Abstract: An operating method with goods information is applicable to an electronic device. The operation method includes: obtaining image information associated with one or more goods objects on a target electronic shelf among a plurality of electronic shelves in a network; and performing first communicating with a server for controlling the electronic shelves in the network according to either or both of the image information and feature information associated with the one or more goods objects, wherein feature information is extracted from the image information and the first communicating includes wirelessly transmitting either or both of the image information and the feature information associated with the one or more goods objects to the server.

Abstract: A program recommendation method applicable to a television is provided. The program recommendation method includes the steps of obtaining information of a user's current watching behavior regarding the program genres in the current time interval of the time intervals for the current time; obtaining information of the user's past personal preference regarding the program genres in one of the time intervals corresponding to the current time interval for the past time; analyzing information of the user's current personal preference regarding the program genres in the current time interval of the time intervals for the current time according to the information of the user's current watching behavior and the information of the user's past personal preference; and generating, and providing one or more recommendations of programs available in the current time interval of the time intervals to the user according to the information of the user's current personal preference.

Abstract: An operating method with goods information is applicable to an electronic device. The operation method includes: obtaining image information associated with one or more goods objects on a target electronic shelf among a plurality of electronic shelves in a network; and performing first communicating with a server for controlling the electronic shelves in the network according to either or both of the image information and feature information associated with the one or more goods objects, wherein feature information is extracted from the image information and the first communicating includes wirelessly transmitting either or both of the image information and the feature information associated with the one or more goods objects to the server.

Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.

Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.

Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.

Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.

Abstract: An LED lamp includes a first light device and a second light device. The first light device includes a first cover and a first light strip received in the first cover. The second light device included a second cover and a second light strip received in the second cover. The second light device is movably mounted to the first light device. A light emitting area of the second light strip of the second light device is changeable according to movement of the second light device relative to the first light device whereby a total light emitting area of the LED lamp is adjustable.

Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

Abstract: An exemplary illumination device includes an enclosure, a semiconductor light source accommodated in the enclosure, and an envelope engaged with the enclosure and covering the semiconductor light source. Light generated by the semiconductor light source can project through the envelope and out of the illumination device. The semiconductor light source includes a plurality of light source modules independent from each other. A plurality of air passages are defined in each light source module for air passing therethrough to dissipate heat generated by the semiconductor light source into ambient air.

Abstract: An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

Abstract: A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

Abstract: An LED lamp comprises a lamp housing, a heat sink made of metal and mounted at a bottom side of the lamp housing, a plurality of LED modules, and a vapor chamber having a bottom surface thereof attached to a top surface of the heat sink and having a top surface thereof to which the LED modules are attached, a working liquid is sealed in the vapor chamber. The vapor chamber defines a sealed chamber therein, and the working liquid is phase changeable liquid and is sealed in the sealed chamber. A plurality of ribs is arranged in the vapor chamber for strengthening an integrity of the vapor chamber, and the ribs divide the sealed chamber into a plurality of communicating spaces.

Abstract: A heat sink for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a protrusion projecting downwardly therefrom. A bottom surface of the protrusion is milled to be flat and smooth, whereby the bottom surface can intimately contact the electronic component. A method for manufacturing the heat sink comprising milling a bottom surface of a protrusion punched downwardly from a lower plate, whereby the bottom surface can be flat and smooth sufficiently to have an intimate contact with an electronic component, and sequentially welding an upper plate on the lower plate and a plurality of fins on the lower plate and the upper plate, respectively.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate forms a plurality of bumps projecting upwardly therefrom, which sandwich the heat pipes therebetween to position the heat pipes on the lower plate, wherein some of the heat pipes are bent and sandwiched between two bumps at each bended position, and some of the heat pipes are straight and located near one bump at each end portion thereof.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof.

Abstract: A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate fixed on the lower plate, and a plurality of heat pipes sandwiched between the lower plate and the upper plate. The lower plate includes a panel, a pair of sidewalls extending upwardly from two opposite sides of the panel, and a plurality of flanges extending upwardly from the sidewalls, respectively. The upper plate defines a plurality of cutouts corresponding to the flanges. The flanges fit into the cutouts to position the upper plate on the lower plate, whereby the lower plate and the upper plate are mechanically connected together.

Abstract: A heat transfer device includes a receptacle having a number of partitions disposed for forming a number of fluid flowing passages within the receptacle, an inlet and a path formed in one side and communicating with the inlet and the fluid flowing passages of the receptacle, and a distributor having a tubular member engaged into the inlet and the path of the receptacle and having a number of orifices formed along the tubular member and aligned with the fluid flowing passages of the receptacle for guiding the fluid to evenly flow through the fluid flowing passages of the receptacle respectively. The distributor may include a manifold attached to the tubular member for bypassing the fluid.