Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.

Abstract: A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Abstract: A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof, and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.

Abstract: A light emitting device including a carrying element having two electric conductors connectable to a power source, a light emitting element disposed on the carrying element and electrically connected to the two electric conductors, and at least one correction element electrically connected to the light emitting element, wherein the light emitting element is adapted to provide a light source upon connection of the two electric conductors with the power source, and the at least one correction element allows the light emitting element to have functions of temperature compensation, voltage correction, or surge absorption.

Abstract: The present invention relates to a method for fabricating a crystal fiber having different regions of polarization inversion, comprising the following steps: (a) providing a source material; (b) putting the source material into a fabricating apparatus; and (c) forming the crystal fiber from the source material, and applying an external electric field on the grown crystal fiber during the growth procedure of the crystal fiber so as to induce micro-swing of the crystal fiber for polarization inversion, whereby poling at the time a ferroelectric crystalline body is being formed, whereas the conventional methods are designed for poling a ferroelectric crystalline body after it has been formed.

Abstract: The present invention relates to an apparatus for making a source material into a crystal fiber having different regions of polarization inversion. The apparatus of the present invention is similar to a laser-heated pedestal growth (LHPG) apparatus, characterized in that a first electric field generating device and a second electric field generating device are included. The first electric field generating device is used for providing a first external electric field which is used for poling the crystal fiber and inducing micro-swing of the crystal fiber. The second electric field generating device is disposed on a predetermined position above the first electric field generating device for providing a second external electric field to control and maintain the amplitude of the micro-swing. Whereby, the growth condition of the crystal fiber can be controlled precisely, and a uniformly and regularly periodic polarization inversion structure is fabricated.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Abstract: The present invention relates to a combined light emitting diode (LED) package structure and a fabricating method for fabricating the same. The combined LED package structure includes an LED chip, a conductive structure and an encapsulant. The encapsulant encapsulates the LED chip and a portion of the conductive structure. The conductive structure has a thick metal member and a thin metal member. The thick metal member is used for carrying the LED chip, provide heat absorbing and heat dissipating paths to the LED chip, the bottom and a portion of the lateral side thereof are exposed to the outside of the encapsulant to increase heat dissipating area. The thin metal member is electrically connected to the LED chip via at least two conductive leads which are extended to a region outside of the encapsulant to serve as outside electrodes of the LED package structure.

Abstract: A light emitting device is proposed, which emits light while connected to the power. The light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection. The light emitting device of the present invention has advantages of short current path, low series thermal resistance and low cost. In addition, the depth of the recess can further be increased to improve light collecting efficiency.

Abstract: The present invention relates to an apparatus for making a source material into a crystal fiber having different regions of polarization inversion. The apparatus of the present invention is similar to a laser-heated pedestal growth (LHPG) apparatus, characterized in that a first electric field generating device and a second electric field generating device are included. The first electric field generating device is used for providing a first external electric field which is used for poling the crystal fiber and inducing micro-swing of the crystal fiber. The second electric field generating device is disposed on a predetermined position above the first electric field generating device for providing a second external electric field to control and maintain the amplitude of the micro-swing. Whereby, the growth condition of the crystal fiber can be controlled precisely, and a uniformly and regularly periodic polarization inversion structure is fabricated.

Abstract: The present invention relates to a method for fabricating a crystal fiber having different regions of polarization inversion, comprising the following steps: (a) providing a source material; (b) putting the source material into a fabricating apparatus; and (c) forming the crystal fiber from the source material, and applying an external electric field on the grown crystal fiber during the growth procedure of the crystal fiber so as to induce micro-swing of the crystal fiber for polarization inversion, whereby poling at the time a ferroelectric crystalline body is being formed, whereas the conventional methods are designed for poling a ferroelectric crystalline body after it has been formed.