with silicon (Si-Vi) at a terminal end thereof, a phosphor, and a density controlling agent, wherein a weight ratio of the density controlling agent to the phosphor is about 1.5:1 to about 10:1.
    Type: Application
    Filed: December 28, 2011
    Publication date: July 5, 2012
    Inventors: Sang-Ran Koh, Yong Kook Kim, Woo-Han Kim, Ha Neul Kim, Chi Won An, Sung-Hwan Cha
  • RESIN FOR TRANSPARENT ENCAPSULATION MATERIAL, AND ASSOCIATED ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE
    Publication number: 20120168780
    Abstract: A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Inventors: Sung-Hwan CHA, Sang-Ran KOH, Yong Kook KIM, Woo-Han KIM, Ha Neul KIM, Chi Won AN