Patents by Inventor Chi-Yu Chou

Chi-Yu Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Barrier layer for copper interconnect
    Patent number: 8722531
    Abstract: A method for forming an interconnect structure includes forming a dielectric layer overlying a substrate, forming a metal-containing layer in the dielectric layer, forming a barrier layer overlying the metal-containing layer, and performing a thermal process to form a metal oxide layer underlying the conductive layer. The metal oxide layer is a barrier layer formed at the boundary between the dielectric layer and the metal-containing layer.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: May 13, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Hung Lin, Chi-Yu Chou, Kuei-Pin Lee, Chen-Kuang Lien, Yu-Chang Hsiao, Yao-Hsiang Liang, Yu-Min Chang