Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.

Abstract: Various embodiments of the present application are directed towards an integrated memory chip comprising a memory array with a strap-cell architecture that reduces the number of distinct strap-cell types and that reduces strap-line density. In some embodiments, the memory array is limited to three distinct types of strap cells: a source line/erase gate (SLEG) strap cell; a control gate/word line (CGWL) strap cell; and a word-line strap cell. The small number of distinct strap-cell types simplifies design of the memory array and further simplifies design of a corresponding interconnect structure. Further, in some embodiments, the three distinct strap-cell types electrically couple word lines, erase gates, and control gates to corresponding strap lines in different metallization layers of an interconnect structure. By spreading the strap lines amongst different metallization layers, strap-line density is reduced.

Abstract: Various embodiments of the present application are directed towards an integrated memory chip comprising a memory array with a strap-cell architecture that reduces the number of distinct strap-cell types and that reduces strap-line density. In some embodiments, the memory array is limited to three distinct types of strap cells: a source line/erase gate (SLEG) strap cell; a control gate/word line (CGWL) strap cell; and a word-line strap cell. The small number of distinct strap-cell types simplifies design of the memory array and further simplifies design of a corresponding interconnect structure. Further, in some embodiments, the three distinct strap-cell types electrically couple word lines, erase gates, and control gates to corresponding strap lines in different metallization layers of an interconnect structure. By spreading the strap lines amongst different metallization layers, strap-line density is reduced.

Abstract: A method for manufacturing an extra low-k (ELK) inter-metal dielectric (IMD) layer includes forming a first IMD layer including a plurality of dielectric material layers over a substrate. An adhesion layer is formed over the first IMD layer. An ELK dielectric layer is formed over the adhesion layer. A protection layer is formed over the ELK dielectric layer. A hard mask is formed over the protection layer and is patterned to create a window. Layers underneath the window are removed to create an opening. The removed layers include the protection layer, the ELK dielectric layer, the adhesion layer, and the first IMD layer. A metal layer is formed in the opening.

Abstract: An electronic bead string includes a main bead, a plurality of secondary beads, a displacement sensor, a memory, and a processor. The main bead and the secondary beads are strung together to form a bead string. The displacement sensor is fixed in the main bead to output two-dimensional displacement signals, the memory stores the two-dimensional displacement signals, and the processor determines whether a rotation cycle of the electronic bead string is an approved rotation cycle according to the two-dimensional displacement signals.

Abstract: An electronic bead string includes a main bead, a plurality of secondary beads, a displacement sensor, a memory, and a processor. The main bead and the secondary beads are strung together to form a bead string. The displacement sensor is fixed in the main bead to output two-dimensional displacement signals, the memory stores the two-dimensional displacement signals, and the processor determines whether a rotation cycle of the electronic bead string is an approved rotation cycle according to the two-dimensional displacement signals.

Abstract: A wireless expanding system includes an electronic device and a wireless expanding interface, and the wireless expanding interface is connected to the electronic device. The electronic device is configured to execute an operational procedure, and to generate an operational signal according to the operational procedure. The wireless expanding interface is configured to transmit the operational signal to a function expanding device. The function expanding device includes a displayer. When the displayer receives the operational signal via the wireless expanding interface, the displayer is configured to display an operational interface of the operational procedure.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.

Abstract: A computer device with at least one heat-dissipation channel includes a master unit and a peripheral unit. A case of the master unit includes a first connection surface including a first hole. The first hole communicates to an external space through a first heat-dissipation channel inside the master unit. A case of the peripheral unit includes a second connection surface including a second hole. The second hole communicates to the external space through a second heat-dissipation channel. A fan is located inside the second peripheral unit channel. When the first connection surface and the second connection surface are aligned to connect with each other, the first heat-dissipation channel, the first hole, the second hole and the second heat-dissipation channel are sequentially communicated in space to form an integrated heat-dissipation channel for guiding a cooling airflow driven by the fan to pass therethrough.

Abstract: A game controller device comprises an assembling component and at least one input module. The assembling component comprises a loading surface and a rear surface relative to each other. The assembling component is for accommodating an electronic device. The at least one input module comprises a control surface. The at least one input module is movably connected to a side of the assembling component to have a first using position and a second using position. The at least one input module covers the rear surface when the at least one input module is located at the first using position. The at least one input module is disengaged from the rear surface and both the control surface and the loading surface face along a same direction when the at least one input module is located at the second using position.

Abstract: An electronic device includes an input module, a connection assembly and a display module. The input module has a recess structure. The connection assembly includes a link member and a support plate. The link member has a first end and a second end, and the first end is pivotally disposed on one side of the input module. The support plate has a first edge and a second edge, and the first edge is pivotally disposed on the second end. The display module is pivotally disposed on the second edge. The recess structure is configured for accommodating the support plate.

Abstract: A selective assembling type computing device includes a host computer and at least one peripheral device. The host computer has a first host external connection surface and a second host external connection surface, and the peripheral device has a first peripheral device external connected surface and a second peripheral device external connected surface. The peripheral device is provided for selectively assembling to the first host external connection surface or the second host external connection surface through assembling the second peripheral device external connected surface to the first host external connection surface or through assembling the first peripheral device external connected surface to the second host external connection surface. When the peripheral device is assembled to the host computer, the host computer detects the peripheral device to obtain at least one electrical operating parameter of the peripheral device to accordingly transmit a working power to the peripheral device.

Abstract: An electronic device includes an input module, a connection assembly and a display module. The input module has a recess structure. The connection assembly includes a link member and a support plate. The link member has a first end and a second end, and the first end is pivotally disposed on one side of the input module. The support plate has a first edge and a second edge, and the first edge is pivotally disposed on the second end. The display module is pivotally disposed on the second edge. The recess structure is configured for accommodating the support plate.

Abstract: An electronic device with supporting stands includes an input/output module, two stands and a limiter. The two stands are obliquely disposed on the back side of the input/output module. The stands are limited by the limiter to move synchronously. At the same time, the limiter has two slots penetrated by the stands to limit moving range for the stands. Then the stands are controlled to swing with an angle and finally the visual angle of the input/output module is varied in suitable range.

Abstract: A USB socket is disposed on a casing for connecting to a USB plug. The USB socket includes a piercing structure, a substrate and a plurality of terminals. The piercing structure is formed on a surface of the casing, and a main board is disposed inside the casing. An internal wall of the piercing structure can buckle the USB plug when the USB plug inserts into the piercing structure. The substrate is disposed on the main board and located inside the piercing structure. An integrated circuit is disposed on the substrate. The plurality of terminals is disposed on the substrate and coupled to the integrated circuit. The USB plug is electrically connected to the substrate and the terminals when the USB plug inserts into the piercing structure.