Patents by Inventor Chi YUAN

Chi YUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162833
    Abstract: A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.
    Type: Application
    Filed: November 13, 2023
    Publication date: May 16, 2024
    Inventors: Yi-Sheng CHANG, Cheng-Chan HSU, Chia-Wei CHU, Chun-Yu YANG, Deng-Cyun HUANG, Yi-Hsun CHIU, Chien-An LAI, Yu-Tai WANG, Chi-Shou HO, Zhi-Yuan WU, Ko-Wen LU
  • Patent number: 11983475
    Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
  • Patent number: 11984261
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao
  • Publication number: 20240153812
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a shallow trench isolation (STI) in a substrate, forming a first gate structure on the substrate and adjacent to the STI, forming a first doped region between the first gate structure and the STI, forming a second doped region between the first doped region and the first gate structure, forming a first contact plug on the first doped region, and then forming a second contact plug on the second doped region.
    Type: Application
    Filed: December 4, 2022
    Publication date: May 9, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Wen-Kai Lin, Chi-Horn Pai, Sheng-Yuan Hsueh, Kuo-Hsing Lee, Chih-Kai Kang
  • Publication number: 20240145350
    Abstract: A semiconductor device is provided. The semiconductor device includes a carrier, an electronic component, an adapter, a first metal wire and a second metal wire. The electronic component is disposed on the carrier. The adapter is disposed on the carrier. The first metal wire connects the electronic component and the adapter. The second metal wire connects the adapter and the carrier.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 2, 2024
    Inventors: Pu-Shan HUANG, Chi-Yuan CHEN, Shih-Chin LIN
  • Publication number: 20240142339
    Abstract: The present disclosure relates to metrology measurement systems, and related methods. In one or more embodiments a system, includes a substrate support, and an optical arm. The optical arm includes a light source operable to project a first beam on a first light path. The optical arm also includes a first lens, a first beam splitter, a second lens, a first detector, and an aperture. The first lens is disposed on the first light path and between the substrate support and the light source. The first beam splitter is disposed on the first light path. The first beam splitter is positioned between the substrate support and the light source. The first detector is disposed on the second light path. The second lens focuses the second beam to a second beam diameter. The aperture is disposed between the second lens and the first detector.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Yangyang SUN, Jinxin FU, Ravi KOMANDURI, Chi-Yuan YANG
  • Publication number: 20240146501
    Abstract: A method of monitoring a clock signal of a server is provided. The server includes a phase-locked loop (PLL), a baseboard management controller (BMC), and a light emitting unit. The method includes steps of: A) the server executing a time synchronization service to obtain a synchronization mode that the PLL is operating in, where the synchronization mode is one of a free-run mode, a locked mode, and a holdover mode; B) the server updating the synchronization mode to the BMC when executing the time synchronization service; and C) the BMC storing the synchronization mode and controlling the light emitting unit to display in one of a plurality of displaying manners that corresponds to the synchronization mode.
    Type: Application
    Filed: July 10, 2023
    Publication date: May 2, 2024
    Inventors: Yu-Yuan Chen, Po-Wei Chang, Chi-Hua Li
  • Patent number: 11971824
    Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 30, 2024
    Assignee: AETHERAI IP HOLDING LLC
    Inventors: Chi-Chung Chen, Wei-Hsiang Yu, Chao-Yuan Yeh
  • Publication number: 20240136454
    Abstract: A back panel of a solar cell and a method for manufacturing the same are provided. The back panel includes a prepreg and a fluorine-containing polymer layer, and the fluorine-containing polymer layer is formed on the prepreg. The prepreg is formed by immersing a fiber substrate into a resin composition. Based on a total weight of the resin composition being 100 PHR (parts per hundred resin), the resin composition includes: 5 PHR to 70 PHR of a first epoxy resin, 1 PHR to 20 PHR of a hardener, and 0.01 PHR to 10 PHR of an accelerant. The first epoxy resin contains phosphorus atoms, and an amount of the phosphorus atoms in the first epoxy resin ranges from 0.1 wt % to 5 wt %.
