Patents by Inventor Chi-Yeh Chen

Chi-Yeh Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat dissipation device
    Patent number: 12181224
    Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.
    Type: Grant
    Filed: October 2, 2022
    Date of Patent: December 31, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Jung-Kai Chang, Chi-Yeh Chen
  • HEAT DISSIPATION DEVICE
    Publication number: 20230221078
    Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.
    Type: Application
    Filed: October 2, 2022
    Publication date: July 13, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Jung-Kai Chang, Chi-Yeh Chen