Patents by Inventor Chia Chi Chen

Chia Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240125771
    Abstract: The present invention relates to a reaction platform, which comprises: a machine body with a bottom plate for placing non-porous substrates; and a coater module configured on the top of the machine body and capable of maintaining a preset of a predetermined height for moving along the surface of non-porous substrate, wherein the coater module has one or more slits, and a target liquid can be directly injected or sucking in from the outside of the coater module through the slit, and spreading the target liquid onto a surface of the non-porous substrate while moving along the non-porous substrate; wherein the surface of the non-porous substrate has a target to be coated. The reaction platform of the present invention can not only save time, labor and cost, but also have accurate and reproducible experimental results, showing better results than traditional methods.
    Type: Application
    Filed: July 25, 2023
    Publication date: April 18, 2024
    Inventors: An-Bang Wang, Shih-Yu Chen, Tung-Hung Su, Chia-Chi Chu, Chia-Chien Yen, Yu-Wei Chiang
  • Patent number: 11955515
    Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Chuan Chiu, Chia-Hao Chang, Cheng-Chi Chuang, Chih-Hao Wang, Huan-Chieh Su, Chun-Yuan Chen, Li-Zhen Yu, Yu-Ming Lin
  • Patent number: 11955664
    Abstract: A battery module includes an insulating base, a pair of electrodes and multiple battery packs. Each electrode is installed to the insulating base and has a bridge portion and a wire connecting part exposed from the insulating base, and a pair of lugs is extended smoothly from each battery pack, and an end of at least a part of the lugs is attached to each bridge portion correspondingly. Therefore, the lug is not being twisted or deformed easily, and the battery module may have good conductive efficiency, long service life, and convenience of changing the battery pack.
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: April 9, 2024
    Assignee: AMITA TECHNOLOGIES INC.
    Inventors: Chueh-Yu Ko, Hou-Chi Chen, Chia-Wen Yen, Ming-Hsiao Tsai
  • Patent number: 11948920
    Abstract: Provided are a semiconductor device and a method for manufacturing the same, and a semiconductor package. The semiconductor device includes a die stack and a cap substrate. The die stack includes a first die, second dies stacked on the first die, and a third die stacked on the second dies. The first die includes first through semiconductor vias. Each of the second dies include second through semiconductor vias. The third die includes third through semiconductor vias. The cap substrate is disposed on the third die of the die stack. A sum of a thickness of the third die and a thickness of the cap substrate ranges from about 50 ?m to about 80 ?m.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: I-Chun Hsu, Yan-Zuo Tsai, Chia-Yin Chen, Yang-Chih Hsueh, Yung-Chi Lin, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 11937932
    Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: March 26, 2024
    Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, TUNGHAI UNIVERSITY
    Inventors: Chieh-Liang Wu, Chun-Te Huang, Cheng-Hsu Chen, Tsai-Jung Wang, Kai-Chih Pai, Chun-Ming Lai, Min-Shian Wang, Ruey-Kai Sheu, Lun-Chi Chen, Yan-Nan Lin, Chien-Lun Liao, Ta-Chun Hung, Chien-Chung Huang, Chia-Tien Hsu, Shang-Feng Tsai
  • Publication number: 20240098016
    Abstract: A method for performing adaptive multi-link aggregation dispatching control in multi-link operation architecture and associated apparatus are provided.
    Type: Application
    Filed: June 19, 2023
    Publication date: March 21, 2024
    Applicant: MEDIATEK INC.
    Inventors: Kuo-Wei Chen, Chia-Shun Wan, Cheng-En Hsieh, Po-Chi Chen
  • Publication number: 20240088195
    Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yu WEI, Yen-Liang LIN, Kuo-Cheng LEE, Hsun-Ying HUANG, Hsin-Chi CHEN
  • Publication number: 20240086633
    Abstract: A method for generating and outputting a message is implemented using an electronic device the stores a computer program product and a text database. The text database includes a main message template, a template text that includes a placeholder, and a word group that includes a plurality of preset words for replacing the placeholder. The method includes: in response to receipt of a command for execution of the computer program product, displaying an editing interface including the main message template; in response to receipt of user operation of a selection of the main message template, displaying the template text; in response to receipt of user operation of a selection of one of the preset words via the user interface, generating an edited text by replacing the placeholder with the one of the preset words in the template text; and outputting the edited text as a message.