    Type: Application
    Filed: November 29, 2022
    Publication date: April 25, 2024
    Inventors: TE-CHAO LIAO, CHING-YAO YUAN, Yu-Chi Hsieh
  • Publication number: 20240130614
    Abstract: An intraocular pressure inspection device includes an intraocular pressure detection unit, a high-precision positioning system and a wide-area positioning system, wherein according to the position of the intraocular pressure detection unit, a set of high-precision coordinates output by the high-precision positioning system and a set of wide-area coordinates output by the wide-area positioning system are integrated in appropriate weights to obtain a set of more precise integrated coordinate. The above-mentioned intraocular pressure inspection device can prevent the intraocular pressure detection unit from failing to operate once it is not in the working area of the high-precision positioning system.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 25, 2024
    Inventors: Shao Hung HUANG, Chao-Ting CHEN, Fong Hao KUO, Yu-Chung TUNG, Chu-Ming CHENG, Chi-Yuan KANG
  • Patent number: 11967570
    Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.
    Type: Grant
    Filed: March 4, 2022
    Date of Patent: April 23, 2024
    Assignee: MediaTek Inc.
    Inventors: Chia-Hao Hsu, Tai-Yu Chen, Shiann-Tsong Tsai, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen, Chung-Fa Lee
  • Publication number: 20240127603
    Abstract: Provided are a system and methods for a unified framework and tooling for lane boundary annotation, which include obtaining sensor data along a trajectory corresponding to locations of a base map. Features are extracted from the sensor data. The features are input into a trained neural network that outputs overlapping rich feature maps comprising polylines. The overlapping rich feature maps are aggregated according to an aggregation function to obtain raster image. Vectorization is applied to the raster images to extract roadway geometry represented by globally consistent polylines.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 18, 2024
    Inventors: Sergi Adipraja Widjaja, Venice Erin Baylon Liong, Sucipta Alexander, Nikki Erwin Ramirez, Ivana Irene Thomas, Chi Yuan Goh
  • Publication number: 20240127109
    Abstract: A federated learning method includes: providing importance parameters and performance parameters by client devices respectively to a central device, performing a training procedure by the central device, wherein the training procedure includes: selecting target devices from the client devices according to a priority order associated with the importance parameters, dividing the target devices into training groups according to a similarity of the performance parameters, notifying the target devices to perform iterations according to the training groups respectively to generate trained models, transmitting the trained models to the central device, and updating a global model based on the trained models, performing the training procedure again or outputting the global model to the client devices based on a convergence value of the global model and the number of times of performing the training procedure.
    Type: Application
    Filed: November 10, 2022
    Publication date: April 18, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Ping Feng WANG, Chiun Sheng HSU, Chi-Yuan CHOU, Fu-Chiang CHANG
  • Publication number: 20240124292
    Abstract: An auxiliary operation device for a droplet dispenser includes a droplet sensor, an imaging device and a processor. The droplet sensor has a detected area located between a droplet dispenser and a target area, wherein the droplet sensor detects a droplet output from the droplet dispenser, and outputs a corresponding droplet detection signal. The imaging device captures an image of the target area. The processor obtains a dripping time point at which the droplet passes through the detected area according to the droplet detection signal, and determines whether the target area is shielded within a first time range according to the image, so as to evaluate whether the droplet has successfully dropped into the target area. The above-mentioned auxiliary operating device of the droplet dispenser can objectively determine whether the droplets successfully drops into the target area, and improve the accuracy of judgment.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Inventors: SHAO HUNG HUANG, CHAO-TING CHEN, FONG HAO KUO, CHI-YUAN KANG, Chang Mu WU
  • Publication number: 20240117179
    Abstract: A plastic wrap is provided. The plastic wrap is formed from a biodegradable material. The biodegradable material includes a biodegradable polymer and a chain extender. The biodegradable polymer includes polybutylene adipate terephthalate (PBAT). Based on a total weight of the plastic wrap being 100 phr, an amount of the PBAT is higher than 85 phr. The chain extender is selected from the group consisting of: an epoxy functional compound, a dianhydride compound, diisocyanate, phosphite, dioxazoline, and any combination thereof.
