Patents by Inventor Chia Chen

Chia Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180292713
    Abstract: A display may have display layers that form an array of pixels. The display layers may include a first layer that includes a light-blocking matrix and a second layer that overlaps the first layer. The first layer may include quantum dot elements formed in openings in the light-blocking matrix. The light-blocking matrix may be formed from a reflective material such as metal. The second layer may include color filter elements that overlap corresponding quantum dot elements in the first layer. Substrate layers may be used to support the first and second layers and to support thin-film transistor circuitry that is used in controlling light transmission through the array of pixels. The display layers may include a liquid crystal layer, polarizer layers, filter layers for reflecting red and green light and/or other light to enhance light recycling, and layers with angularly dependent transmission characteristics.
    Type: Application
    Filed: August 31, 2017
    Publication date: October 11, 2018
    Inventors: Jean-Jacques P. Drolet, Yuan Chen, Jonathan S. Steckel, Ion Bita, Dmitry S. Sizov, Chia Hsuan Tai, John T. Leonard, Lai Wang, Ove Lyngnes, Xiaobin Xin, Zhibing Ge
  • Publication number: 20180295339
    Abstract: An apparatus including a processor and a non-transitory storage medium is provided. The non-transitory storage medium includes a program code executable by the processor. The apparatus is configured to execute the program code with the processor for processing a source image to generate a target image.
    Type: Application
    Filed: June 12, 2018
    Publication date: October 11, 2018
    Applicant: Novatek Microelectronics Corp.
    Inventors: Chieh-Cheng Chen, Chih-Chia Kuo
  • Publication number: 20180294381
    Abstract: A light emitting diode device is provided. The light emitting diode device has a substrate, a plurality of metal pads, a plurality of LEDs and a first metal conductive wire. A plurality of first metal pads of the metal pads are disposed on a first surface of the substrate, and the LEDs are disposed on a part of the first metal pads. Each of the LEDs has at least one first electrode contact. The first electrode contact of each of the LEDs electrically connected to the first metal conductive wire has the same electrode contact polarity. Moreover, another light emitting diode device is also provided.
    Type: Application
    Filed: May 14, 2018
    Publication date: October 11, 2018
    Applicant: Everlight Electronics Co., Ltd.
    Inventors: Wei-Ting Wu, Jun Yu Chen, Han-Hsiang Chiang, Hsien-Chia Lin, Tzu-Pin Lin
  • Patent number: 10098250
    Abstract: An electronic device includes a casing, a first power housing and a second power housing. The casing is equipped with a main board. The first power housing is disposed in the casing. The first power housing has a plurality of engaging portions. The second power housing has a plurality of engaging grooves. Each of the engaging grooves is corresponding to one of the engaging portions. Each of the engaging grooves is L-shaped and has an opening. When the second power housing is disposed on the first power housing and the engaging portion enters the engaging groove through the opening, the second power housing is capable of moving with respect to the first power housing in a horizontal direction, such that the engaging portion is engaged with the engaging groove.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: October 9, 2018
    Assignees: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chia-Chen Lu, Chun-Ying Yang, Hsin-Liang Chen
  • Publication number: 20180287465
    Abstract: A shock wave generating unit includes a housing and a disk in the housing. The disk includes a vibration plate, which corresponds to a shock wave transmission member covering a first opening of the housing and includes an insulating thin elastic plate and a thin metal plate. The insulating thin elastic plate, with one side corresponding to the shock wave transmission member and the opposite side provided with the thin metal plate, has a hollow portion for partially exposing the thin metal plate and forms an accommodating cavity together with the exposed portion of the thin metal plate and the shock wave transmission member. A shock wave transmission medium can circulate through the accommodating cavity via a channel in the housing and is in contact with the exposed portion of the thin metal plate to facilitate dissipation of the heat generated by the disk during operation.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: CHIA-CHI LIN, YUNG-CHEN SU, PO-HSIANG KUO
  • Publication number: 20180281244
    Abstract: A solid thermal balancing composite material with lightweight is formed by a reinforced composite material pressured by a molding machine after going through a powder filling equipment. The reinforced composite material is a mixture of inorganic filler powders and polymer adhesives after granulation. The specific gravity of the solid thermal balancing composite material is no greater than 2.0. In addition, the present invention is adjustable in different shapes for various applications in heat dissipation.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 4, 2018
    Inventors: CHING-I CHOU, YU-CHIA CHEN
  • Publication number: 20180280231
    Abstract: An invasive shock wave applicator for applying shock waves sideways includes a bar-shaped invasive member and a disk. The invasive member defines a lateral side, has a first end with a recess extending inward from the lateral side, and is provided with a shock wave transmission member detachably sealing the opening of the recess. The disk is embedded in the invasive member; divides the recess into first and second receiving rooms, which are adjacent to and away from the shock wave transmission member respectively; and is provided with a vibration plate adjacent to the first receiving room and facing the shock wave transmission member. The first receiving room is filled with a shock wave transmission medium. Shock waves propagate toward the lateral side of the invasive member to facilitate the performance of an invasive shock wave treatment in a human cavity of the human body.