    Type: Application
    Filed: April 25, 2023
    Publication date: March 14, 2024
    Inventors: Yi-Ru CHIU, Ting-Yi LI, Hong-Xun WANG, Jin-Lin CHEN, Chih-Hsuan YEH, Chia-Chi YIN, Wei-Ting LI, Po-Lun CHANG
  • Patent number: 11925454
    Abstract: A respiratory function testing system includes an air transforming device, a sound reception device and an operation device. The air transforming device is configured to collect exhaled and/or inhaled air for a predetermined period and generate a wide frequency range sound signal according to the collected respired air. The wide frequency range sound signal at least contains an ultrasonic signal. The sound reception device is configured to receive and record the wide frequency range sound signal as an audio file. The operation device is in communication with the sound reception device and is configured to receive and compute the audio file to generate a respiratory function parameter. Besides, the recorded wide frequency range sound signal may be converted into a spectrogram for further applications, and the computation of the audio file can be replaced by analyzing the spectrogram. A respiratory function testing method corresponding to the respiratory function testing system is also provided.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: March 12, 2024
    Inventors: Chia-Chi Su, Hsiao-Pao Yen, Pei-Ling Hsu, Chia-Hung Chen
  • Publication number: 20240077593
    Abstract: An optical radar includes an optical-signal receiving unit and an optical-signal pickup unit. The optical-signal receiving unit is configured to receive a reflected light. The optical-signal pickup unit is coupled to the optical-signal receiving unit and includes a first optical-signal filtering circuit and a second optical-signal filtering unit. The first optical-signal filtering circuit is configured to filter out a first interference pulse of the reflected light, wherein the first interference pulse has a first interference voltage value higher than a reference voltage. The second optical-signal filtering circuit is coupled to the first optical-signal filtering circuit and configured to generate a clock signal comprising a clock pulse; and filter out a second interference pulse that does not match the clock pulse in time point from the reflected light.
    Type: Application
    Filed: November 30, 2022
    Publication date: March 7, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chih-Chun CHEN, Yi-Chi LEE, Chia-Yu HU, Ji-Bin HORNG
  • Patent number: 11925017
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
  • Publication number: 20240069594
    Abstract: A portable electronic device including a first body, a second body, a stand, and a hinge structure is provided. The stand has a first pivot part and a second pivot part opposite to the first pivot part, wherein the first pivot part is pivotally connected to the first body, and the second body is pivotally connected to the second pivot part. The hinge structure includes a first bracket secured to the second body, a second bracket secured to the second pivot part of the stand, a first movable base, a first shaft secured to the first bracket and pivoted to the first movable base, a second movable base, a second shaft secured to the first movable base and pivoted to the second movable base, and a sliding shaft fixed to the second movable base and slidably connected to the second bracket.
    Type: Application
    Filed: November 3, 2023
    Publication date: February 29, 2024
    Applicant: Acer Incorporated
    Inventors: Chia-Bo Chen, Yi-Hsuan Yang, Hung-Chi Chen, Wu-Chen Lee
  • Patent number: 11915977
    Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Ting Tsai, Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Feng-Chi Hung, Chih-Hui Huang, Sheng-Chau Chen, Shih Pei Chou, Chia-Chieh Lin
  • Patent number: 11916077
    Abstract: The present disclosure describes an apparatus with a local interconnect structure. The apparatus can include a first transistor, a second transistor, a first interconnect structure, a second interconnect structure, and a third interconnect structure. The local interconnect structure can be coupled to gate terminals of the first and second transistors and routed at a same interconnect level as reference metal lines coupled to ground and a power supply voltage. The first interconnect structure can be coupled to a source/drain terminal of the first transistor and routed above the local interconnect structure. The second interconnect structure can be coupled to a source/drain terminal of the second transistor and routed above the local interconnect structure. The third interconnect structure can be routed above the local interconnect structure and at a same interconnect level as the first and second interconnect structures.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young, Hui-Ting Yang, Jiann-Tyng Tzeng, Ru-Gun Liu, Wei-Cheng Lin, Lei-Chun Chou, Wei-An Lai
  • Patent number: 11555792
    Abstract: Embodiments are disclosed for terahertz spectroscopy and imaging in dynamic environments. In an embodiment, a method comprises using a sensor of an electronic device to determine an orientation of the electronic device. A transmitter of the electronic device emits an electromagnetic (EM) wave in a terahertz (THz) frequency band into a dynamic environment according to a power duty cycle that is determined at least in part by the orientation. A receiver of the electronic device receives a reflected EM wave from the environment. A spectral response of the reflected EM wave is determined that includes absorption spectra that is indicative of the transmission medium in the environment. The absorption spectra are compared with known absorption spectra of target transmission mediums. Based on the comparing, a particular target transmission medium is identified as being the transmission medium in the environment, and a concentration level of the identified target transmission medium in the environment is determined.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: January 17, 2023
    Assignee: Apple Inc.
