Abstract: An integrated air valve structure includes a main body and two air valves. The main body is formed with two air passages not communicated with each other, a plurality of through holes disposed corresponding to the two air passages, and two valve mounting seats. One valve mounting seat is disposed corresponding to one of the through holes, the other valve mounting seat is disposed corresponding to two of the through holes belonging to the two air passages. The two air valves are disposed on the two valve mounting seats, each air valves includes an air plug facing at least one of the through holes, a valve body assembled with one of the two valve mounting seats for the air plug to move therein, and a coil disposed on the valve body for generating magnetic force to change a position of the air plug.

Abstract: A noise reduction device includes a shaft member being positioned, a stator unit including a coil assembly surrounding the shaft member, a rotor unit, and a noise reducing unit. The rotor unit includes a magnetic unit disposed between the shaft member and the coil assembly and driven by the coil assembly to rotate, and a flywheel set co-rotatably connected to the magnetic unit, and is adapted for contacting a transmission member movable relative to the flywheel set and for driving movement of the transmission member during rotation of the flywheel set. The noise reducing unit surrounds the shaft member, is mounted to the flywheel set, and is for absorbing energy of sound waves generated when the flywheel set contacts the transmission member.

Abstract: An EUV lithographic apparatus includes a wafer stage and a particle removing assembly for cleaning a wafer for an extreme ultraviolet (EUV) lithographic apparatus. The wafer stage includes a measurement side and an exposure side. The particle removing assembly includes particle removing electrodes, an exhaust device and turbomolecular pumps. The particle removing electrodes is configured to direct debris from the chamber by suppressing turbulence such that the debris can be exhausted from the wafer stage to the outside of the processing apparatus. In some embodiments, turbomolecular pumps are turned off in the measurement side of the wafer stage so that an exhaust flow can be guided to an exposure side of the wafer stage. In some embodiments, the speed of voltage rise to the electrodes of the wafer chuck is adjusted.

Abstract: A fan assembly, a heat dissipation assembly and an electronic device. The fan assembly including a casing, an impeller and an air collecting component. The casing has an inner surface, an inlet and at least two outlets. The inner surface is connected to the two outlets. The inlet is in fluid communication with the two outlets. The inner surface faces the impeller. The air collecting component is disposed in one of the two outlets and having an air collecting surface. The air collecting surface faces the impeller. The air collecting surface is connected to the inner surface. The air collecting surface and the inner surface form a gap together with the impeller. The gap is widened along a rotating direction of the impeller. The air collecting component is configured to guide an airflow blown by the impeller to another outlet via the gap.

Abstract: An image sensor includes a pixel array, a dielectric layer, a plurality of first conductive shielding regions, and a plurality of second conductive shielding regions. The pixel array includes photodiodes within a substrate. The dielectric layer is over the substrate. From a plan view, the first conductive shielding regions are adjacent four corners of the pixel array, and the second conductive shielding regions are adjacent four sides of the pixel array. The second conductive region has a length-to-width ratio greater than a length-to-width ratio of the first conductive region.

Abstract: An electric nail gun includes a frame unit, a flywheel that is rotatably connected to the frame unit, a swing arm unit, an impact member, a driving member that is swingably connected to the frame unit, and a strike prevention member that is swingably connected to the frame unit. The swing arm unit is operable to urge the impact member to be in contact with the flywheel. The impact member is urged by rotation of the flywheel to strike a nail. The driving member is operable to swing relative to the swing arm unit between an initial position and a trigger position, and drives the swing arm unit to move toward the flywheel when the driving member swings from the initial position to the trigger position. The strike prevention member is driven by the driving member to swing relative to the impact member and the driving member.

Abstract: Disclosed are a real and virtual identity verification circuit, a system thereof and an electronic transaction method. The circuit is capable of being built in or connected with an electronic device to allow a user to carry out electronic identity verification with his or her unique biological characteristic on a remote server. The real and virtual identity verification circuit comprises a memory unit, an acquisition unit, a processing unit and a communication unit. A verification key code is stored by the memory unit. The acquisition unit acquires the biological characteristic and generates a corresponding biological characteristic code. The processing unit processes the verification key code and the biological characteristic code according to a deal process to generate a corresponding unverified code, and the communication unit transmits the unverified code to the server and awaits a verification result of the electronic identity verification.

Abstract: Alignment of devices formed on substrates that are to be bonded may be achieved through the use of scribe lines between the devices, where the scribe lines progressively increase or decrease in size from a center to an edge of one or more of the substrates to compensate for differences in the thermal expansion rates of the substrates. The devices on the substrates are brought into alignment as the substrates are heated during a bonding operation due to the progressively increased or decreased sizes of the scribe lines. The scribe lines may be arranged in a single direction in a substrate to compensate for thermal expansion along a single axis of the substrate or may be arranged in a plurality of directions to compensate for actinomorphic thermal expansion.

Abstract: A wireless transceiver device includes a communication module and a processor. The communication module is used for receiving and transmitting radio frequency signals. The processor is coupled to the communication module and used for performing the following operations: determining whether to perform a spatial reuse transmission when detecting an overlapping basic service set (OBSS) packet; performing countdown of a spatial reuse backoff counter in response to determining that the spatial reuse transmission is to be performed; performing countdown of an enhanced distributed channel access (EDCA) backoff counter after the OBSS packet is transmitted; and transmitting a data packet via the communication module when one of the spatial reuse backoff counter and the EDCA backoff counter expires.

