Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.

Abstract: A phosphorus-containing compound represented by formula (I) and a preparation method thereof are provided. An addition reaction is performed for an organic cyclic phosphorus compound with an aryl aldehyde compound, and then a condensation reaction is performed with an aryl compound having active hydrogen in the use of an organic acid as a catalyst to obtain the proposed phosphorus-containing compound. This phosphorus-containing compound can be used as a hardener for resin, and improves flame retardant properties and thermal resistance for a flame retardant epoxy resin composition, thereby suitably applied to resin compositions used for manufacturing printed circuit boards and laminated circuit boards in electronic or electric products.

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): 1

Abstract: Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I): 1

Abstract: A phosphorus-containing compound represented by formula (I) and a preparation method thereof are provided. An addition reaction is performed for an organic cyclic phosphorus compound with an aryl aldehyde compound, and then a condensation reaction is performed with an aryl compound having active hydrogen in the use of an organic acid as a catalyst to obtain the proposed phosphorus-containing compound. This phosphorus-containing compound can be used as a hardener for resin, and improves flame retardant properties and thermal resistance for a flame retardant epoxy resin composition, thereby suitably applied to resin compositions used for manufacturing printed circuit boards and laminated circuit boards in electronic or electric products.

Abstract: Disclosed is a flame retarding resin composition comprising (A) one or more epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of the component B is a phosphorus-containing compound represented by the following formula (I): 1