Patents by Inventor Chi-Yeh Yu

Chi-Yeh Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140101626
    Abstract: A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, processing the model in a computer processor to generate a temperature map containing temperatures at a plurality of points of the 3D-IC under the operating condition; identifying an electromigration (EM) rating factor, and calculating and outputting from the processor data representing a temperature-dependent EM current constraint at each point.
    Type: Application
    Filed: December 10, 2013
    Publication date: April 10, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yeh YU, Chung-Min FU, Ping-Heng YEH
  • Publication number: 20140096102
    Abstract: A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, inputting a power profile in a computer processor, generating a transient temperature profile based on the 3D-IC model, identifying a potential thermal violation at a corresponding operating time interval and a corresponding location of a plurality of points of the 3D-IC design, and outputting data representing the potential thermal violation. The 3D-IC model represents a 3D-IC design comprising a plurality of elements in a stack configuration. The power profile is applied to the plurality of elements of the 3D-IC design as a function of an operating time. The transient temperature profile includes temperatures at a plurality of points of the 3D-IC design as a function of an operating time.
    Type: Application
    Filed: November 21, 2012
    Publication date: April 3, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chung-min FU, William Wu SHEN, Po-Hsiang HUANG, Meng-Fu YOU, Chi-Yeh YU
  • Patent number: 8680882
    Abstract: An interposer for a 3D-IC is provided with a plurality of functional metal wiring segments where the plurality of functional metal wiring segments are connected in series by a plurality of dummy metal wiring segments thus allowing the plurality of functional metal wiring segments to be electrically tested for continuity Each of the plurality of dummy metal wiring segments is provided with a laser fuse portion for disconnecting the dummy metal wiring segments upon completion of the electrical test.
    Type: Grant
    Filed: October 31, 2011
    Date of Patent: March 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Nan-Hsin Tseng, Chi-Yeh Yu
  • Patent number: 8631372
    Abstract: A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, processing the model in a computer processor to generate a temperature map containing temperatures at a plurality of points of the 3D-IC under the operating condition; identifying an electromigration (EM) rating factor, and calculating and outputting from the processor data representing a temperature-dependent EM current constraint at each point.
    Type: Grant
    Filed: May 22, 2012
    Date of Patent: January 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yeh Yu, Chung-Min Fu, Ping-Heng Yeh
  • Publication number: 20130304449
    Abstract: A method includes identifying at least one local power segment of a circuit, estimating at least one performance parameter of the at least one power segment based on a computer-based simulation of the circuit, and changing a design of the circuit based on at least one electromigration avoidance strategy if the at least one parameter is greater than or equal to a threshold value. A data file representing the circuit is stored if the at least one parameter is less than the threshold value.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jerry KAO, King-Ho TAM, Meng-Xiang LEE, Li-Chung HSU, Chi-Yeh YU, Chung-Min FU, Chung-Hsing WANG
  • Publication number: 20130212544
    Abstract: A computer implemented method comprises accessing a 3D-IC model stored in a tangible, non-transitory machine readable medium, processing the model in a computer processor to generate a temperature map containing temperatures at a plurality of points of the 3D-IC under the operating condition; identifying an electromigration (EM) rating factor, and calculating and outputting from the processor data representing a temperature-dependent EM current constraint at each point.
    Type: Application
    Filed: May 22, 2012
    Publication date: August 15, 2013
    Inventors: Chi-Yeh YU, Chung-Min FU, Ping-Heng YEH
  • Publication number: 20130106459
    Abstract: An interposer for a 3D-IC is provided with a plurality of functional metal wiring segments where the plurality of functional metal wiring segments are connected in series by a plurality of dummy metal wiring segments thus allowing the plurality of functional metal wiring segments to be electrically tested for continuity Each of the plurality of dummy metal wiring segments is provided with a laser fuse portion for disconnecting the dummy metal wiring segments upon completion of the electrical test.
    Type: Application
    Filed: October 31, 2011
    Publication date: May 2, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Nan-Hsin TSENG, Chi-Yeh Yu
  • Patent number: 8374295
    Abstract: A mobile device capable of scaling input data and a method thereof. The mobile device comprises a data segmentation module, a quality measure module, and a scaling module. The data segmentation module divides the input data into a plurality of subdata. The quality measure module, coupled to the data segmentation module, calculates signal quality of each subdata. The scaling module, coupled to the quality measure module, scales each subdata according to corresponding signal quality.
