Patents by Inventor Chi-Yun Tseng

Chi-Yun Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for transporting wafers between wafer holders and chambers
    Patent number: 9997384
    Abstract: An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock.
    Type: Grant
    Filed: December 1, 2011
    Date of Patent: June 12, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shao-Yen Ku, Ming-Jung Chen, Tzu Yang Chung, Chi-Yun Tseng, Rui-Ping Chuang
  • Semiconductor device and method of manufacture
    Patent number: 9263337
    Abstract: A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.
    Type: Grant
    Filed: March 8, 2012
    Date of Patent: February 16, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Li Chou, Shao-Yen Ku, Chi-Yun Tseng, Yu-Yen Hsu, Tsai-Pao Su, Hobin Chen, Sheng-Chi Shih
  • Methods for Transporting Wafers Between Wafer Holders and Chambers
    Publication number: 20130142594
    Abstract: An apparatus comprises a process chamber, and a loadlock connected to the process chamber. The loadlock is configured to have a wafer holder disposed therein. The wafer holder is configured to store a plurality of wafers, and is configured to transport the plurality of wafers away from the loadlock.
    Type: Application
    Filed: December 1, 2011
    Publication date: June 6, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shao-Yen Ku, Ming-Jung Chen, Tsu-Yang Chung, Chi-Yun Tseng, Jui-Ping Chuang
  • Semiconductor Device and Method of Manufacture
    Publication number: 20130109140
    Abstract: A system and method for etching a substrate is provided. An embodiment comprises utilizing an inert carrier gas in order to introduce a liquid etchant to a substrate. The inert carrier gas may prevent undesirable chemical reactions from taking place during the etching process, thereby helping to reduce the number of defects that occur to the substrate and other structures during the etching process.
    Type: Application
    Filed: March 8, 2012
    Publication date: May 2, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Li Chou, Shao-Yen Ku, Chi-Yun Tseng, Yu-Yen Hsu, Tsai-Pao Su, Hobin Chen, Sheng-Chi Shih
  • Apparatus and method for transferring wafers by robot
    Patent number: 6206441
    Abstract: An apparatus for transferring wafers by a robot blade and a method for using the apparatus are disclosed. In the apparatus, a robot blade that is equipped with distance sensors mounted in a bottom surface of the blade is provided which senses the distance between the bottom surface of the robot blade and an adjacent surface below the robot blade such that any possible scratching of the adjacent surface is eliminated. The adjacent surface below the robot blade may be a wafer surface in a wafer cassette, or a wafer pedestal surface in a process machine. The distance sensors are mounted in recesses in the bottom surface of the blade which may be suitably capacitance sensors, ultrasonic sensors or optical sensors. The distance sensed by the distance sensors is analyzed by a controller and compared to a predetermined value of a minimum allowable distance such that any danger of scratching the adjacent surface is eliminated.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: March 27, 2001
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ming-Chien Wen, Chuan-Yuan Lu, Chi-Yun Tseng, Su-Yi Doung