Patents by Inventor Chia-Chi Lo
Chia-Chi Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11239125Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.Type: GrantFiled: December 26, 2018Date of Patent: February 1, 2022Assignee: Siliconware Precision Industries Co., Ltd.Inventors: Hsien-Lung Hsiao, Yu-Cheng Pai, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang
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Publication number: 20200035573Abstract: A carrier structure includes: a plurality of substrates; a separation portion provided between the substrates; and a periphery portion provided at the periphery of the substrates and formed with at least one opening. With the configuration of the opening, the area of an insulating layer of the carrier structure can be reduced. Therefore, the overall space of electrostatic buildup in the carrier structure can also be reduced.Type: ApplicationFiled: December 26, 2018Publication date: January 30, 2020Inventors: Hsien-Lung Hsiao, Yu-Cheng Pai, Chia-Chi Lo, Szu-Hsien Chen, Shu-Chi Chang
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Patent number: 8837808Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.Type: GrantFiled: December 20, 2012Date of Patent: September 16, 2014Assignee: Kinsus Interconnect Technology Corp.Inventors: Chia-Chi Lo, Cheng-Hsiung Yang, Jun-Chung Hsu
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Publication number: 20140177939Abstract: Disclosed is a method of final defect inspection, including preparing a final defect inspection apparatus which includes a host device, a microscope, a bar code scanner, a support tool and a signal transceiver, using the host device to calibrate an original point in an outline of the circuit board based on a plurality of original mark positions generated by an electromagnetic pen, using the electromagnetic pen to mark each defect position on the inspection region on the circuit board where any defect is found through the microscope, using the signal transceiver to receive and transmit each defect position to the host device, and using the host device to calculate the coordinate of a scrap region based on a relative position between the original point and each defect position so as to generate a shipment file.Type: ApplicationFiled: December 20, 2012Publication date: June 26, 2014Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.Inventors: Chia-Chi Lo, Cheng-Hsiung Yang, Jun-Chung Hsu
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Patent number: 8547548Abstract: Disclosed is a final defect inspection system, which including a host device, a microscope, a bar code scanner, a support tool, a signal transceiver and an electromagnetic pen. The bar code scanner scans a bar code on a circuit board provided on the support plate. The host device selects data and a circuit layout diagram from the database corresponding to the bar code. The signal transceiver and the electromagnetic pen are electrically connected to the host device. The electromagnetic pen is used to make a mark on a scrap region of the circuit board where any defect is visually found through the microscope. The signal transceiver receives and transmits the positions of the mark to the host device such that the host device calculates the coordinate of a scrap region based on a relative position between an original point and the positions of the mark.Type: GrantFiled: December 20, 2012Date of Patent: October 1, 2013Assignee: Kinsus Interconnect Technology Corp.Inventors: Chia-Chi Lo, Cheng-Hsiung Yang Yang, Jun-Chung Hsu
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Patent number: 8186054Abstract: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.Type: GrantFiled: March 17, 2010Date of Patent: May 29, 2012Assignee: Kinsus Interconnect Technology Corp.Inventors: Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu, Chia-Chi Lo
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Patent number: 7875809Abstract: A circuit board includes a core layer substrate having a plated through hole filled with a dielectric material. The plated through hole has a sidewall coated with an inner electroless copper layer, and an electroplated metal layer plated on the inner electroless copper layer before the plated through hole is filled with the dielectric material. The outer portion of the filled plated through hole is thicker than the center portion and tapered toward the center portion to form a depressed surface on the filled plated through hole. The core layer substrate is covered with a patterned electroless copper layer and a patterned electroplated copper layer that connect with the inner electroless copper layer and electroplated metal layer of the plated through hole. The patterned electroplated copper layer forms a flat copper pad above the plated through hole.Type: GrantFiled: June 21, 2007Date of Patent: January 25, 2011Assignee: Kinsus Interconnect Technology Corp.Inventors: Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu, Chia-Chi Lo
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Publication number: 20100170088Abstract: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.Type: ApplicationFiled: March 17, 2010Publication date: July 8, 2010Inventors: Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu, Chia-Chi Lo
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Publication number: 20080314622Abstract: Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product.Type: ApplicationFiled: June 21, 2007Publication date: December 25, 2008Inventors: Chien-Wei Chang, Ting-Hao Lin, Jen-Fang Chang, Yu-Te Lu, Chia-Chi Lo