    Type: Application
    Filed: November 29, 2022
    Publication date: April 11, 2024
    Inventors: TE-CHAO LIAO, CHING-YAO YUAN, Yu-Chi Hsieh
  • Publication number: 20240104019
    Abstract: Disclosed is a method for enhancing memory utilization and throughput of a computing platform in training a deep neural network (DNN). The critical features of the method includes: calculating a memory size for every operation in a computational graph, storing the operations in the computational graph in multiple groups with the operations in each group being executable in parallel and a total memory size less than a memory threshold of a computational device, sequentially selecting a group and updating a prefetched group buffer, and simultaneously executing the group and prefetching data for a group in the prefetched group buffer to the corresponding computational device when the prefetched group buffer is update. Because of group execution and data prefetch, the memory utilization is optimized and the throughput is significantly increased to eliminate issues of out-of-memory and thrashing.
    Type: Application
    Filed: September 9, 2020
    Publication date: March 28, 2024
    Applicant: AETHERAI IP HOLDING LLC
    Inventors: Chi-Chung CHEN, Wei-Hsiang YU, Chao-Yuan YEH
  • Publication number: 20240095136
    Abstract: Efficient and effective testing systems and methods are presented. In one embodiment, a test system includes: a user interface configured to enable user interaction with the system; a test board configured to communicatively couple with a plurality of devices under test (DUTs), wherein the DUTs are compute express link (CXL) protocol compliant; and a tester configured to direct testing of the plurality of DUTs, wherein the tester manages testing of the plurality of DUTs, including managing flexible and independent parallel testing across the plurality of DUTs. In one exemplary implementation, the tester generates and manages workloads independently for DUTs included in the plurality of DUTs. The DUTs can be memory devices the tester is configured to test different memory spaces in parallel. The different memory spaces can have various implementations (e.g., included in the plurality of DUTs, different memory spaces are within one of the DUTs included in the plurality of DUTs, etc.).
    Type: Application
    Filed: March 31, 2023
    Publication date: March 21, 2024
    Inventors: Srdjan Malisic, Chi Yuan
  • Publication number: 20240095138
    Abstract: Efficient and effective testing systems and methods are presented. In one embodiment, a test system includes: a user interface configured to enable user interaction with the system; a test board configured to communicatively couple with a plurality of devices under test (DUTs), wherein the DUTs are compute express link (CXL) protocol compliant; and a tester configured to direct testing of the plurality of DUTs, wherein the tester includes a direct access device (DAX) interface that prevents corruption of DUTs. In one exemplary implementation, the tester isolates testing of a particular CXL enabled DUT from undesirable interference and corruption. The tester can prevent inappropriate writing over the DUT's memory. The DUTs reside in the separate per-device space of a Linux operating system rather than an extension of memory space. One of the plurality of DUTs can be a CXL type 3 memory expander device.
    Type: Application
    Filed: March 31, 2023
    Publication date: March 21, 2024
    Inventors: Srdjan Malisic, Chi Yuan
  • Publication number: 20240096800
    Abstract: A semiconductor device includes first and second active regions extending in parallel in a substrate, a plurality of conductive patterns, each conductive pattern of the plurality of conductive patterns extending on the substrate across each of the first and second active regions, and a plurality of metal lines, each metal line of the plurality of metal lines overlying and extending across each of the first and second active regions. Each conductive pattern of the plurality of conductive patterns is electrically connected in parallel with each metal line of the plurality of metal lines.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Inventors: Fei Fan DUAN, Fong-yuan CHANG, Chi-Yu LU, Po-Hsiang HUANG, Chih-Liang CHEN
  • Publication number: 20240099147
    Abstract: In some embodiments, the present disclosure relates to a method in which a first set of one or more voltage pulses is applied to a piezoelectric device over a first time period. During the first time period, the method determines whether a performance parameter of the piezoelectric device has a first value that deviates from a reference value by more than a predetermined value. Based on whether the first value deviates from the reference value by more than the predetermined value, the method selectively applies a second set of one or more voltage pulses to the piezoelectric device over a second time period. The second time period is after the first time period and the second set of one or more voltage pulses differs in magnitude and/or polarity from the first set of one or more voltage pulses.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Inventors: Chi-Yuan Shih, Shih-Fen Huang, You-Ru Lin, Yan-Jie Liao