Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.

Abstract: A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electrodes. The substrate has first and second board surfaces opposite to each other. The vias penetrate through the first board surface and the second board surface, and a part of the vias is disposed in a first die-bonding region on which a chip is to be arranged. The electrodes extend from the first board surface to the second board surface through the vias. The dam is formed on the first board surface to surround the first die-bonding region, and the dam has a height higher than that of the chip. The metal shielding layer covers the dam and a part of the first board surface that do not overlap with the electrodes.

Abstract: An electronic bead string includes a main bead, a plurality of secondary beads, a displacement sensor, a memory, and a processor. The main bead and the secondary beads are strung together to form a bead string. The displacement sensor is fixed in the main bead to output two-dimensional displacement signals, the memory stores the two-dimensional displacement signals, and the processor determines whether a rotation cycle of the electronic bead string is an approved rotation cycle according to the two-dimensional displacement signals.

Abstract: An electronic bead string includes a main bead, a plurality of secondary beads, a displacement sensor, a memory, and a processor. The main bead and the secondary beads are strung together to form a bead string. The displacement sensor is fixed in the main bead to output two-dimensional displacement signals, the memory stores the two-dimensional displacement signals, and the processor determines whether a rotation cycle of the electronic bead string is an approved rotation cycle according to the two-dimensional displacement signals.

Abstract: A wireless expanding system includes an electronic device and a wireless expanding interface, and the wireless expanding interface is connected to the electronic device. The electronic device is configured to execute an operational procedure, and to generate an operational signal according to the operational procedure. The wireless expanding interface is configured to transmit the operational signal to a function expanding device. The function expanding device includes a displayer. When the displayer receives the operational signal via the wireless expanding interface, the displayer is configured to display an operational interface of the operational procedure.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A game controller device comprises an assembling component and at least one input module. The assembling component comprises a loading surface and a rear surface relative to each other. The assembling component is for accommodating an electronic device. The at least one input module comprises a control surface. The at least one input module is movably connected to a side of the assembling component to have a first using position and a second using position. The at least one input module covers the rear surface when the at least one input module is located at the first using position. The at least one input module is disengaged from the rear surface and both the control surface and the loading surface face along a same direction when the at least one input module is located at the second using position.

Abstract: An electronic device includes an input module, a connection assembly and a display module. The input module has a recess structure. The connection assembly includes a link member and a support plate. The link member has a first end and a second end, and the first end is pivotally disposed on one side of the input module. The support plate has a first edge and a second edge, and the first edge is pivotally disposed on the second end. The display module is pivotally disposed on the second edge. The recess structure is configured for accommodating the support plate.

Abstract: A selective assembling type computing device includes a host computer and at least one peripheral device. The host computer has a first host external connection surface and a second host external connection surface, and the peripheral device has a first peripheral device external connected surface and a second peripheral device external connected surface. The peripheral device is provided for selectively assembling to the first host external connection surface or the second host external connection surface through assembling the second peripheral device external connected surface to the first host external connection surface or through assembling the first peripheral device external connected surface to the second host external connection surface. When the peripheral device is assembled to the host computer, the host computer detects the peripheral device to obtain at least one electrical operating parameter of the peripheral device to accordingly transmit a working power to the peripheral device.

Abstract: An electronic device includes an input module, a connection assembly and a display module. The input module has a recess structure. The connection assembly includes a link member and a support plate. The link member has a first end and a second end, and the first end is pivotally disposed on one side of the input module. The support plate has a first edge and a second edge, and the first edge is pivotally disposed on the second end. The display module is pivotally disposed on the second edge. The recess structure is configured for accommodating the support plate.

Abstract: An electronic device with supporting stands includes an input/output module, two stands and a limiter. The two stands are obliquely disposed on the back side of the input/output module. The stands are limited by the limiter to move synchronously. At the same time, the limiter has two slots penetrated by the stands to limit moving range for the stands. Then the stands are controlled to swing with an angle and finally the visual angle of the input/output module is varied in suitable range.

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.