Patents by Inventor Chi-Yung Liu

Chi-Yung Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7006882
    Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.
    Type: Grant
    Filed: January 9, 2004
    Date of Patent: February 28, 2006
    Assignee: Macronix International Co., Ltd.
    Inventors: Da-Yi Chang, Kuei Yi Liu, Chi Yung Liu
  • Patent number: 6907306
    Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.
    Type: Grant
    Filed: May 27, 2003
    Date of Patent: June 14, 2005
    Assignee: Macronix International, Co., Ltd.
    Inventors: Chiung-Fang Hsieh, Long-Fan Lin, Ching-Yi Chen, Ching-Feng Yeh, Chi-Yung Liu, Shu-Shung Lin
  • Publication number: 20040243268
    Abstract: A process tool monitoring system is disclosed including a retrieving module, a calculating module, and an output module. The retrieving module retrieves parameter data from a process tool. Where the process tool is a furnace, the parameter data may include furnace temperature data, times of day that wafers were loaded into the furnace, and times of day that wafers were unloaded from the furnace. The retrieving module stores the parameter data in a database, and the calculating module accesses the parameter data within the database, and calculates a present throughput data dependent upon the parameter data, wherein the present throughput data is indicative of a present throughput of the process tool. The output module provides the present throughput data to an operator of the process tool. The process tool monitoring system may be used to monitor multiple process tools, and to compare the throughputs of the multiple process tools.
    Type: Application
    Filed: May 27, 2003
    Publication date: December 2, 2004
    Inventors: Chiung-Fang Hsieh, Long-Fan Lin, Ching-Yi Chen, Ching-Feng Yeh, Chi-Yung Liu, Shu-Shung Lin
  • Publication number: 20040225402
    Abstract: The invention is related to methods and apparatus that advantageously provide compatibility between two or more different computer systems, such as computers used in a manufacturing environment, e.g., a foundry for semiconductor fabrication. For example, a first computer system with a first operating system, such as OS/2® from IBM Corporation, and a second computer system with a second operating system, such as Windows® NT® from Microsoft Corporation. In one embodiment, a transfer module permits an application that executes in the IBM® OS/2® operating system access to files maintained in a component object model (COM+) format from Microsoft Corporation. A routing module transfers data to and from a module with functions created in the component object model (COM+) format. One embodiment of the routing module routes data according to one of four selectable processing paths termed TAPCOM, COMTAP, TAPCOMTAP, and COMTAPCOM.
    Type: Application
    Filed: January 9, 2004
    Publication date: November 11, 2004
    Inventors: Da-Yi Chang, Kuei Yi Liu, Chi Yung Liu