Abstract: A Schottky diode includes a substrate, a first drift region in the substrate, a second drift region in the substrate, a first dielectric layer disposed over the substrate, a first doped region in the first drift region, a second doped region in the second drift region, a third doped region in the first drift region, and a metal field plate disposed over the first dielectric layer. The first drift region and the first doped region include a first conductivity type. The second drift region, the second doped region and third doped region include a second conductivity type complementary to the first conductivity type. The first dielectric layer overlaps a portion of the first drift region and a portion of the second drift region. The second doped region is separated from the first doped region.

Abstract: A sealing article includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: A method of making a sealing article that includes a body and a coating layer disposed on at least one surface of the body. The body comprises a polymeric elastomer such as perfluoroelastomer or fluoroelastomer. The coating layer comprises at least one metal. The sealing article may be a seal, a gasket, an O-ring, a T-ring or any other suitable product. The sealing article is resistant to ultra-violet (UV) light and plasma, and may be used for sealing a semiconductor processing chamber.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: A dock for a portable electronic device includes a base, a cradle coupled to the base and defining an interior volume configured to receive the portable electronic device, and a security apparatus. The security apparatus is configured to move between a first position where the security apparatus is configured to couple to the portable electronic device, and a second position where the security apparatus is configured to disengage the portable electronic device. The dock includes a detect mechanism coupled to the security apparatus for movement relative to the cradle. The detect mechanism is configured to block insertion of the portable electronic device into the cradle when the security apparatus is in the first position.

Abstract: A dock for a portable electronic device including a base, a controller, and a locking element configured to engage the portable electronic device. The locking element includes an electronic actuator configured to unlock the locking element. The controller includes a power supply in electronic communication with a utility power input connection and an external power source input connection. The power supply is configured to receive power from either the utility power input connection or the external power source input connection. The electronic processor is configured to receive an indication to unlock the locking element, and to provide power to the electronic actuator to unlock the locking element upon receiving the indication. The external power input is provided to the power supply from the external power source input connection based on no utility power input being present at the utility power input connection.