Patents by Inventor Chi-Yuan Lo

Chi-Yuan Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8984468
    Abstract: Using an adaptive square mesh for parasitic extraction, small squares of a predetermined minimum size will be placed where accuracy in the parasitic calculations is most critical—around edges, contacts and vias, and corners. Then, in areas where the parasitic analysis is less critical, for example in open spaces, a more coarse grid consisting of larger squares may be used to calculate the parasitic values in those spaces. Squares in the mesh may increase in size gradually to provide more accurate results.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: March 17, 2015
    Assignee: Cadence Design Systems, Inc.
    Inventors: Shun-Lin Su, Yue-Zhong Shu, Chi-Yuan Lo
  • Patent number: 8701066
    Abstract: Some embodiments of the invention provide a method for verifying an integrated circuit (IC) design. The method receives a process description file that specifies a process technology for building the IC. The process description file describes a particular device type in which a first conductor overlaps a second conductor by recessing from the second conductor in one or more cut-outs. Based on the process description file, the method finds a section of the IC design that matches the particular device type and uses the description of the particular device type to compute a capacitance value and a resistance value for the section of the IC design.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: April 15, 2014
    Assignee: Cadence Design Systens, Inc.
    Inventors: Chi-Yuan Lo, Mikhail Khapaev
  • Patent number: 8689157
    Abstract: Some embodiments of the invention provide a method for verifying an integrated circuit (IC) design. The method receives a process description file that specifies a process technology for building the IC. The process description file describes a particular device type in which a first conductor overlaps a second conductor by recessing from the second conductor in one or more cut-outs. Based on the process description file, the method finds a section of the IC design that matches the particular device type and uses the description of the particular device type to compute a capacitance value and a resistance value for the section of the IC design.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: April 1, 2014
    Assignee: Cadence Design Systems, Inc.
    Inventors: Chi-Yuan Lo, Mikhail Khapaev
  • Patent number: 5613102
    Abstract: A method of compressing data used in integrated circuit (IC) layout verifications includes the steps of identifying each circuit component from each layer of the IC chip; sorting each circuit component in an established order; identifying predetermined parameters for each component; determining the difference in value of the parameters for each pair of components in successive order; and storing the difference values for each pair of components.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: March 18, 1997
    Assignee: Lucent Technologies Inc.
    Inventors: Kuang-Wei Chiang, Chi-Yuan Lo, Doowan Paik, Shun-Lin Su
  • Patent number: 5229231
    Abstract: A method is described which reduces the size of the constraint graph used in assembling cells into a tiled module for integrated circuit manufacture. The smaller size significantly reduces the amount of time required to assemble the cells appropriately.
    Type: Grant
    Filed: August 30, 1991
    Date of Patent: July 20, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Debaprosad Dutt, Chi-Yuan Lo