    Type: Application
    Filed: March 31, 2017
    Publication date: October 4, 2018
    Inventors: CHIA-CHI LIN, YUNG-CHEN SU, PO-HSIANG KUO
  • Publication number: 20180282871
    Abstract: A method of forming a patterned metal unit on an article. The method includes the steps of: providing an article that has an insulating surface; transferring a catalyst layer onto the insulating surface of the article, the catalyst layer including a catalytic material; removing a part of the catalyst layer to form a patterned catalyst layer; and forming a patterned metal layer on the patterned catalyst layer by an electroless plating technique to obtain a patterned metal unit that is constituted by the patterned catalyst layer and the patterned metal layer.
    Type: Application
    Filed: April 30, 2018
    Publication date: October 4, 2018
    Applicant: Taiwan Green Point Enterprises Co., Ltd.
    Inventors: Pen-Yi LIAO, Hui-Ching CHUANG, Chih-Hao CHEN, Jing-Yi YANG, Wen-Chia TSAI, Yao-Tsung HO
  • Publication number: 20180288430
    Abstract: Aspects of the disclosure provide a video coding method for processing a current prediction unit (PU) with a sub-PU temporal motion vector prediction (TMVP) mode. The method can include receiving the current PU including sub-PUs, determining an initial motion vector that is a motion vector of a spatial neighboring block of the current PU, performing a searching process to search for a main collocated picture in a sequence of reference pictures of the current PU based on the initial motion vector, and obtaining collocated motion information in the main collocated picture for the sub-PUs of the current PU. The searching process can include turning on motion vector scaling operation for searching a subset of the sequence of reference pictures, and turning off the motion vector scaling operation for searching the other reference pictures in the sequence of reference pictures.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Applicant: MEDIATEK INC.
    Inventors: Chun-Chia Chen, Chih-Wei Hsu, Ching-Yeh Chen, Yu-Wen Huang
  • Patent number: 10090196
    Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.
    Type: Grant
    Filed: February 8, 2016
    Date of Patent: October 2, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsun-Chung Kuang, Yen-Chang Chu, Cheng-Tai Hsiao, Ping-Yin Liu, Lan-Lin Chao, Yeur-Luen Tu, Chia-Shiung Tsai, Xiaomeng Chen
  • Publication number: 20180278002
    Abstract: An electronic device adapted to be detachably assembled to a lamp holder having a lamp socket is provided. The electronic device includes an adaptor module and a functional module. The adaptor module includes a lamp connector corresponding to the lamp socket, a first connector electrically connected to the lamp connector, and a first engaging member adjacent to the first connector. The functional module includes a second connector and a second engaging member. The second engaging member of the functional module is detachably connected to the first engaging member of the adaptor module. When the functional module is assembled to the adaptor module, the second connector is electrically connected to the first connector.
    Type: Application
    Filed: March 19, 2018
    Publication date: September 27, 2018
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Tzu-Chien Lai, Chia-Chen Lin
  • Patent number: 10082471
    Abstract: A semiconductor structure includes a wafer comprising a plurality of viewing fields defined thereon, a plurality of dies defined by a scribe line formed in each viewing field, a plurality of mark patterns formed in the scribe line, and a plurality of anchor pattern respectively formed in the review fields, the anchor patterns being different from the mark patterns.
    Type: Grant
    Filed: January 2, 2017
    Date of Patent: September 25, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yung-Teng Tsai, Hung-Chin Lin, Chia-Chen Sun, Chih-Yu Wu, Jun-Ming Chen, Chung-Chih Hung, Sheng-Chieh Chen
  • Patent number: 10084076
    Abstract: A semiconductor device includes an active layer, a source electrode, a drain electrode, a gate electrode, an interlayer dielectric, an inter-source layer, an inter-source plug, an inter-drain layer, an inter-drain plug, an inter-gate layer, and an inter-gate plug. The active layer is made of III-V group semiconductors. The source electrode, the drain electrode, and the gate electrode are disposed on the active layer. The gate electrode is disposed between the source electrode and the drain electrode. The interlayer dielectric covers the source electrode, the drain electrode, and the gate electrode. The inter-source layer, the inter-drain layer, and the inter-gate layer are disposed on the interlayer dielectric. The inter-source plug is electrically connected to the source electrode and the inter-source layer. The inter-drain plug is electrically connected to the drain electrode and the inter-drain layer. The inter-gate plug is electrically connected to the gate electrode and the inter-gate layer.