    Inventors: Vijendrakumar K. Ashiwal, Sireesha Ramisetti, Chia-Chi Chen, Vusthla Sunil Reddy, Peter M. Agboh
  • Patent number: 11513004
    Abstract: Embodiments are disclosed for terahertz spectroscopy and imaging in dynamic environments. In an embodiment, a transmitter of an electronic device emits a continuous electromagnetic (EM) wave in the terahertz (THz) frequency band into a dynamic environment that includes a transmission medium that changes over time. A receiver of the electronic device, receives an EM wave reflected off an object in the environment and determines a spectral response of the reflected EM wave. The spectral response includes absorption spectra at a frequency in the THz frequency band that is indicative of a known target transmission medium. The absorption spectra of the target transmission medium and a path length of the reflected EM wave signal are used to obtain the concentration level of the target transmission medium from a reference library of known concentration levels.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: November 29, 2022
    Assignee: Apple Inc.
    Inventors: Chia-Chi Chen, Vusthla Sunil Reddy, Sireesha Ramisetti, Peter M. Agboh, Mohit Narang, Vijendrakumar K. Ashiwal
  • Patent number: 11099072
    Abstract: Embodiments are disclosed for terahertz spectroscopy and imaging in dynamic environments. In an embodiment, a method comprises emitting a continuous electromagnetic (EM) wave in a terahertz (THz) frequency band into a dynamic environment. The EM THz wave is reflected off an object in the environment. A spectral response of a received signal indicative of the reflected EM wave is determined that includes absorption spectra at a frequency in the THz frequency band. The absorption spectra is indicative of a transmission medium in the environment. The spectral response of the received signal is compensated for fixed and frequency-specific losses. The compensated absorption spectra is compared with known absorption spectra of target transmission mediums. Based on results of the comparing, a particular target transmission medium is identified as being the transmission medium in the environment. The absorption spectra loss is used to determine a concentration level of the target transmission medium.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: August 24, 2021
    Assignee: Apple Inc.
    Inventors: Sireesha Ramisetti, Chia-Chi Chen, Vijendrakumar K. Ashiwal, Peter M. Agboh, Vusthla Sunil Reddy
  • Publication number: 20210041292
    Abstract: Embodiments are disclosed for terahertz spectroscopy and imaging in dynamic environments. In an embodiment, a transmitter of an electronic device emits a continuous electromagnetic (EM) wave in the terahertz (THz) frequency band into a dynamic environment that includes a transmission medium that changes over time. A receiver of the electronic device, receives an EM wave reflected off an object in the environment and determines a spectral response of the reflected EM wave. The spectral response includes absorption spectra at a frequency in the THz frequency band that is indicative of a known target transmission medium. The absorption spectra of the target transmission medium and a path length of the reflected EM wave signal are used to obtain the concentration level of the target transmission medium from a reference library of known concentration levels.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 11, 2021
    Inventors: Chia-Chi Chen, Vusthla Sunil Reddy, Sireesha Ramisetti, Peter M. Agboh, Mohit Narang, Vijendrakumar K. Ashiwal
  • Publication number: 20210041295
    Abstract: Embodiments of a terahertz (THz) sensor module are disclosed for spectroscopy and imaging in a dynamic environment. In an embodiment, a terahertz (THz) sensor module comprises: a THz emitter configured to emit a THz beam into an environment; one or more movable micro-electromechanical system (MEMS) micromirrors; and one or more MEMS motors or actuators coupled to the one or more MEMS micromirrors. The one or more MEMS motors or actuators are configured to move the one or more MEMS micromirrors to change a direction of the THz beam in the environment. A THz receiver is configured to receive a reflection of the THz beam from a reflective object in the environment.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 11, 2021
    Inventors: Sireesha Ramisetti, Chia-Chi Chen, Vusthla Sunil Reddy, Peter M. Agboh, Vijendrakumar K. Ashiwal
  • Patent number: D1019023
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: March 19, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Edward James Paterson, Chia-Wei Chan, Mei Hsuan Chen, Benjamin Wild, Matthew J. England, Wen-Yo Lu, James Siminoff, Mark Siminoff, Yen-Chi Tsai