Patents by Inventor Chia-Ao Chu

Chia-Ao Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9525224
    Abstract: An electrical connector includes an insulating housing and a plurality of terminals coupled to the insulating housing. The insulating housing includes a positioning body, a head portion extending from a first face of the positioning body, and a tail portion extending from a second face of the positioning body. Each terminal includes a first contact portion, a second contact portion, and a retaining portion between the first contact portion and the second contact portion. The retaining portion includes a first coupling portion coupled to the first contact portion and a second coupling portion between the first coupling portion and the second contact portion. The first coupling portion and the second coupling portion are noncoplanar. The first contact portion is coupled to the head portion, the second contact portion is coupled to the tail portion. The retaining portion extends from the head portion to the tail portion.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: December 20, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yi-Sing Jiang, Yi-Sheng Cheng, Chia-Ao Chu
  • Publication number: 20150029647
    Abstract: An electronic device includes a frame and a display screen. The frame includes a receiving chamber. The receiving chamber has a slot and a first data connecting portion. The display screen is received in the receiving chamber and removable from the receiving chamber. The display screen includes a display surface, a rear surface and a side surface. The display screen further includes an engaging portion and a second data connecting portion. The engaging portion is engaged with the slot of the receiving chamber. The second data connecting portion is configured to exchange data with the first data connecting portion.
    Type: Application
    Filed: July 24, 2013
    Publication date: January 29, 2015
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KUANG-SUNG WANG, CHIA-AO CHU
  • Patent number: D676394
    Type: Grant
    Filed: February 8, 2012
    Date of Patent: February 19, 2013
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventors: Kuang-Sung Wang, Chia-Ao Chu
  • Patent number: D769232
    Type: Grant
    Filed: November 12, 2014
    Date of Patent: October 18, 2016
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Chia-Ao Chu, Wei-Min Chang
  • Patent number: D922365
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 15, 2021
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Yao Liu, Chia-Ao Chu
  • Patent number: D937248
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: November 30, 2021
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Yao Liu, Chia-Ao Chu
  • Patent number: D991929
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: July 11, 2023
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Yao Liu, Chia-Ao Chu
  • Patent number: D1040144
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: August 27, 2024
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Qian-Kun Han, Chia-Ao Chu
  • Patent number: D1055058
    Type: Grant
    Filed: June 21, 2023
    Date of Patent: December 24, 2024
    Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.
    Inventors: Tsung-Yuan Huang, Chia-Ao Chu, Kuang-Sung Wang