Patents by Inventor Chia Chieh Tunmu

Chia Chieh Tunmu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for enhancing stability, robustness and throughput of semiconductor device test machines in low temperature conditions
    Patent number: 10393794
    Abstract: An apparatus includes a platform and a test board mounted on the platform. The platform generally comprises (i) a transducer array configured to generate ultrasonic vibrations and (ii) a controller configured to control the transducer array in response to measurements of moisture content of air around the platform. The test board may be configured to apply test signals to and receive test responses from a semiconductor device under test. The platform may be configured to utilize the ultrasonic vibrations to inhibit frost formation between the semiconductor device under test and a test header providing a low temperature test condition.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: August 27, 2019
    Assignee: Ambarella, Inc.
    Inventors: Chia Chieh Tunmu, Kun-Jung Kuo
  • Method for enhancing stability, robustness and throughput of semiconductor device test machines in low temperature conditions
    Patent number: 10126352
    Abstract: An apparatus includes a platform, a test board mounted on the platform, and a test socket attached to the test board. The test socket may be configured to apply test signals to and receive test responses from a semiconductor device under test. The platform may be configured to utilize ultrasonic vibrations to inhibit frost formation between the semiconductor device under test and a test header providing a low temperature test condition.
    Type: Grant
    Filed: July 6, 2016
    Date of Patent: November 13, 2018
    Assignee: Ambarella, Inc.
    Inventors: Chia Chieh Tunmu, Kun-Jung Kuo