Abstract: A semiconductor package includes a base comprising a top surface and a bottom surface that is opposite to the top surface; a first semiconductor chip mounted on the top surface of the base in a flip-chip manner; a second semiconductor chip stacked on the first semiconductor chip and electrically coupled to the base by wire bonding; an in-package heat dissipating element comprising a dummy silicon die adhered onto the second semiconductor chip by using a high-thermal conductive die attach film; and a molding compound encapsulating the first semiconductor die, the second semiconductor die, and the in-package heat dissipating element.

Abstract: Provided is a housing structure of a portable electronic device including a bezel and a back cover. The bezel has a frame body and multiple first fixing assemblies arranged along the frame body. The back cover has a cover body and multiple second fixing assemblies arranged along a peripheral edge of the cover body. The first fixing assemblies and the second fixing assemblies engage with each other along the peripheral edge for the bezel and the back cover to be locked together.

Abstract: A foldable stand suited for a portable electronic device is provided. The foldable stand includes a foldable plate and an attaching member. The foldable plate has a pair of incisions and a plurality of folding portions to be folded into at least one of an unfolded state and a plurality of folded states. In the unfolded state, a strip structure is formed by part of the folding portions located between the incisions, and a ring structure is formed by others to surround the incisions and the strip structure. In at least one of the folded states, the strip structure and the ring structure are separated from each other along the incisions. The attaching member that the portable electronic device attached thereto has a part connected to the foldable plate, and other part of the attaching member is separated from the foldable plate.

Abstract: An electronic device is provided, including a first module, a second module, a hinge member, a first rotary member, a second rotary member, and a wire. The first module and the second module are hinged to the hinge member. The first rotary member and the second rotary member are connected to the hinge member and rotatable around a first axis and a second axis relative to the hinge member, respectively. The wire extends through the first rotary member and the second rotary member to electrically connect the first module and the second module.

Abstract: A connecting mechanism is provided, including a first member, a second member, a first connecting element, a second connecting element, a resilient element, and a ball-shaped element. The first connecting element is connected to the second member. The first connecting element has an opening. The second connecting element is disposed in the first connecting element. The resilient element is connected between the second member and the second connecting element. When the first member moves to a joining position relative to the second member, a column of the first member extends through the opening, and the ball-shaped element is clamped between the first connecting element, the second connecting element and a recess of the column.

Abstract: An electronic device is provided, including a first module, a second module, a hinge member, a first rotary member, a second rotary member, and a wire. The first module and the second module are hinged to the hinge member. The first rotary member and the second rotary member are connected to the hinge member and rotatable around a first axis and a second axis relative to the hinge member, respectively. The wire extends through the first rotary member and the second rotary member to electrically connect the first module and the second module.

Abstract: A method for redistributing cell densities in layout of IC is provided. Initial cell density distribution and routing density distribution are obtained in an initial placement of the IC. White space is inserted into the initial placement according to a specific density value, so as to flatten the initial cell density distribution to the specific density value and obtain a flat cell density distribution. The specific density value is larger than a maximum cell density value within the initial cell density distribution. Cell densities of a first region are increased in the IC according to the routing density distribution and the flat cell density distribution, so as to obtain a modified cell density distribution. The modified cell density distribution is smoothed to obtain a calibrated cell density distribution. The white space is removed from the calibrated cell density distribution to obtain a final placement.

Abstract: A method for redistributing cell densities in layout of IC is provided. Initial cell density distribution and routing density distribution are obtained in an initial placement of the IC. White space is inserted into the initial placement according to a specific density value, so as to flatten the initial cell density distribution to the specific density value and obtain a flat cell density distribution. The specific density value is larger than a maximum cell density value within the initial cell density distribution. Cell densities of a first region are increased in the IC according to the routing density distribution and the flat cell density distribution, so as to obtain a modified cell density distribution. The modified cell density distribution is smoothed to obtain a calibrated cell density distribution. The white space is removed from the calibrated cell density distribution to obtain a final placement.

Abstract: A method for redistributing cell densities in layout of IC is provided. Initial cell density distribution and routing density distribution are obtained in an initial placement of the IC. White space is inserted into the initial placement according to a specific density value, so as to flatten the initial cell density distribution to the specific density value and obtain a flat cell density distribution. The specific density value is larger than a maximum cell density value within the initial cell density distribution. Cell densities of a first region are increased in the IC according to the routing density distribution and the flat cell density distribution, so as to obtain a modified cell density distribution. The modified cell density distribution is smoothed to obtain a calibrated cell density distribution. The white space is removed from the calibrated cell density distribution to obtain a final placement.

Abstract: A method for providing a macro placement of an integrated circuit is provided. An initial placement of the integrated circuit is obtained, wherein the initial placement includes a plurality of first macro blocks. The first macro blocks are divided into a plurality of groups according to the hierarchy of the integrated circuit. A value of layout area is obtained for each of the groups according to macro areas of the first macro blocks. A plurality of candidate placements are obtained for each of the groups according to the value of placement area corresponding to the group, wherein the candidate placement includes the first macro blocks corresponding to the group. A first macro placement is obtained according to a specific placement o selecting from the candidate placements for each of the groups.

