Abstract: A PIN photodiode comprising a p region containing a p type dopant, an n region containing an n type dopant, an i region positioned intermediate the p region and the n region, and a relatively thick, undoped buffer region positioned between the n region and the i region which substantially decreases the capacitance of the PIN photodiode such that the photodiode bandwidth is maximized. Typically, the buffer region is formed as a layer of indium phosphide that is at least approximately 0.5 &mgr;m in thickness.

Abstract: An apparatus may be used to deposit metal or conductive layers upon semiconductor wafers using an electrochemical process. The apparatus comprises a housing for retaining a first electrode (e.g., anode) and a second electrode (e.g., cathode), in a fixed spaced-apart relation to each other, with the surface area of the anode exceeding the surface area of the cathode (the wafer). The back surface of the wafer is mounted on a handling disk; the disk has an aperture for accessing the wafer and is held in the housing. A contact probe passes through the aperture to touch the back surface of the wafer, the probe having a spring-loaded spherical radius head for depressurizing the head as it touches the wafer. This apparatus permits a uniform current distribution as the contact probe is not interposed between the electrodes, and the larger surface area of the anode relative to the wafer enhances the production of uniform and reproducible films.

Abstract: Disclosed is a water-soluble solder flux and a method of fabricating circuit boards which does not adversely affect the insulation resistance of the boards. The flux applied to the board comprises a vehicle including at least two random copolymers of polyalkylene glycol with various amounts of ethylene oxide and propylene oxide. The flux also exhibits a low viscosity for improved copper coverage.

Abstract: A multi-functional electrically activated stove which includes a stove housing (10) defining an upper concave housing (11) and a similarly formed concave housing above and below a heat conducting board (12) having mounted thereon an electrical heating tube (13). The heat conducting board includes a plurality of apertures (121) to allow radiant heat to pass to the lower housing chamber in an efficient manner. The stove housing (10) includes an opening (17) formed in a frontal wall for reversible insert of a lower grill member (20) having webs (21) formed thereon for positioning foodstuffs. Insertable within the upper concave housing (11) is an upper baking member (30), a flat pan member (40), and a steam plate (50) which is mountable within the flat pan member (40). A stove cover (60) is mountable over the stove housing (10) to provide for a closed internal chamber.