Patents by Inventor Chia-Chi Tuan

Chia-Chi Tuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170342273
    Abstract: An exemplary embodiment of the present invention provides a filler comprising a silica core, a first layer in communication with the core, and a second layer in communication with the first layer. The presence of the second layer can decrease the coefficient of thermal expansion, decrease the composite modulus, and increase the glass transition temperature of the modulus as compared to fillers without a second layer.
    Type: Application
    Filed: May 30, 2017
    Publication date: November 30, 2017
    Inventors: Chia-Chi Tuan, Kyoung-Sik Moon, Ching Ping Wong