Abstract: A method for providing a macro placement of an integrated circuit is provided. An initial placement of the integrated circuit is obtained, wherein the initial placement includes a plurality of first macro blocks. The first macro blocks are divided into a plurality of groups according to the hierarchy of the integrated circuit. A value of layout area is obtained for each of the groups according to macro areas of the first macro blocks. A plurality of candidate placements are obtained for each of the groups according to the value of placement area corresponding to the group, wherein the candidate placement includes the first macro blocks corresponding to the group. A first macro placement is obtained according to a specific placement o selecting from the candidate placements for each of the groups.

Abstract: A method for redistributing cell densities in layout of IC is provided. Initial cell density distribution and routing density distribution are obtained in an initial placement of the IC. White space is inserted into the initial placement according to a specific density value, so as to flatten the initial cell density distribution to the specific density value and obtain a flat cell density distribution. The specific density value is larger than a maximum cell density value within the initial cell density distribution. Cell densities of a first region are increased in the IC according to the routing density distribution and the flat cell density distribution, so as to obtain a modified cell density distribution. The modified cell density distribution is smoothed to obtain a calibrated cell density distribution. The white space is removed from the calibrated cell density distribution to obtain a final placement.

Abstract: A hinge mechanism for a foldable electronic device is provided. The hinge mechanism includes a hinge, a pivot part and a friction part. The hinge and the pivot part are fixed to a first body and a second body of the foldable electronic device respectively. The friction part is connected to the pivot part and selectively contacting the hinge. When the pivot part rotates relative to the hinge to drive the first body to rotate from a close position to an open position in relative to the second body, the friction part does not contact the hinge. When the pivot part rotates relative to the hinge to drive the first body to rotate from the open position to the close position in relative to the second body, the friction part contacts the hinge and limits a rotation of the pivot part on the hinge.

Abstract: A connection mechanism is provided. The connection mechanism includes a first fixing member, a fixer, an elastic element, a second fixing member and a connection element. The first fixing member includes a first side and second side, wherein the first side is opposite to the second side. The fixer passes through the first fixing member and is pivotable relative to the first fixing member along the first direction, wherein the fixer has a head portion and an end portion. The head portion is located on the first side and has an outer surface, and the second portion protrudes from the second side. The elastic element is disposed on the first side of the first fixing member and is abutting the outer surface, to prevent the fixer from rotating along a direction opposite the first direction. The connection element is disposed on the second fixing member and has a hollow structure.

Abstract: A hinge mechanism for a foldable electronic device is provided. The hinge mechanism includes a hinge, a pivot part and a friction part. The hinge and the pivot part are fixed to a first body and a second body of the foldable electronic device respectively. The friction part is connected to the pivot part and selectively contacting the hinge. When the pivot part rotates relative to the hinge to drive the first body to rotate from a close position to an open position in relative to the second body, the friction part does not contact the hinge When the pivot part rotates relative to the hinge to drive the first body to rotate from the open position to the close position in relative to the second body, the friction part contacts the hinge and limits a rotation of the pivot part on the hinge.

Abstract: A connection mechanism is provided. The connection mechanism includes a first fixing member, a fixer, an elastic element, a second fixing member and a connection element. The first fixing member includes a first side and second side, wherein the first side is opposite to the second side. The fixer passes through the first fixing member and is pivotable relative to the first fixing member along the first direction, wherein the fixer has a head portion and an end portion. The head portion is located on the first side and has an outer surface, and the second portion protrudes from the second side. The elastic element is disposed on the first side of the first fixing member and is abutting the outer surface, to prevent the fixer from rotating along a direction opposite the first direction. The connection element is disposed on the second fixing member and has a hollow structure.

Abstract: A laser power control system and method used in an optical disc writer. According to a write power value, the laser power control system drives a laser to output a write power through a first channel. According to a proportional value, the laser power control system drives the laser to output an overdrive power through a second channel. By using a close loop control of the laser power control system, the write power and the overwrite power are independent of the temperature changes.

Abstract: A label pattern can be created on a label side of an optical disc under well focus control. An optical disc is first loaded in an optical disc drive with the label side thereof facing to an optical head of the optical disc drive. Then, the optical head is actuated along a focusing direction. Meanwhile, a light intensity addition signal is generated in response to optical signals reflected from the optical disc and received by the optical head. A closed-loop control operation of the optical head is performed according to the light intensity addition signal after the light intensity addition signal up-crosses a threshold. Then, a label pattern can be defined on the label side of the optical disc with the closed-loop control operation.

Abstract: A drawing control method is used for producing a label pattern on a label side of an optical disc. The optical disc is first loaded into an optical disc drive with the label side facing to an optical pickup head of the optical disc drive. The optical pickup head is controlled to move along a seeking direction from a first track to a second track in a long seeking operation; and then controlled to move along another seeking direction opposite to the seeking direction from the second track to a preset track range between lower track and an upper track. The optical pickup head then draws a label pattern on the label side of the optical disc in the preset track range.

Abstract: A laser power control system and method used in an optical disc writer. According to a write power value, the laser power control system drives a laser to output a write power through a first channel. According to a proportional value, the laser power control system drives the laser to output an overdrive power through a second channel. By using a close loop control of the laser power control system, the write power and the overwrite power are independent of the temperature changes.