    Type: Grant
    Filed: July 16, 2007
    Date of Patent: February 12, 2013
    Assignee: Mediatek Inc.
    Inventors: Chi-Yeh Yu, Shih-Kung Chang, Chun-Ming Kuo, I-Ping Chang, Ho-Chi Huang
  • Publication number: 20120326319
    Abstract: A semiconductor device and method for forming the same provide a through silicon via (TSV) surrounded by a dielectric liner. The TSV and dielectric liner are surrounded by a well region formed by thermal diffusion. The well region includes a dopant impurity type opposite the dopant impurity type of the substrate. The well region may be a double-diffused well with an inner portion formed of a first material and with a first concentration and an outer portion formed of a second material with a second concentration. The surrounding well region serves as an isolation well, reducing parasitic capacitance.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 27, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Chi-Yeh YU
  • Publication number: 20120120198
    Abstract: A system for measuring a three-dimensional (3D) size of an object in a space according to an indicating mark is provided, wherein the indicating mark is used to point to one of a plurality of measuring points on the object. The system includes an image capturing module, an spatial vector calculating module, and a measuring module. The image capturing module captures an image of the space. The spatial vector calculating module respectively calculates a spatial vector corresponding to the indicating mark when the indicating mark is used to point to each of the measuring points on the object in the image. The measuring module calculates spatial coordinates of the measuring points according to the spatial vectors so as to obtain the 3D size of the object.
    Type: Application
    Filed: May 16, 2011
    Publication date: May 17, 2012
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Chi-Yeh Yu, Shih-Hung Yen, Chia-Hao Liang, Chun-Tai Yen
  • Patent number: 7936856
    Abstract: A synchronization circuit includes a correlator, an energy calculator, a post-processing unit, and a decision device. The correlator correlates a received sequence r(t) with a local sequence c(i) to obtain a correlation result h(t). The energy calculator calculates an energy function of the correlation result h(t), and filters the energy function of the correlation result by a channel impulse response wc(l) to obtain a filtered energy function e(t), where l is the index of the channel impulse response. The post-processing unit applies weighting function wa(t) to the filtered energy e(t) to obtain a weighted energy function e?(t), wherein the weighting function wa(t) weights a central portion of the filtered energy function e(t). The decision device selects a maximum energy value from the weighted energy function e?(t), and the time index t with maximum energy value is the time shift of the received sequence and the local sequence.
    Type: Grant
    Filed: September 13, 2007
    Date of Patent: May 3, 2011
    Assignee: Mediatek Inc.
    Inventors: Chun-Ming Kuo, I-Ping Chang, Chi-Yeh Yu, Shih-Kung Chang, Ho-Chi Huang
  • Patent number: 7937643
    Abstract: A mobile communication device and a data reception method implemented thereby are provided. An antenna receives a signal, and an inner receiver demodulates the received signal to generate an equalizer output. A channel decoder is coupled to the inner receiver, decoding the equalizer output to generate a data sequence. A quality estimator estimates signal quality of the received signal to generate a quality value. An error checker selectively performs cyclic redundancy code (CRC) check or CRC correction on the data sequence according to the quality value.
    Type: Grant
    Filed: July 19, 2007
    Date of Patent: May 3, 2011
    Assignee: Mediatek Inc.
    Inventors: I-Ping Chang, Chun-Ming Kuo, Chi-Yeh Yu, Shih-Kung Chang, Ho-chi Huang
  • Publication number: 20080069269
    Abstract: A mobile device capable of scaling input data and a method thereof. The mobile device comprises a data segmentation module, a quality measure module, and a scaling module. The data segmentation module divides the input data into a plurality of subdata. The quality measure module, coupled to the data segmentation module, calculates signal quality of each subdata. The scaling module, coupled to the quality measure module, scales each subdata according to corresponding signal quality.
    Type: Application
    Filed: July 16, 2007
    Publication date: March 20, 2008
    Applicant: MEDIATEK INC.
    Inventors: Chi-Yeh Yu, Shih-Kung Chang, Chun-Ming Kuo, I-Ping Chang, Ho-Chi Huang