Abstract: A light emission module includes a laser source, a beam steering element, a focusing lens set, an imaging fiber bundle set, and expansion lens sets. The beam steering element splits a received laser beam into at least two laser beams to the focusing lens set. The imaging fiber bundle set includes a receiving element and branch elements, which the branch elements are individually connected to the receiving element, distributed disposing, and oriented to individual desired scanning directions. The focusing lens set is disposed between the beam steering element and the receiving element. The at least two laser beams are focused on the receiving element and emitted through one of the branch elements. The expansion lens sets, disposed individually corresponding to the branch elements, receives the laser beam emitted from the branch elements and further controls the laser beam to have a spread angle and an expanding angle.

Abstract: An example method of threshold voltage offset calibration at memory device power up comprises: identifying a set of memory pages that have been programmed within a time window; determining, for each voltage offset bin of a plurality of voltage offset bins, a corresponding value of a data state metric produced by a memory access operation with respect to a memory page of the set of memory pages; identifying a subset of the plurality of voltage offset bins, such that memory access operations performed using the corresponding voltage offsets produced respective values of the data state metric that satisfy a predefined quality criterion; selecting, among the subset of the plurality of voltage offset bins, a voltage offset bin that is associated with the lowest voltage offset; and associating the set of memory pages with the selected voltage offset bin.

Abstract: Provided are a composition and a method for preventing thrombogenesis. The composition includes a conjugate of heparin and a viral capsid protein, wherein the heparin is covalently bonded with the viral capsid protein.

Abstract: The invention provides a detection air faucet, including a working chamber and a source port in communication with the working chamber. The working chamber is provided with a pressure sensing member for sensing a change in the pressure in the chamber, and the pressure in the working chamber is affected by an object connected to the source port. The pressure sensing member is provided with a working pressure range. Furthermore, the detection air faucet includes a working pressure maintaining mechanism implemented by a pressure release structure and a pressure maintaining structure. When the pressure in the working chamber exceeding the working pressure range, the working chamber discharges air by the pressure release structure, and when the pressure in the working chamber is lower than a pressure outside the detection air faucet, the air outside the detection air faucet entering into the working chamber by the pressure maintaining structure.

Abstract: A laser beam shaping device includes a multi-zone structure lens and a focusing lens. The multi-zone structure lens includes a lens body and a refractive structure. The lens body has an incident plane and an emission plane, and one of the incident plane and the emission plane is furnished with the refractive structure. The light source passing through the refractive structure deviates and leaves the lens body via the emission plane. The light source passing through the lens body is divided into N sets of light beams. After the N sets of light beams penetrate through the focusing lens, N set of incident beams are formed to project the interface of the first material and the second material in an oblique inward manner with respect to the optical axis of the focusing lens. In additional, a laser processing system and a laser interlocking welding structure respectively are also provided.

Abstract: An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure.

Abstract: An apparatus includes multiple analog to digital converters. Individual analog to digital converters are configured to produce a digital output from an analog input and configured to compute a least significant bit of the digital output by comparing an internal residual voltage for determination of the least significant bit and a residual voltage from another analog to digital converter.

Abstract: Systems and methods for generating a radio frequency (RF) signal by a digital-to-analog converter (DAC) with transmission frequency within a wide transmission frequency range are described. An output reactance of the DAC coupled (directly or indirectly) to one or more antennas corresponds to the transmission frequency of the RF signals. Multiple embodiments of the DAC are described to include circuitry for tuning the output reactance of the DAC, and therefore, shifting a center frequency to select a transmission frequency range (from multiple transmission frequency ranges) for providing the RF signals.

Abstract: An image sensor structure and methods of forming the same are provided. An image sensor structure according to the present disclosure includes a semiconductor substrate including a photodiode, a transfer gate transistor disposed over the semiconductor substrate and having a first channel area, a first dielectric layer disposed over the semiconductor substrate, a semiconductor layer disposed over the first dielectric layer, a source follower transistor disposed over the semiconductor layer and having a second channel area, a row select transistor disposed over the semiconductor layer and having a third channel area, and a reset transistor disposed over the semiconductor layer and having a fourth channel area. The second channel area is greater than the first channel area, the third channel area or the fourth channel area.

Abstract: In a method of fabricating an electronic device, a first nMOS device structure and a second nMOS device structure are formed. Each nMOS device structure includes a gate oxide disposed on a p-type base material and a gate disposed on the gate oxide. N-type dopant implantation is performed to form source and drain regions in the p-type substate of the first nMOS device structure and source and drain regions in the p-type substate of the second nMOS device structure, and to further dope the gate of the first nMOS device structure n-type to form a first nMOS device with the gate doped n-type. P-type dopant implantation is performed to dope the gate of the second nMOS device structure p-type to form the second nMOS device structure with the gate anti-doped p-type.

Abstract: This document describes apparatuses and techniques enabling a scale down capture preview for a panorama capture user interface. This scale down preview enables users to more-easily and more-accurately capture images for a panorama.