    Type: Grant
    Filed: October 18, 2016
    Date of Patent: September 25, 2018
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Li-Fan Lin, Chun-Chieh Yang, Wen-Chia Liao, Ching-Chuan Shiue, Shih-Peng Chen
  • Patent number: 10082655
    Abstract: A differential filtering chromatic confocal microscopic system comprises a chromatic dispersion objective for receiving and axially dispersing a broadband light from a light source and projecting dispersed lights onto an object thereby forming an object light reflected therefrom; an optical modulation module for dividing the object light into a first and a second object lights; a pair of optical intensity sensing module, respectively having a spatial filter with a different pinhole diameter or a slit width from each other, for detecting the first and second object lights, thereby obtaining a plurality of first and second optical intensity signals; and a signal processor for respectively processing the plurality of first and second optical intensity signals thereby obtaining a plurality of differential rational values of optical intensity and determining a corresponding object depth associated with each differential rational value according to a relation between signal intensity ratio and object surface depth.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: September 25, 2018
    Assignee: NATIONAL TAIWAN UNIVERSITY
    Inventors: Liang-Chia Chen, Jiun-Da Lin
  • Publication number: 20180269107
    Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 20, 2018
    Inventors: Yat-Kai Sun, Chao-Nan Chen, Hung-Lin Shih, Che-Hung Huang, Wei-Lun Hsu, Cheng-Chia Liu
  • Patent number: 10079688
    Abstract: A network port includes a connection port, a PD unit, a PSE unit, a control unit, and a switch unit. The connection port is connected to an external Ethernet port. The control unit determines a type of the external Ethernet port and outputs determination signal correspondingly. The switch unit selectively connects the PSE unit to the connection port, or connects the PD unit to the connection port according to the determination signal output by the control unit. An Ethernet device is also provided. The network port and the Ethernet device integrate PD and PSE in a port, and switch to corresponding PSE mode or PD mode automatically according to the PSE device or PD device.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: September 18, 2018
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Yu-Chia Chen
  • Patent number: 10079067
    Abstract: A data read method and a non-volatile memory apparatus using the same are provided. The data read method includes: obtaining a first read current and a second read current from a memory cell pair of the non-volatile memory; performing a calculation operation according to the first read current and the second read current to obtain a calculation result; and determining a logical state of the memory cell pair according to the calculation result. The calculation operation includes at least a signal addition operation and a signal multiplying operation.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 18, 2018
    Assignee: Winbond Electronics Corp.
    Inventors: Frederick Chen, Shao-Ching Liao, Ping-Kun Wang, Chia-Hua Ho
  • Patent number: 10079180
    Abstract: A method of forming a semiconductor device includes following steps. First of all, plural mandrel patterns are formed on a target layer. Then, plural capping layers are formed to cover a top region and sidewalls of each of the mandrel patterns, respectively. Next, plural spacers are formed at two sides of each of the capping layers, respectively. Following these, a portion of the spacers and the capping layers covered on the top regions of the mandrel patterns are simultaneously removed, and the capping layers is then removed completely.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: September 18, 2018
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yat-Kai Sun, Chao-Nan Chen, Hung-Lin Shih, Che-Hung Huang, Wei-Lun Hsu, Cheng-Chia Liu
  • Publication number: 20180260599
    Abstract: The fingerprint sensing circuit includes sensing units and a sensing circuit. The sensing units are arranged as columns and rows. Each of the sensing units includes a sensing electrode. The sensing circuit is electrically connected to the sensing electrodes in at least two first sensing units of the sensing units in a first period to obtain a first fingerprint grey level.
    Type: Application
    Filed: March 12, 2017
    Publication date: September 13, 2018
    Inventors: Shing-Chia CHEN, Yaw-Guang CHANG, Wei-Ting SUEN
  • Publication number: 20180262445
    Abstract: A method of a cross-region multilevel band broadcast structure includes: selecting a main band for broadcasting in a full region; selecting a first secondary band for broadcasting in a first region within the full region; and selecting a second secondary band for broadcasting in a second region within the full region. The main band, the first secondary band and the second secondary band are different bands.
    Type: Application
    Filed: October 12, 2017
    Publication date: September 13, 2018
    Inventors: Chia-Shiang Shih, Tao-Hsuan Wu, Cheng-Min Jen, Hou-Chen Liao, Han-Lin Shih